CN103801489B - 基板制造方法及基板制造装置 - Google Patents
基板制造方法及基板制造装置 Download PDFInfo
- Publication number
- CN103801489B CN103801489B CN201310344687.6A CN201310344687A CN103801489B CN 103801489 B CN103801489 B CN 103801489B CN 201310344687 A CN201310344687 A CN 201310344687A CN 103801489 B CN103801489 B CN 103801489B
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- CN
- China
- Prior art keywords
- substrate
- pixel
- data
- film
- deflection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Compression, Expansion, Code Conversion, And Decoders (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Image Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012241784A JP6053459B2 (ja) | 2012-11-01 | 2012-11-01 | 基板製造方法及び基板製造装置 |
JP2012-241784 | 2012-11-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103801489A CN103801489A (zh) | 2014-05-21 |
CN103801489B true CN103801489B (zh) | 2015-09-30 |
Family
ID=50699156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310344687.6A Active CN103801489B (zh) | 2012-11-01 | 2013-08-08 | 基板制造方法及基板制造装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6053459B2 (ja) |
KR (1) | KR101436755B1 (ja) |
CN (1) | CN103801489B (ja) |
TW (1) | TWI492792B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105499069B (zh) * | 2014-10-10 | 2019-03-08 | 住友重机械工业株式会社 | 膜形成装置及膜形成方法 |
JP6862041B2 (ja) * | 2016-08-10 | 2021-04-21 | 住友重機械工業株式会社 | 膜形成方法及び膜形成装置 |
CN110049858B (zh) * | 2016-12-13 | 2021-05-28 | 株式会社富士 | 数据转换装置及层叠造型系统 |
JP6968505B2 (ja) * | 2018-05-17 | 2021-11-17 | 住友重機械工業株式会社 | インク塗布装置及びインク塗布方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1224881A (zh) * | 1997-12-18 | 1999-08-04 | 莱克斯马克国际公司 | 用于打印机图像变形的系统和方法 |
US20020007122A1 (en) * | 1999-12-15 | 2002-01-17 | Howard Kaufman | Methods of diagnosing disease |
JP2004104104A (ja) * | 2003-08-04 | 2004-04-02 | Ricoh Co Ltd | 液状樹脂噴射装置及び樹脂構造物 |
US20100220092A1 (en) * | 2009-02-27 | 2010-09-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor Device and Driving Method Thereof, and Electronic Device |
US20100321478A1 (en) * | 2004-01-13 | 2010-12-23 | Ip Foundry Inc. | Microdroplet-based 3-D volumetric displays utilizing emitted and moving droplet projection screens |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05151350A (ja) * | 1991-11-27 | 1993-06-18 | Nippon Steel Corp | 画像データの位置歪み補正方法 |
US5517234A (en) * | 1993-10-26 | 1996-05-14 | Gerber Systems Corporation | Automatic optical inspection system having a weighted transition database |
US7250237B2 (en) * | 2003-12-23 | 2007-07-31 | Asml Netherlands B.V. | Optimized correction of wafer thermal deformations in a lithographic process |
GB0426126D0 (en) * | 2004-11-29 | 2004-12-29 | Plastic Logic Ltd | Distortion compensation for multiple head printing |
JP5246945B2 (ja) | 2009-03-05 | 2013-07-24 | 武蔵エンジニアリング株式会社 | 液体材料の塗布方法および塗布装置 |
JP5336301B2 (ja) * | 2009-08-24 | 2013-11-06 | 大日本スクリーン製造株式会社 | パターン描画方法、パターン描画装置および描画データ生成方法 |
CN102770811B (zh) * | 2010-02-25 | 2015-05-20 | Asml荷兰有限公司 | 光刻设备和器件制造方法 |
KR20120047628A (ko) * | 2010-11-04 | 2012-05-14 | 삼성전기주식회사 | 레지스트 잉크 인쇄 장치 |
TWM415406U (en) * | 2011-05-25 | 2011-11-01 | Yee Chang Prec Machinery Co Ltd | Facilitate for Substrate Alignment Holes Measurement Substrate deformation of the measuring device |
-
2012
- 2012-11-01 JP JP2012241784A patent/JP6053459B2/ja active Active
-
2013
- 2013-07-24 TW TW102126455A patent/TWI492792B/zh active
- 2013-08-08 CN CN201310344687.6A patent/CN103801489B/zh active Active
- 2013-09-26 KR KR1020130114311A patent/KR101436755B1/ko active Search and Examination
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1224881A (zh) * | 1997-12-18 | 1999-08-04 | 莱克斯马克国际公司 | 用于打印机图像变形的系统和方法 |
US20020007122A1 (en) * | 1999-12-15 | 2002-01-17 | Howard Kaufman | Methods of diagnosing disease |
JP2004104104A (ja) * | 2003-08-04 | 2004-04-02 | Ricoh Co Ltd | 液状樹脂噴射装置及び樹脂構造物 |
US20100321478A1 (en) * | 2004-01-13 | 2010-12-23 | Ip Foundry Inc. | Microdroplet-based 3-D volumetric displays utilizing emitted and moving droplet projection screens |
US20100220092A1 (en) * | 2009-02-27 | 2010-09-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor Device and Driving Method Thereof, and Electronic Device |
Also Published As
Publication number | Publication date |
---|---|
TWI492792B (zh) | 2015-07-21 |
JP2014093349A (ja) | 2014-05-19 |
TW201417903A (zh) | 2014-05-16 |
KR20140055978A (ko) | 2014-05-09 |
JP6053459B2 (ja) | 2016-12-27 |
CN103801489A (zh) | 2014-05-21 |
KR101436755B1 (ko) | 2014-09-01 |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |