CN103801489B - 基板制造方法及基板制造装置 - Google Patents

基板制造方法及基板制造装置 Download PDF

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Publication number
CN103801489B
CN103801489B CN201310344687.6A CN201310344687A CN103801489B CN 103801489 B CN103801489 B CN 103801489B CN 201310344687 A CN201310344687 A CN 201310344687A CN 103801489 B CN103801489 B CN 103801489B
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China
Prior art keywords
substrate
pixel
data
film
deflection
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CN201310344687.6A
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English (en)
Chinese (zh)
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CN103801489A (zh
Inventor
白石达朗
冈本裕司
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Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
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Publication of CN103801489A publication Critical patent/CN103801489A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Compression, Expansion, Code Conversion, And Decoders (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Image Processing (AREA)
CN201310344687.6A 2012-11-01 2013-08-08 基板制造方法及基板制造装置 Active CN103801489B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012241784A JP6053459B2 (ja) 2012-11-01 2012-11-01 基板製造方法及び基板製造装置
JP2012-241784 2012-11-01

Publications (2)

Publication Number Publication Date
CN103801489A CN103801489A (zh) 2014-05-21
CN103801489B true CN103801489B (zh) 2015-09-30

Family

ID=50699156

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310344687.6A Active CN103801489B (zh) 2012-11-01 2013-08-08 基板制造方法及基板制造装置

Country Status (4)

Country Link
JP (1) JP6053459B2 (ja)
KR (1) KR101436755B1 (ja)
CN (1) CN103801489B (ja)
TW (1) TWI492792B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105499069B (zh) * 2014-10-10 2019-03-08 住友重机械工业株式会社 膜形成装置及膜形成方法
JP6862041B2 (ja) * 2016-08-10 2021-04-21 住友重機械工業株式会社 膜形成方法及び膜形成装置
CN110049858B (zh) * 2016-12-13 2021-05-28 株式会社富士 数据转换装置及层叠造型系统
JP6968505B2 (ja) * 2018-05-17 2021-11-17 住友重機械工業株式会社 インク塗布装置及びインク塗布方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1224881A (zh) * 1997-12-18 1999-08-04 莱克斯马克国际公司 用于打印机图像变形的系统和方法
US20020007122A1 (en) * 1999-12-15 2002-01-17 Howard Kaufman Methods of diagnosing disease
JP2004104104A (ja) * 2003-08-04 2004-04-02 Ricoh Co Ltd 液状樹脂噴射装置及び樹脂構造物
US20100220092A1 (en) * 2009-02-27 2010-09-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor Device and Driving Method Thereof, and Electronic Device
US20100321478A1 (en) * 2004-01-13 2010-12-23 Ip Foundry Inc. Microdroplet-based 3-D volumetric displays utilizing emitted and moving droplet projection screens

Family Cites Families (9)

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Publication number Priority date Publication date Assignee Title
JPH05151350A (ja) * 1991-11-27 1993-06-18 Nippon Steel Corp 画像データの位置歪み補正方法
US5517234A (en) * 1993-10-26 1996-05-14 Gerber Systems Corporation Automatic optical inspection system having a weighted transition database
US7250237B2 (en) * 2003-12-23 2007-07-31 Asml Netherlands B.V. Optimized correction of wafer thermal deformations in a lithographic process
GB0426126D0 (en) * 2004-11-29 2004-12-29 Plastic Logic Ltd Distortion compensation for multiple head printing
JP5246945B2 (ja) 2009-03-05 2013-07-24 武蔵エンジニアリング株式会社 液体材料の塗布方法および塗布装置
JP5336301B2 (ja) * 2009-08-24 2013-11-06 大日本スクリーン製造株式会社 パターン描画方法、パターン描画装置および描画データ生成方法
CN102770811B (zh) * 2010-02-25 2015-05-20 Asml荷兰有限公司 光刻设备和器件制造方法
KR20120047628A (ko) * 2010-11-04 2012-05-14 삼성전기주식회사 레지스트 잉크 인쇄 장치
TWM415406U (en) * 2011-05-25 2011-11-01 Yee Chang Prec Machinery Co Ltd Facilitate for Substrate Alignment Holes Measurement Substrate deformation of the measuring device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1224881A (zh) * 1997-12-18 1999-08-04 莱克斯马克国际公司 用于打印机图像变形的系统和方法
US20020007122A1 (en) * 1999-12-15 2002-01-17 Howard Kaufman Methods of diagnosing disease
JP2004104104A (ja) * 2003-08-04 2004-04-02 Ricoh Co Ltd 液状樹脂噴射装置及び樹脂構造物
US20100321478A1 (en) * 2004-01-13 2010-12-23 Ip Foundry Inc. Microdroplet-based 3-D volumetric displays utilizing emitted and moving droplet projection screens
US20100220092A1 (en) * 2009-02-27 2010-09-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor Device and Driving Method Thereof, and Electronic Device

Also Published As

Publication number Publication date
TWI492792B (zh) 2015-07-21
JP2014093349A (ja) 2014-05-19
TW201417903A (zh) 2014-05-16
KR20140055978A (ko) 2014-05-09
JP6053459B2 (ja) 2016-12-27
CN103801489A (zh) 2014-05-21
KR101436755B1 (ko) 2014-09-01

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