CN103811355B - 用于叠层封装器件的模制底部填充物 - Google Patents

用于叠层封装器件的模制底部填充物 Download PDF

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Publication number
CN103811355B
CN103811355B CN201310051231.0A CN201310051231A CN103811355B CN 103811355 B CN103811355 B CN 103811355B CN 201310051231 A CN201310051231 A CN 201310051231A CN 103811355 B CN103811355 B CN 103811355B
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China
Prior art keywords
encapsulation
installed part
muf
carrier package
district
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CN103811355A (zh
Inventor
余振华
李建勋
郑荣伟
王宗鼎
郑明达
陈永庆
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Abstract

本文公开了具有模制底部填充物的叠层封装器件及其形成方法，该方法包括应用将管芯安装至载体封装件的第一侧的封装安装件。模制底部填充物可被应用在载体封装件的第一侧，并且与载体安装件的一部分和管芯侧壁的一部分接触。具有至少一个连接盘的顶部封装件可被安装至载体封装件的第一侧且位于管芯之上，并且可选地与管芯的顶面分离。可在应用模制底部填充物之前、期间或之后削平封装安装件，以可选地与底部填充物的表面齐平。与封装安装件接触的底部填充物区可位于与管芯侧壁接触的底部填充物区表面之下或之上。

Description

用于叠层封装器件的模制底部填充物
技术领域
本发明总的来说涉及半导体领域，更具体地，涉及用于叠层封装器件的模制底部填充物。
背景技术
半导体器件被用于各种电子应用，诸如个人计算机、手机、数码相机以及其他电子设备。通常通过在半导体衬底上方顺序沉积绝缘层或介电层、导电层以及半导体材料层，然后使用光刻图案化各个材料层以在其上形成电路部件和元件来制造半导体器件。
半导体工业通过持续减小最小部件尺寸而不断提高各种电子部件(例如，晶体管、二极管、电阻器、电容器等)的集成密度，这使得将更多的部件集成到给定面积中。在一些应用中，这些更小的电子部件还要求更小的封装件，它们使用比过去封装件更小的面积。
叠层封装(PoP)技术因为其允许将集成电路密集地集成到较小的整体封装件中而越来越受欢迎。PoP技术应用于许多先进的手持设备，诸如智能手机。尽管PoP技术实现较小的封装轮廓，但是总体厚度的减小当前受到顶部封装件和底部封装件之间的焊球连接高度的限制。有时管芯通过球栅阵列、连接盘阵列(1and array)、固体中介柱阵列(solid interposer studarray)等安装至中介衬底或其他封装载体。在一些情况下，底部安装填充物或底部填充物可应用在管芯和中介PC板之间，以填充安装导体之间的空间。
发明内容
根据本发明的一个方面，提供了一种用于形成器件的方法，包括：提供载体封装件，至少一个连接盘设置在第一侧上；在载体封装件的第一侧上应用封装安装件；将管芯安装至载体封装件的第一侧；向载体封装件的至少第一侧应用模制底部填充物(MUF)，MUF与封装安装件的至少一部分接触并且与管芯的侧壁的至少一部分接触；以及将具有至少一个连接盘的顶部封装件安装至载体封装件的第一侧，顶部封装件的连接盘与载体封装件的连接盘电通信，并且顶部封装件被安装在管芯的至少一部分之上。
优选地，该方法还包括削平封装安装件以形成削平的表面。
