CN103930969B - 半导体制造用薄膜涂布装置 - Google Patents
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Abstract
本发明涉及一种半导体制造用薄膜涂布装置,作为薄膜涂布装置,其特征在于包括:主滚筒(10),其与薄膜的另一面进行面接触;涂布用滚筒(20),其与所述主滚筒(10)平行地邻接配备,与薄膜的一面进行面接触;涂布液供应滚筒(30),其在所述主滚筒(10)的相反一侧,与所述涂布用滚筒(20)平行地邻接并隔开地配备,在下部浸于涂布液存储容器(39)中的状态下,在表面沾染涂布液后,涂布于所述涂布用滚筒(20)的表面;薄膜引导部(40),其将薄膜引导至所述主滚筒(10)与滚筒(20)之间的空隙;硬化装置部(50),其利用高温使在通过所述主滚筒(10)与涂布用滚筒(20)之间的同时而涂布了涂布液的薄膜硬化;传输机(60),其进行移送,使薄膜通过硬化装置部(40)。
Description
技术领域
本发明涉及紫外线曝光用掩膜或基板(Board)的紫外线曝光用原图(artwork)薄膜的涂布装置。
主要用于在涂布有紫外线感光膜的柔性基板(Board)的紫外线曝光步骤中使用的掩膜或原图薄膜的UV涂布用途。
背景技术
最近,随着电子产品的轻量化、超薄化及短小化和高功能化,印刷电路板进一步高精密化、高密度化,因此,在涂布光刻胶等感光材料的基板表面,借助于曝光装置对既定的图案进行感光、成像后,借助于刻蚀工序而在基板上形成图案的光刻法,正在应用于印刷电路板制造。
在利用一般使用的使光掩膜与印刷电路板贴合并进行曝光的贴合方式,制造高精密度、高密度的印刷电路板时,由于光掩膜与电路基板的贴合,每当曝光时发生光掩膜的损伤,存在无法在电路基板上精密地形成电路或阻焊膜等图案的问题。
发明内容
根据本发明,针对不损伤曝光用掩膜地涂布涂布液,提供一种半导体制造用薄膜涂布装置,通过在薄膜前面涂布均匀量的保护涂布液,使保护涂布层的厚度均一,能够实现更精密的半导体制造。
本发明涉及一种半导体制造用薄膜涂布装置,作为薄膜涂布装置,其特征在于包括:主滚筒(10),其与薄膜的另一面进行面接触;
涂布用滚筒(20),其借助于旋转装置而旋转,与所述主滚筒(10)平行地邻接配备,与薄膜的一面进行面接触;
涂布液供应滚筒(30),其在所述主滚筒(10)的相反一侧,与所述涂布用滚筒(20)平行地邻接并隔开地配备,在下部浸于涂布液存储容器(39)中的状态下,在表面沾染涂布液后,涂布于所述涂布用滚筒(20)的表面;
薄膜引导部(40),其将薄膜引导至所述主滚筒(10)与滚筒(20)之间的空隙;
硬化装置部(50),其对在通过所述主滚筒(10)与涂布用滚筒(20)之间的同时而涂布了涂布液的薄膜进行加热、硬化;
传输机(60),其进行移送,使薄膜通过硬化装置部(50)。
本发明针对不损伤曝光用掩膜地涂布涂布液,旨在提供一种半导体制造用薄膜涂布装置,通过在薄膜前面涂布均匀量的保护涂布液,使保护涂布层的厚度均一,能够实现更精密的半导体制造。
附图说明
图1是本发明一个实施例的半导体制造用薄膜涂布装置侧面结构图。
图2是本发明一个实施例的半导体制造用薄膜涂布装置侧面主要部分放大图。
图3是本发明一个实施例的半导体制造用薄膜涂布装置俯视图。
