CN103855180B - 发光器件 - Google Patents

发光器件 Download PDF

Info

Publication number
CN103855180B
CN103855180B CN201310651693.6A CN201310651693A CN103855180B CN 103855180 B CN103855180 B CN 103855180B CN 201310651693 A CN201310651693 A CN 201310651693A CN 103855180 B CN103855180 B CN 103855180B
Authority
CN
China
Prior art keywords
layer
luminescence unit
light emitting
semiconductor layer
top electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310651693.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN103855180A (zh
Inventor
崔炳然
金明洙
范熙荣
李容京
朱炫承
洪奇锡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Liyu Semiconductor Co ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of CN103855180A publication Critical patent/CN103855180A/zh
Application granted granted Critical
Publication of CN103855180B publication Critical patent/CN103855180B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
    • H10H20/8162—Current-blocking structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/833—Transparent materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8314—Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies

Landscapes

  • Led Devices (AREA)
CN201310651693.6A 2012-12-06 2013-12-05 发光器件 Active CN103855180B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120141503A KR20140073351A (ko) 2012-12-06 2012-12-06 발광 소자
KR10-2012-0141503 2012-12-06

Publications (2)

Publication Number Publication Date
CN103855180A CN103855180A (zh) 2014-06-11
CN103855180B true CN103855180B (zh) 2019-11-05

Family

ID=49683623

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310651693.6A Active CN103855180B (zh) 2012-12-06 2013-12-05 发光器件

Country Status (5)

Country Link
US (2) US9337236B2 (enExample)
EP (1) EP2741338B1 (enExample)
JP (1) JP2014116604A (enExample)
KR (1) KR20140073351A (enExample)
CN (1) CN103855180B (enExample)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103840054A (zh) * 2012-11-20 2014-06-04 展晶科技(深圳)有限公司 发光二极管芯片
KR20140073351A (ko) * 2012-12-06 2014-06-16 엘지이노텍 주식회사 발광 소자
US9356212B2 (en) 2012-12-21 2016-05-31 Seoul Viosys Co., Ltd. Light emitting diode and method of fabricating the same
CN104885236B (zh) * 2012-12-21 2017-12-19 首尔伟傲世有限公司 发光二极管
CN106910758B (zh) * 2013-01-09 2020-05-15 新世纪光电股份有限公司 发光装置
KR20150101783A (ko) * 2014-02-27 2015-09-04 서울바이오시스 주식회사 발광 다이오드 및 그 제조 방법
TWI614920B (zh) 2014-05-19 2018-02-11 晶元光電股份有限公司 光電元件及其製造方法
KR102197082B1 (ko) * 2014-06-16 2020-12-31 엘지이노텍 주식회사 발광 소자 및 이를 포함하는 발광소자 패키지
FR3023061B1 (fr) * 2014-06-27 2017-12-15 Commissariat Energie Atomique Diode de structure mesa a surface de contact sensiblement plane
JP6529223B2 (ja) * 2014-06-30 2019-06-12 晶元光電股▲ふん▼有限公司Ｅｐｉｓｔａｒ Ｃｏｒｐｏｒａｔｉｏｎ 光電部品
KR102052040B1 (ko) * 2014-06-30 2019-12-04 에피스타 코포레이션 광전소자와 그 제조방법
CN104218133B (zh) * 2014-08-26 2017-04-26 华灿光电股份有限公司 一种发光二极管芯片及其制造方法
CN104362236B (zh) * 2014-11-11 2017-03-08 杭州士兰明芯科技有限公司 一种led结构及其制作方法
TWI620349B (zh) * 2015-01-05 2018-04-01 隆達電子股份有限公司 覆晶式發光二極體晶片
CN110061027B (zh) * 2015-02-13 2024-01-19 首尔伟傲世有限公司 发光元件
TWI699902B (zh) * 2015-04-22 2020-07-21 新世紀光電股份有限公司 發光元件及其製造方法
WO2016177333A1 (zh) * 2015-05-05 2016-11-10 湘能华磊光电股份有限公司 Iii族半导体发光器件倒装结构的制作方法
JP2017059752A (ja) * 2015-09-18 2017-03-23 豊田合成株式会社 発光装置とその製造方法
US9705035B1 (en) * 2015-12-30 2017-07-11 Epistar Corporation Light emitting device
DE102017205639B4 (de) * 2016-04-18 2025-02-13 Seoul Viosys Co., Ltd Lumineszenzdiode mit hoher Effizienz
KR102641965B1 (ko) * 2016-11-10 2024-02-29 서울바이오시스 주식회사 고효율 발광 다이오드
CN105762246B (zh) * 2016-04-25 2017-11-28 厦门乾照光电股份有限公司 一种垂直结构发光二极管及其制作方法
KR102510006B1 (ko) * 2016-05-24 2023-03-14 엘지이노텍 주식회사 반도체 소자
KR102699567B1 (ko) * 2016-07-11 2024-08-29 삼성디스플레이 주식회사 초소형 발광 소자를 포함하는 픽셀 구조체, 표시장치 및 그 제조방법
CN106711306A (zh) * 2016-12-20 2017-05-24 合肥彩虹蓝光科技有限公司 一种高压led芯片制备方法
CN108886050A (zh) * 2017-01-24 2018-11-23 歌尔股份有限公司 微led装置、显示设备及微led制造方法
US10043941B1 (en) 2017-01-31 2018-08-07 International Business Machines Corporation Light emitting diode having improved quantum efficiency at low injection current
FR3062953A1 (fr) * 2017-02-15 2018-08-17 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif comportant une pluralite de diodes
DE102017104135A1 (de) 2017-02-28 2018-08-30 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
KR20180106720A (ko) * 2017-03-21 2018-10-01 서울바이오시스 주식회사 분포 브래그 반사기 적층체를 구비하는 발광 다이오드
CN106941108B (zh) * 2017-05-23 2019-09-17 深圳市华星光电技术有限公司 微发光二极管显示面板及其制作方法
CN108110107A (zh) * 2017-12-18 2018-06-01 湘能华磊光电股份有限公司 一种led芯片的制作方法
KR20190094283A (ko) 2018-02-03 2019-08-13 김승훈 기억 상기 다기능 테이블
JP6822429B2 (ja) * 2018-02-19 2021-01-27 日亜化学工業株式会社 発光素子
JP2019149480A (ja) * 2018-02-27 2019-09-05 豊田合成株式会社 半導体素子、発光装置、および発光装置の製造方法
CN108447955B (zh) * 2018-03-16 2019-07-23 厦门市三安光电科技有限公司 发光二极管芯片结构及其制作方法
CN208385406U (zh) * 2018-05-25 2019-01-15 深圳市瑞丰光电子股份有限公司 一种led模组
US11282984B2 (en) * 2018-10-05 2022-03-22 Seoul Viosys Co., Ltd. Light emitting device
CN109891610A (zh) 2018-10-11 2019-06-14 厦门市三安光电科技有限公司 一种发光二极管元件及其制作方法
US11515456B2 (en) 2019-02-21 2022-11-29 Innolux Corporation LED with light adjusting layer extending past the LED
KR102649029B1 (ko) * 2019-04-10 2024-03-20 삼성전자주식회사 Led 소자, led 소자의 제조 방법 및 led 소자를 포함하는 디스플레이 장치
JP6843916B2 (ja) * 2019-05-14 2021-03-17 晶元光電股▲ふん▼有限公司Ｅｐｉｓｔａｒ Ｃｏｒｐｏｒａｔｉｏｎ 光電部品
TWI830759B (zh) 2019-07-31 2024-02-01 晶元光電股份有限公司 發光二極體元件及其製造方法
CN110767670B (zh) * 2019-10-31 2022-11-15 成都辰显光电有限公司 显示面板、显示装置和显示面板的制作方法
FR3103634B1 (fr) * 2019-11-21 2021-12-03 Commissariat Energie Atomique Procede de formation d’une electrode commune d’une pluralite de dispositifs optoelectroniques
CN113036014B (zh) * 2019-12-25 2022-07-05 深圳第三代半导体研究院 一种垂直集成单元发光二极管
US11901491B2 (en) * 2020-10-29 2024-02-13 Lumileds Llc Light emitting diode devices
JP7223046B2 (ja) * 2021-02-24 2023-02-15 晶元光電股▲ふん▼有限公司 光電部品
US12199210B2 (en) * 2021-10-18 2025-01-14 Hamamatsu Photonics K.K. Optical semiconductor element
WO2024053994A1 (ko) * 2022-09-06 2024-03-14 서울반도체 주식회사 발광장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1819255A (zh) * 2005-02-03 2006-08-16 范朝阳 基于微型发光二极管的高压交直流指示灯
CN102132429A (zh) * 2008-09-11 2011-07-20 普瑞光电股份有限公司 串联分段式发光二极管