优选地，在应用MUF之前执行削平封装安装件，并且应用MUF包括应用具有围绕与封装安装件的削平顶面基本齐平的封装安装件的MUF区域的MUF。
优选地，在应用MUF之后执行削平封装安装件，并且削平封装安装件包括将封装安装件的高度降低至与围绕封装安装件的MUF区域基本相同的高度。
优选地，该方法还包括对载体封装件的第一侧应用管芯安装件并且削平管芯安装件，其中管芯安装至管芯安装件。
优选地，该方法还包括在封装安装件上应用封装安装柱，封装安装柱与载体封装件的连接盘电通信，并且安装顶部封装件包括将顶部封装件安装至封装安装柱。
优选地，MUF包括封装安装件MUF区和管芯侧壁MUF区，管芯侧壁MUF区与管芯的侧壁的至少一部分接触，封装安装件至少部分地设置在封装安装件MUF区中，并且封装安装件MUF区的顶面处于不同于管芯侧壁MUF区的顶面的高度。
优选地，封装安装件MUF区的顶面位于管芯的顶面下方。
优选地，安装顶部封装件包括在使顶部封装件的底面与管芯的顶面分离的高度处安装顶部封装件。
根据本发明的另一方面，提供了一种器件，包括：载体封装件，具有至少一个连接盘；封装安装件，设置在载体封装件的第一侧上并与载体封装件的连接盘电通信；管芯安装件，设置在载体封装件的第一侧上；管芯，安装在管芯安装件上；以及模制底部填充物(MUF)，设置在载体封装件的第一侧上，MUF与封装安装件的至少一部分接触并与管芯的侧壁的至少一部分接触。
优选地，封装安装件被削平以具有与载体封装件相对的基本平坦的部分。
优选地，管芯安装件被削平以具有与载体封装件相对的基本平坦的部分，并且封装安装件和管芯安装件在单个表面处被削平至在载体封装件的所述第一侧之上具有预定高度。
优选地，MUF包括封装安装件MUF区和管芯侧壁MUF区，管芯侧壁MUF区与管芯的侧壁的至少一部分接触，封装安装件至少部分地设置在封装安装件MUF区中，并且封装安装件MUF区的顶面处于不同于管芯侧壁MUF区的顶面的高度。
优选地，封装安装件MUF区的顶面位于管芯的顶面下方。
优选地，封装安装件MUF区的顶面位于管芯的顶面之上。
根据本发明的又一方面，提供了一种器件，包括：载体封装件，具有至少一个连接盘；封装安装件，设置在载体封装件的第一侧上并与载体封装件的连接盘电通信；管芯，设置在载体封装件的第一侧上；以及模制底部填充物(MUF)，设置在载体封装件的第一侧上并至少具有封装安装件MUF区和管芯侧壁MUF区，管芯侧壁MUF区与管芯的侧壁的至少一部分接触，并且封装安装件至少部分地设置在封装安装件MUF区中。
优选地，封装安装件被削平以具有与载体封装件相对的基本平坦的顶部，该平坦的顶部与封装安装件MUF区的顶面基本齐平。
优选地，该器件还包括安装至封装安装件的顶部封装件，顶部封装件设置在管芯之上。
优选地，顶部封装件的底面与管芯的顶面分离。
优选地，该器件还包括设置在封装安装件上的封装安装柱，顶部封装件设置在封装安装柱上并且通过封装安装柱和封装安装件与载体封装件电通信。
附图说明
为了更完整地理解本发明及其优点，现在结合附图作为参考进行以下描述，其中：
图1示出了用于形成具有模制底部填充物的叠层封装器件的方法的流程图；
图2至图7示出了形成具有模制底部填充物的叠层封装器件的实施例的中间步骤的截面图；
图8A至8D以及9A至9D示出了用于形成具有模制底部填充物的叠层封装器件的方法的实施例；以及
图10至13示出了具有模制底部填充物的叠层封装器件的实施例的截面图。
除非另有指明，否则不同图中对应的标号和符号通常表示对应的部件。绘制附图是为了示出实施例的相关方面，但不一定按比例绘制。
具体实施方式
以下详细讨论本发明实施例的制造和使用。然而，应该理解，本发明提供了许多可在各种具体环境中具体化的可应用概念。所讨论的具体实施例仅是本发明的制造和使用的具体方式的说明，但是并不限制本发明的范围。注意，为了简化，后续的每幅附图并没有包括全部的元件标号。相反，每幅附图都包括与每幅附图的描述最相关的元件标号。