图4是本发明一个实施例的半导体制造用薄膜涂布装置主视图。
图5是本发明一个实施例的半导体制造用薄膜涂布装置中的涂布用滚筒主视图。
最佳实施方式
下面参照附图,对本发明一个实施例的半导体制造用薄膜涂布装置进行详细说明。图1是本发明一个实施例的半导体制造用薄膜涂布装置侧面结构图,图2(a,b)是本发明一个实施例的半导体制造用薄膜涂布装置侧面主要部分放大图,图3是本发明一个实施例的半导体制造用薄膜涂布装置俯视图,图4是本发明一个实施例的半导体制造用薄膜涂布装置主视图,图5是本发明一个实施例的半导体制造用薄膜涂布装置中的涂布用滚筒主视图。
本发明可以用于在涂布有紫外线感光膜的柔性基板(Board)的紫外线曝光步骤中使用的掩膜或原图薄膜的UV涂布用途。
如图1至图4所示,本发明一个实施例的半导体制造用薄膜涂布装置由主滚筒(10)、涂布用滚筒(20)、涂布液供应滚筒(30)、薄膜引导部(40)、硬化装置部(50)和传输机(60)构成。
如图所示,主滚筒(10)与薄膜的另一面实现面接触。涂布用滚筒(20)平行地接近主滚筒(10)配备,与薄膜的一面实现面接触。主滚筒(10)和涂布用滚筒(20)借助轴承而支撑于主体部。还具备使主滚筒(10)旋转的旋转装置。旋转装置由固定于主体部的驱动齿轮、固定于主滚筒轴(11)的从动齿轮、连接所述驱动齿轮与固定于主滚筒轴(11)的从动齿轮的皮带(或链)构成。
如图所示,涂布液供应滚筒(30)在所述主滚筒(10)的相反一侧,与所述涂布用滚筒(20)平行地邻接并隔开地配备,在下部浸于涂布液存储容器(39)中的状态下,在表面沾染涂布液后,涂布于所述涂布用滚筒(20)的表面。如图2所示,涂布液存储容器(39)的上部开放,以便能够补充涂布液,涂布液供应滚筒(30)的下部位于开放的上部。
涂布用滚筒(20)与涂布液供应滚筒(30)可以保持30~300μm间隔。当间隔过小时,会要求高精密度的位置控制,一旦失败,将会造成装备的损伤。当间隔超过300μm时,由于间隔过宽,在表面张力作用下,在涂布液供应滚筒(30)上含浸的涂布液向涂布用滚筒(20)传递方面会发生问题。
如图2(a、b)所示,薄膜引导部(40)把薄膜引导至主滚筒(10)与滚筒(20)之间的空隙。优选地,薄膜引导部(40)在下部具备以扁平板状形成且向前方向上弯曲的曲面支撑部(40a),上端(40b)延长至主滚筒(10)与涂布用滚筒(20)之间的空隙下部。
硬化装置部(50)具备加热装置(51),所述加热装置(51)位于通过的薄膜的上部,利用高温的热,使在通过主滚筒(10)与涂布用滚筒(20)之间的同时涂布了涂布液的薄膜加热、硬化。加热装置(51)可以使用通常的紫外线、红外线灯。传输机(60)进行移送,使薄膜通过硬化装置部(50)。传输机(60)可以应用本行业公知的通常的移送系统,由于是公知的事项,因而省略详细说明。
如图5所示,在本发明一个实施例的半导体制造用薄膜涂布装置中,在涂布液供应滚筒(30)的表面,可以以螺旋状均匀地形成有涂布液含浸槽(35)。此时,能够使得在涂布液供应滚筒(30)的外部表面,沿涂布液供应滚筒(30)的长度方向均匀地含浸涂布液,另外,通过试制品测试结果可知,涂布液均匀地传递到涂布用滚筒(20)。涂布液含浸槽(35)可以是利用金属针形成的螺旋形的划痕(scratch).