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3497741B2 (ja) * 1998-09-25 2004-02-16 株式会社東芝 半導体発光装置及び半導体発光装置の駆動方法
DE60043536D1 (de) * 1999-03-04 2010-01-28 Nichia Corp Nitridhalbleiterlaserelement
JP2002026384A (ja) * 2000-07-05 2002-01-25 Nichia Chem Ind Ltd 集積型窒化物半導体発光素子
US6630689B2 (en) 2001-05-09 2003-10-07 Lumileds Lighting, U.S. Llc Semiconductor LED flip-chip with high reflectivity dielectric coating on the mesa
KR100640496B1 (ko) 2005-11-23 2006-11-01 삼성전기주식회사 수직구조 질화갈륨계 발광다이오드 소자
KR101113878B1 (ko) * 2006-06-23 2012-03-09 엘지이노텍 주식회사 수직형 발광 소자 및 그 제조방법
JP2009071220A (ja) * 2007-09-18 2009-04-02 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体発光素子
KR101371511B1 (ko) * 2007-10-04 2014-03-11 엘지이노텍 주식회사 수직형 발광 소자
US8536584B2 (en) 2007-11-14 2013-09-17 Cree, Inc. High voltage wire bond free LEDS
JP2009302314A (ja) * 2008-06-13 2009-12-24 Rohm Co Ltd ＧａＮ系半導体装置
JP5217787B2 (ja) * 2008-08-27 2013-06-19 日亜化学工業株式会社 半導体発光素子
JP5123269B2 (ja) * 2008-09-30 2013-01-23 ソウル オプト デバイス カンパニー リミテッド 発光素子及びその製造方法
KR20100076083A (ko) 2008-12-17 2010-07-06 서울반도체 주식회사 복수개의 발광셀들을 갖는 발광 다이오드 및 그것을 제조하는 방법
KR101533817B1 (ko) 2008-12-31 2015-07-09 서울바이오시스 주식회사 복수개의 비극성 발광셀들을 갖는 발광 소자 및 그것을 제조하는 방법
US7982409B2 (en) * 2009-02-26 2011-07-19 Bridgelux, Inc. Light sources utilizing segmented LEDs to compensate for manufacturing variations in the light output of individual segmented LEDs
CN102201426B (zh) * 2010-03-23 2016-05-04 展晶科技(深圳)有限公司 发光二极管及其制作方法
JP2012028749A (ja) * 2010-07-22 2012-02-09 Seoul Opto Devices Co Ltd 発光ダイオード
KR20140073351A (ko) * 2012-12-06 2014-06-16 엘지이노텍 주식회사 발광 소자

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1819255A (zh) * 2005-02-03 2006-08-16 范朝阳 基于微型发光二极管的高压交直流指示灯
CN102132429A (zh) * 2008-09-11 2011-07-20 普瑞光电股份有限公司 串联分段式发光二极管

Also Published As

Publication number Publication date
US20160225816A1 (en) 2016-08-04
KR20140073351A (ko) 2014-06-16
US9735199B2 (en) 2017-08-15
EP2741338B1 (en) 2020-05-20
CN103855180A (zh) 2014-06-11
JP2014116604A (ja) 2014-06-26
US20140159071A1 (en) 2014-06-12
US9337236B2 (en) 2016-05-10
EP2741338A1 (en) 2014-06-11

Similar Documents

Publication Publication Date Title
CN103855180B (zh) 发光器件
KR102087933B1 (ko) 발광 소자 및 이를 포함하는 발광 소자 어레이
CN103094435B (zh) 发光器件及发光器件封装
US9620682B2 (en) Light emitting device
KR101871372B1 (ko) 발광 소자
US9837577B2 (en) Light emitting device
TWI446586B (zh) 發光裝置
US9812626B2 (en) Light emitting device
CN102169937A (zh) 发光器件、发光器件封装、制造发光器件的方法及照明系统
KR20130006810A (ko) 발광 소자 및 발광 소자 패키지

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20210813

Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Leyu Semiconductor Co.,Ltd.

Address before: Seoul, South Kerean

Patentee before: LG INNOTEK Co.,Ltd.

CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Liyu Semiconductor Co.,Ltd.

Country or region after: China

Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee before: Suzhou Leyu Semiconductor Co.,Ltd.

Country or region before: China