图1示出了根据本发明实施例的用于形成具有模制底部填充物的PoP器件的方法100的流程图。首先参考图1，在顶部封装件安装过程106之前执行中介片制备过程102和模具制备过程104。图2示出了载体封装件200。在中介片制备过程102中，在方框108中提供载体封装件200，并且管芯安装件202、封装安装件204和一个或多个管芯402(参见图4)被应用于载体封装件200。虽然附图示出了一个载体封装件200，但是可以可选地在包括多个载体封装件200的工件上对多个载体封装件200进行处理，并且工件可在随后的处理步骤期间被分割。
载体封装件200可具有中介衬底206，其中一个或多个再分布层(RDL)208设置在中介衬底206的一侧或两侧。在中介衬底206的一侧或两侧可具有衬底连接盘216，通过通孔218连接衬底连接盘216。RDL208可包括一个或多个安装焊盘或连接盘210，其可电连接至中介衬底的衬底连接盘216并通过延伸连接至通孔218。
另一个实施例可以是载体封装件200在中介衬底206与管芯安装件202相对的一侧具有RDL208。该RDL208可具有一个或多个连接盘210，其具有诸如球栅阵列等的可使最终的PoP器件安装至其他封装件、电路板、器件、显示器等的PoP安装件212。
在方框110中，安装点可应用于载体封装件200。重新参考图2，诸如封装安装件204和管芯安装件202的安装点可设置在连接盘210上。在一些实施例中，封装安装件204和/或管芯安装件202是焊球。可选地，管芯安装件202和封装安装件204可以是固体互连件或其他封装安装装置。一个或多个表面通孔214可电连接至连接盘210，它们又连接至衬底连接盘216和通孔218。在一些实施例中，由封装安装件204所示的安装点可直接设置在连接盘210上，或者由管芯安装件202所示的安装点可设置在表面通孔214上。
在方框112中并如图3所示，管芯安装件202和封装安装件204可以可选地被削平(coin)或削减。在一些实施例中，在方框110中可应用焊球，然后，在方框112中一旦焊球凝固就对其进行削平。在一些实施例中，削平封装安装件204或管芯安装件202可包括在封装安装件204或管芯安装件202上生成基本平坦的顶面。在一些实施例中，平坦的削平表面或平坦的顶部可形成在与载体封装件200相对的封装安装件204或管芯安装件202上。如图3所示，封装安装件204和管芯安装件202可在单个平面302处被削平或削减至在载体封装件200的表面上方具有预定高度。在其他实施例中，封装安装件204可在第一平面处被削平至第一高度，而管芯安装件202可在第二平面处被削平至第二不同的高度。此外，第一封装安装件204的高度高于第二管芯安装件202的高度，或者可选地，第一封装安装件204的高度低于第二管芯安装件202的高度。在其他实施例中，管芯安装件202可保持未被削减而没有被削平，而封装安装件204可被削平至预定高度。
在方框114中并如图4所示，一个或多个管芯402可安装在管芯安装件202上。尽管为了清楚图4示出了安装单个管芯402，但任意数目的管芯402都可被安装至管芯安装件202。在多个管芯402被安装至管芯安装件202的实施例中，可按组配置管芯安装件202以接受多个管芯402。
管芯402可通过将管芯连接盘404或其他安装焊盘附接至管芯安装件202而安装至管芯安装件。在管芯安装件202是焊球的实施例中，可对焊球管芯安装件202进行回流，以将管芯安装件202附接至管芯连接盘404。在其他实施例中，管芯402可通过焊膏、导电粘合剂等暂时安装至管芯安装件202，并且在随后的步骤中回流焊料，以将管芯402永久地安装至管芯安装件202。在又一些其他实施例中，在管芯安装件202是固体互连件或其他非焊料材料的情况下，可利用焊料、焊膏或其他导电粘合材料将管芯402附接至固体互连件。
在模具制备步骤104中，在方框116中如图5所示，可提供模具502。在方框118中，可以可选地应用剥离膜504。模具502可具有在应用时用于保持底部填充物材料的框架或其他部件。模具502可在一些实施例中被配置成容纳具有管芯402的一个或多个载体封装件200，并且可在模具502中形成凹槽，以在管芯402、管芯安装件202、封装安装件204和载体封装件200表面周围引导或形成底部填充物(图5中的506)。