如图2所示,本发明一个实施例的半导体制造用薄膜涂布装置,优选还包括调节涂布用滚筒(20)或所述涂布液供应滚筒(30)中的一者的上下高度的竖直方向调节装置(70)。竖直方向调节装置(70)可以包括伺服电动机(71)和第1调节轴(72),其中,所述第1调节轴(72)借助于所述伺服电动机(71)而升降,上端连接得使涂布用滚筒轴(21)或涂布液供应滚筒轴(31)中的一者升降。在图2中,第1调节轴(72)使涂布液供应滚筒(30)升降,调节涂布用滚筒(20)与涂布液供应滚筒(30)之间间隙(GAP)的大小。
如图2所示,本发明一个实施例的半导体制造用薄膜涂布装置还包括水平方向调节装置(80),所述水平方向调节装置(80)通过使主滚筒(10)前进后退,从而调节所述主滚筒(10)与涂布用滚筒(20)的间隔。水平方向调节装置(70)可以包括水平方向驱动部(81)和第2调节轴(82),其中,所述第2调节轴(82)借助于所述水平方向驱动部(81)而升降,前端使主滚筒轴(11)前进后退。
在操作者把薄膜放到薄膜引导部(40)的状态下,如果把薄膜向上推入,那么,借助于旋转的主滚筒(10),薄膜通过主滚筒(10)与涂布用滚筒(20)之间,移送到硬化装置部(50),此时,传输机(60)对薄膜的移动进行辅助。
本发明就上述提及的优选实施例进行了说明,但本发明的范围并非限定于这种实施例,本发明的范围根据以下权利要求书确定,包括属于与本发明均等范围的多种修改及变形。
需要指出的是,以下权利要求书中记载的附图符号单纯用于辅助对发明的理解,不对权利范围的理解造成影响,不得根据记载的附图符号而缩小解释权利范围。
具体实施方式
本发明涉及一种半导体制造用薄膜涂布装置,作为薄膜涂布装置,其特征在于包括:主滚筒(10),其与薄膜的另一面进行面接触;
涂布用滚筒(20),其借助于旋转装置而旋转,与所述主滚筒(10)平行地邻接配备,与薄膜的一面进行面接触;
涂布液供应滚筒(30),其在所述主滚筒(10)的相反一侧,与所述涂布用滚筒(20)平行地邻接并隔开地配备,在下部浸于涂布液存储容器(39)中的状态下,在表面沾染涂布液后,涂布于所述涂布用滚筒(20)的表面;
薄膜引导部(40),其将薄膜引导至所述主滚筒(10)与滚筒(20)之间的空隙;
硬化装置部(50),其对在通过所述主滚筒(10)与涂布用滚筒(20)之间的同时而涂布了涂布液的薄膜进行加热、硬化;
传输机(60),其进行移送,使薄膜通过硬化装置部(50)。
工业利用可能性
本发明旨在针对不损伤曝光用掩膜地涂布涂布液,提供一种半导体制造用薄膜涂布装置,通过在薄膜前面涂布均匀量的保护涂布液,从而使保护涂布层的厚度均匀,能够实现更精密的半导体制造。
Claims (3)
1.一种半导体制造用薄膜涂布装置,作为薄膜涂布装置,其特征在于包括:
主滚筒(10),其借助于旋转装置而旋转,与薄膜的另一面进行面接触;
涂布用滚筒(20),其与所述主滚筒(10)平行地邻接配备,与薄膜的一面进行面接触;
涂布液供应滚筒(30),其在所述主滚筒(10)的相反一侧,与所述涂布用滚筒(20)平行地邻接并隔开地配备,在下部浸于涂布液存储容器(39)中的状态下,在表面沾染涂布液后,涂布于所述涂布用滚筒(20)的表面;在所述涂布液供应滚筒(30)的表面以螺旋形状均匀地形成有涂布液含浸槽(35);
薄膜引导部(40),其将薄膜引导至所述主滚筒(10)与滚筒(20)之间的空隙;
硬化装置部(50),其对在通过所述主滚筒(10)与涂布用滚筒(20)之间的同时而涂布了涂布液的薄膜进行加热、硬化;
传输机(60),其进行移送,使薄膜通过硬化装置部(50);
所述涂布用滚筒(20)与涂布液供应滚筒(30)保持30~300μm间隔。
2.根据权利要求1所述的半导体制造用薄膜涂布装置,其特征在于:
还包括竖直方向调节装置(70),其调节所述涂布用滚筒(20)或所述涂布液供应滚筒(30)中一者的上下高度;
所述竖直方向调节装置(70)包括伺服电动机(71)、第1调节轴(72),其中,所述第1调节轴(72)借助于所述伺服电动机(71)而升降,上端使涂布用滚筒轴(21)或涂布液供应滚筒轴(31)中的一者升降。
3.根据权利要求1所述的半导体制造用薄膜涂布装置,其特征在于:
还包括水平方向调节装置(80),其通过使所述主滚筒(10)前进后退,调节所述主滚筒(10)与涂布用滚筒(20)的间隔;
所述水平方向调节装置(70)包括水平方向驱动部(81)、第2调节轴(82),其中,所述第2调节轴(82)借助于所述水平方向驱动部(81)而升降,前端使主滚筒轴(11)前进后退。
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KR1020100096199A KR101028038B1 (ko) | 2010-10-04 | 2010-10-04 | 반도체 제조용 필름 코팅장치 |
PCT/KR2011/004771 WO2012046944A1 (ko) | 2010-10-04 | 2011-06-29 | 반도체 제조용 필름 코팅장치 |
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