在顶部封装件安装步骤106中，模制底部填充物(MUF)506可应用于载体封装件200，并且可填充管芯402下方、管芯安装件202之间以及封装安装件204周围的区域。在一些实施例中，MUF506可以是非导电材料，并且可以是环氧树脂、树脂、可模制聚合物等。当基本呈液态时可应用MUF506，然后可通过化学反应被固化，诸如以环氧基树脂或树脂的形态。在其他实施例中，MUF506可以是紫外线(UV)或热固性聚合物，其被施加为能够置于管芯402和RDL208表面之间的凝胶或可塑性固体。在使用需要UV或热能固化MUF506的材料的实施例中，MUF506材料可以被模制成形，但对于将被去除以将MUF506暴露于用于固化的UV或热能源的模具来说足够坚固。在方框118中剥离膜504的可选应用可以使模具502与MUF506分离，并且可用于MUF506是环氧树脂或树脂的实施例中以防止MUF506材料粘附在模具502的表面。
在方框124中，可以可选地削平安装件。具体地，可在方框122中模制底部填充物期间或者在MUF506形成之后，对封装安装件204进行削平。在一些实施例中，当应用MUF506时，模具502可削减封装安装件204。例如，模具502可被加热，直至由焊料制成的封装安装件204的多余材料可被移除。可选地，与第一模具502具有相同图案但其中具有研磨料的第二模具可在MUF506形成之后用于将封装安装件204研磨至期望高度。在另一个实施例中，可应用MUF506，使得未被削平的封装安装件204延伸至MUF506的表面上方，然后封装安装件可被削减至与围绕封装安装件204的MUF506区域的顶面基本齐平。
可通过例如将其他可流动材料的环氧树脂注入到MUF506空间来应用MUF506。在这种实施例中，模具502具有一个或多个注入端口，通过这些端口注入MUF506。模具502可具有框架结构，其保持载体封装件200的边缘处的MUF506，或者可包含载体封装件200上预定区域的MUF506。在这种实施例中，可在压力下施加MUF506材料以将MUF506材料压入封装安装件204之间、管芯402下方以及管芯安装件202之间的空间。在其他实施例中，可用MUF506材料填充模具502，并且将载体封装件200放置在模具中。在一些实施例中，模具502可被倒置；载体封装件200被倒置在模具502中的MUF506材料中。
MUF506可具有一个或多个子区域，并且可包括管芯侧壁MUF区506B和封装安装件MUF区506A。围绕封装安装件的MUF506可以是封装安装件MUF区506A，并且可应用MUF506，使得MUF506的顶面具有与封装安装件204的削平顶面基本相同的高度或者与其基本齐平。可选地，可应用MUF506然后削平封装安装件204，使得封装安装件204的削平表面或顶面与封装安装件MUF区506A的顶面基本齐平。封装安装件MUF区506A可至少部分包围封装安装件204，使得封装安装件204至少部分地设置在封装安装件MUF区506A中。
在示出的实施例中，封装安装件MUF区506A的顶面可低于管芯402的顶面，并且与封装安装件204的顶面基本齐平。管芯侧壁MUF区506B可覆盖管芯402侧壁的至少一部分。在一些实施例中，管芯侧壁MUF区506B可大约升高至管芯402的顶面，并且粘附至管芯402的侧壁。尽管本文示出的管芯侧壁MUF区506B具有基本垂直的外部侧壁506C，但是管芯侧壁MUF区506B的外部侧壁506C的角度可以是任意角度，并且可具有任意形状。例如，MUF区506B的外部侧壁506C的轻微锥度可使模具502更容易被去除。
在方框126中并如图6所示，封装安装柱602可以可选地应用于封装安装件204。在一些实施例中，封装安装柱602可以是固体互连件，其可以可选地设置在封装安装件204上，并且可连接至连接盘210(图2)或者与其电通信。通过延伸，封装安装柱602可与中介衬底206(图2)中的一个或多个通孔218电通信。在一些实施例中，例如，可利用引线接合设备引线附接封装安装柱602。
在另一个实施例中，封装安装柱602可至少延伸到管芯402的顶面的高度。此外，封装安装柱602可被配置成容纳安装在其上的顶部封装件702(图6未示出，如图7所示)，其中封装安装柱602保持管芯402之上的顶部封装件702。封装安装柱602的顶部可具有足够高的高度，以使顶部封装件与管芯402保持分离并位于其上方，或者顶部封装件与管芯402接触。
在方框128中，可应用有机保焊剂(OSP)或其他兼容焊料的涂层。诸如可焊性防腐剂的防腐蚀涂层可应用于封装安装柱602、封装安装件204或封装安装柱602和封装安装件204。可选地，不易受腐蚀的涂层可应用于封装安装柱602、封装安装件204或两者。例如，由金(Au)、钯(Pd)、镍(Ni)、前述金属的合金等构成的涂层可用于封装安装柱602或封装安装件204上。在安装最后组件或顶部封装件702(图7所示)之前制备或装配载体封装件200的情况下，OSP可以是有利的，因为OSP可保护或保持易受腐蚀的封装安装柱602或封装安装件204的表面。
在方框130中可安装顶部封装件702以及在方框132中可以回流焊料，以将顶部封装件702附接至载体封装件200。图7示出了根据本发明各个实施例的具有安装在载体封装件200上的顶部封装件702的叠层封装器件700。在一些实施例中，可在顶部封装件702的底面与管芯402的顶面分离的高度安装顶部封装件702。在采用封装安装柱602的实施例中，封装安装柱602可形成在足够的高度以保持顶部封装件与管芯402的顶面分离。在另一个实施例中，顶部封装件702的底面可与管芯402的顶面直接接触，或者可在顶部封装件702和管芯402的顶面之间设置粘合剂、导热化合物或散热片。
在一些实施例中，顶部封装件702可具有中介衬底206，其中衬底连接盘216设置在中介衬底的一侧或多侧以连接穿过中介衬底206的通孔。一个或多个封装连接件704可用于连接顶部封装件702与封装安装柱602。在一些实施例中，封装连接件704可以是应用于顶部封装件702底面上的衬底连接盘216的焊球。在这样的实施例中，可回流焊球封装连接件704，以将顶部封装件702附接至所使用的封装安装柱602。在没有封装安装柱602的其他实施例中，顶部封装件702可直接附接至封装安装件204。在又一些其他实施例中，封装连接件704可以是焊膏、导电的粘合剂等。
在一些实施例中，顶部封装件702可通过粘合剂708或其他安装技术附接一个或多个顶部管芯706。顶部管芯706可通过引线接合710电连接至中介衬底206中的一个或多个衬底连接盘216。在其他实施例中，顶部管芯706可通过管芯连接盘404上的球栅阵列、插槽、表面安装技术等被安装在顶部封装件702的中介衬底206上。在一些实施例中，顶部管芯706可通过封装安装柱602和封装安装件204与载体封装件200电通信。
图8A-8D示出了根据本发明实施例的用于形成具有沟槽MUF506的载体封装件200的实施例的截面图。如图8A所示并且如以上参照图2和图4所述，可应用封装安装件204并安装管芯402。如图8B所示，MUF506可施加在封装安装件204上方。在一些实施例中，MUF506可覆盖封装安装件204，并且可具有与管芯402基本齐平的顶面。模具502可用于形成或保持MUF506，并且可具有用于形成MUF506顶面的基本平坦的模制表面。
如图8C所示，可在MUF506和封装安装件204中形成沟槽。安装沟槽802可形成为穿过MUF506并延伸到封装安装件204的一部分中。可在封装安装件204上或封装安装件204中生成平坦表面。在一些实施例中，安装沟槽802形成有平坦的底面。安装沟槽802的底面可设置在封装安装件204中，从而在封装安装件204中形成底部平坦的凹槽。在一些实施例中，可通过诸如铣削、锯削或钻孔的机械工艺形成安装沟槽802，或者在其他实施例中，通过其他适合的工艺形成。
如图8D所示，封装安装柱602可以可选地设置在安装沟槽802中。在一些实施例中，封装安装柱602可延伸高于MUF506的表面。可对安装沟槽802进行配置，使得顶部封装件(图7中的702)可被安装在封装安装柱602上，并且封装连接件(图7中的704)可延伸到安装沟槽802中，以将顶部封装件702附接至封装安装柱602。
图9A-9D示出了根据本发明实施例的用于形成具有嵌入封装安装结构902的载体封装件200的实施例的截面图。如图9A所示，封装安装结构902可利用焊膏904、焊料或其他适合的导电附接工艺应用于连接盘210。在一些实施例中，封装安装结构902可以是诸如铜的非熔金属或非焊料金属。在其他实施例中，封装安装结构902可以是任意其他适合的材料，诸如钨、金、铝、钽、它们的合金等。封装安装结构902的形状例如可以是球形、柱形等。
如图9B所示，可安装管芯402并执行焊料回流工艺，以将管芯402贴附至管芯安装件202以及将封装安装结构902贴附至连接盘210。图9C示出了根据本发明各个实施例的在封装安装结构902周围形成MUF506。波状模具906可具有被配置成符合封装安装结构902的一个或多个波状凹槽。可形成MUF506，使得封装安装结构902延伸超过围绕封装安装结构902的区域中的MUF506的表面。
图9D示出了根据本发明各个实施例的在封装安装结构902上安装顶部封装件702。一个或多个封装连接件704可附接至露出或延伸至MUF506表面上方的部分封装安装结构。
图10示出了根据本发明各个实施例的具有MUF506的载体封装件200的截面图。在图10的实施例中，封装安装柱602可应用于封装安装件204，并且MUF506可应用为覆盖封装安装MUF区506A中的封装安装柱602的底部。在一些实施例中，封装安装柱602的至少一部分延伸至MUF506的顶面之上。在其他实施例中，MUF506应用为与管芯402的顶面基本齐平。在这样的实施例中，管芯402的顶面上可基本没有MUF506材料。
图11示出了根据本发明各个实施例的具有MUF506的载体封装件200的截面图。封装安装件204可延伸至MUF506的顶面，其可应用为与管芯402的顶面基本齐平。在这样的实施例中，可以省略封装安装柱602，或者可选地，其可应用于封装安装件204的延伸高度上。
图12示出了根据本发明各个实施例的具有MUF506的载体封装件200的截面图。封装安装件204可延伸至MUF506的顶面，其可高于管芯402的顶面的平面。在这样的实施例中，MUF可覆盖管芯402。
图13示出了根据本发明各个实施例的具有MUF506的载体封装件200的截面图。封装安装件204可延伸至MUF506的顶面，其可高于封装安装MUF区506A中的管芯402的顶面的平面。可应用MUF506，使得露出管芯402的表面。在一些实施例中，管芯侧壁MUF区506B可从封装安装MUF区506A向管芯402倾斜，或者可以可选地具有从封装安装MUF区506A向管芯402过渡的垂直侧壁。在一些实施例中，露出管芯402顶面的凹进的MUF506可使管芯402上方有空气流、应用散热片等。
尽管已详细描述本发明的实施例及它们的优点，但是应该理解，在不背离所附权利要求限定的本发明的精神和范围的情况下，可以进行各种改变、替换和变更。例如，本领域技术人员很容易理解，可对本文描述的特征、功能、工艺以及材料进行改变而仍在本发明的范围内。而且，本申请的范围并不旨在限于说明书中描述的工艺、机器装置、制造、物质组成、工具、方法及其步骤的具体实施例。本领域的技术人员很容易理解，根据本发明可以使用与本文描述对应的实施例执行基本相同功能或实现基本相同结果的目前现有或即将开发的工艺、机器装置、制造、物质组成、工具、方法或步骤因此，所附权利要求旨在包括这种工艺、机器装置、制造、物质组成、工具、方法或步骤的范围内。

Claims (17)

1.一种用于形成器件的方法，包括：
提供载体封装件，至少一个连接盘设置在第一侧上；
在所述载体封装件的所述第一侧上应用封装安装件；
将管芯安装至所述载体封装件的所述第一侧；
向所述载体封装件的至少第一侧应用模制底部填充物MUF，所述MUF与所述封装安装件的至少一部分接触并且与所述管芯的侧壁的至少一部分接触；以及
将具有至少一个连接盘的顶部封装件安装至所述载体封装件的所述第一侧，所述顶部封装件的连接盘与所述载体封装件的连接盘电通信，并且所述顶部封装件被安装在所述管芯的至少一部分之上；
还包括在所述封装安装件上应用封装安装柱，所述封装安装柱与所述载体封装件的连接盘电通信，并且安装所述顶部封装件包括将所述顶部封装件安装至所述封装安装柱。
2.根据权利要求1所述的方法，还包括削平所述封装安装件以形成削平的表面。
3.根据权利要求2所述的方法，其中，在应用所述MUF之前执行削平所述封装安装件，并且应用所述MUF包括应用具有围绕与所述封装安装件的削平顶面齐平的封装安装件的MUF区的MUF。
4.根据权利要求2所述的方法，其中，在应用所述MUF之后执行削平所述封装安装件，并且削平所述封装安装件包括将所述封装安装件的高度降低至与围绕所述封装安装件的MUF区相同的高度。
5.根据权利要求2所述的方法，还包括对所述载体封装件的第一侧应用管芯安装件并且削平所述管芯安装件，其中所述管芯安装至所述管芯安装件。
6.根据权利要求1所述的方法，其中，所述MUF包括封装安装件MUF区和管芯侧壁MUF区，所述管芯侧壁MUF区与所述管芯的侧壁的至少一部分接触，所述封装安装件至少部分地设置在所述封装安装件MUF区中，并且所述封装安装件MUF区的顶面处于不同于所述管芯侧壁MUF区的顶面的高度。
7.根据权利要求6所述的方法，其中，所述封装安装件MUF区的顶面位于所述管芯的顶面下方。
8.根据权利要求7所述的方法，其中，安装所述顶部封装件包括在使所述顶部封装件的底面与所述管芯的顶面分离的高度处安装所述顶部封装件。
9.一种封装器件，包括：
载体封装件，具有至少一个连接盘；
封装安装件，设置在所述载体封装件的第一侧上并与所述载体封装件的连接盘电通信；
管芯安装件，设置在所述载体封装件的所述第一侧上；
管芯，安装在所述管芯安装件上；以及
模制底部填充物MUF，设置在所述载体封装件的所述第一侧上，所述MUF与所述封装安装件的至少一部分接触并与所述管芯的侧壁的至少一部分接触；
封装安装柱，设置在所述封装安装件上；
顶部封装件，设置在所述封装安装柱上并且通过所述封装安装柱和所述封装安装件与所述载体封装件电通信。
10.根据权利要求9所述的器件，其中，所述封装安装件被削平以具有与所述载体封装件相对的平坦的部分。
11.根据权利要求10所述的器件，其中，所述管芯安装件被削平以具有与所述载体封装件相对的平坦的部分，并且所述封装安装件和所述管芯安装件在单个表面处被削平至在所述载体封装件的所述第一侧之上具有预定高度。
12.根据权利要求9所述的器件，其中，所述MUF包括封装安装件MUF区和管芯侧壁MUF区，所述管芯侧壁MUF区与所述管芯的侧壁的至少一部分接触，所述封装安装件至少部分地设置在所述封装安装件MUF区中，并且所述封装安装件MUF区的顶面处于不同于所述管芯侧壁MUF区的顶面的高度。
13.根据权利要求12所述的器件，其中，所述封装安装件MUF区的顶面位于所述管芯的顶面下方。
14.根据权利要求12所述的器件，其中，所述封装安装件MUF区的顶面位于所述管芯的顶面之上。
15.一种封装器件，包括：
载体封装件，具有至少一个连接盘；
封装安装件，设置在所述载体封装件的第一侧上并与所述载体封装件的连接盘电通信；
管芯，设置在所述载体封装件的第一侧上；以及
模制底部填充物MUF，设置在所述载体封装件的第一侧上并至少具有封装安装件MUF区和管芯侧壁MUF区，所述管芯侧壁MUF区与所述管芯的侧壁的至少一部分接触，并且所述封装安装件至少部分地设置在所述封装安装件MUF区中；
封装安装柱，设置在所述封装安装件上；
顶部封装件，设置在所述封装安装柱上并且通过所述封装安装柱和所述封装安装件与所述载体封装件电通信，所述顶部封装件设置在所述管芯之上。
16.根据权利要求15所述的器件，其中，所述封装安装件被削平以具有与所述载体封装件相对的平坦的顶部，该平坦的顶部与所述封装安装件MUF区的顶面齐平。
17.根据权利要求15所述的器件，其中，所述顶部封装件的底面与所述管芯的顶面分离。
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