CN103706576B - Semiconductor element test separator - Google Patents
Semiconductor element test separator Download PDFInfo
- Publication number
- CN103706576B CN103706576B CN201310455809.9A CN201310455809A CN103706576B CN 103706576 B CN103706576 B CN 103706576B CN 201310455809 A CN201310455809 A CN 201310455809A CN 103706576 B CN103706576 B CN 103706576B
- Authority
- CN
- China
- Prior art keywords
- semiconductor element
- test
- receiving space
- particular wall
- separator
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2862—Chambers or ovens; Tanks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Abstract
A kind of semiconductor element test separator supporting semiconductor element test of disclosure. According to the present invention, by enabling composition to slide for the particular wall housing the test cabinet of semiconductor element, thus the replacement for being contained in the parts within test cabinet provides convenient.
Description
Technical field
The present invention relates to a kind of semiconductor element test separator used when testing semiconductor element.
Background technology
Semiconductor element test separator (hereinafter referred to as separator) be a kind of the semiconductor element manufactured by predetermined manufacturing process is electrically connected to test machine after the device semiconductor element classified according to test result.
For supporting that the separator of semiconductor element test has been disclosed in the numerous patents documents such as KR published patent 10-2002-0053406, Korean granted patent 10-0866364.
Use environment (such as temperature environment) generally, due to semiconductor element is likely to varied, it is therefore necessary to make separator also support high temperature or low-temperature test except supporting room temperature test. For this, separator needs possess the room (Chamber) that semiconductor element to be measured and external environment can carry out block to a certain extent according to its kind.
Further, since the use of semiconductor element is in extensive range and of a great variety, and make due to the development of integrated technology its size equal-specification variable, therefore need when semiconductor element to be tested is replaced to replace the miscellaneous part being formed in separator.
But, for be contained in chamber interior receiving space in parts for, instrument is put into wherein carry out operation owing to open room door, therefore and between miscellaneous part exist interference, therefore replace operation very loaded down with trivial details and harsh. Further, this point manpower loss, replacement time will eventually be caused to increase, degradation under the operation ratio of separator.
Summary of the invention
It is an object of the invention to provide the parts of a kind of receiving space enabling to be positioned at test cabinet and maintain the technology being incorporated into outside the receiving space being drawn out to test cabinet when the state of the wall of main body side composition test cabinet.
In order to reach purpose as above, include according to the semiconductor element test separator of the present invention: test cabinet, there is the receiving space housing semiconductor element; Reciprocating apparatus, moves into the receiving space of described test cabinet by the semiconductor element loading (loading) or takes out of from the receiving space of described test cabinet; Mobile device, moves the semiconductor element being loaded into described reciprocating apparatus the test jack to test machine, or is moved to described reciprocating apparatus from the test jack of test machine by the semiconductor element being completed; Loading part, is loaded into described reciprocating apparatus by semiconductor element; Uninstalling portion, unloads semiconductor element from described reciprocating apparatus, and wherein, the particular wall of described test cabinet can be slided.
Described mobile device is arranged in described particular wall.
Described mobile device includes: pick-up, has for picking up the pickup end being positioned at the semiconductor element within described test cabinet; Drive source, for driving described pick-up, wherein, the movement of described particular wall is making described pickup end depart from from described receiving space or make the described pickup end departed from from described receiving space move to carry out to the scope of described receiving space, and, described pick-up includes at least having one for pickup block that the pickup unit and this pickup unit that pick up semiconductor element are removably combined.
The sidewall being positioned on the mobile route of described particular wall is fixed on described particular wall and moves together with described particular wall.
Could be included for clamping the clamping device of described particular wall.
Described clamping device includes: retaining member, for preventing the disengaging of described particular wall; Cylinder, makes described retaining member retreat mobile, thus preventing described particular wall from departing from or releasing anticreep; Elastomeric element, towards retaining member described in the resiliency supported of described particular wall direction.
Described retaining member is formed the tool receptacle for inserting specialist tools.
Could be included for cushioning the bolster of the mobile impact of described particular wall.
Could be included for confirming the position acknowledging device of the position of described particular wall.
According to the present invention, parts (pickup end etc.) owing to being positioned at the receiving space of test cabinet can be directed into the outside of test cabinet with the slip of particular wall, therefore the replacement operation of corresponding component becomes easy, has after all and can save replacement time and manpower and improve the effect of separator operation ratio.
Accompanying drawing explanation
Fig. 1 is the schematically plane structure chart of the separator according to the present invention.
Fig. 2 is the schematically axonometric chart of separator major part shown in Fig. 1.
Fig. 3 be for illustrate the movement of semiconductor element in separator shown in Fig. 1 with reference to figure.
Fig. 4 and Fig. 5 be the major part for separator shown in Fig. 1 is described with reference to figure.
Fig. 6 a to Fig. 6 d be for illustrate according to the part replacement operation in the separator of the present invention with reference to figure.
Symbol description:
100: semiconductor element test separator 110: test cabinet
111: upper side wall 114: rear wall
120: reciprocating apparatus 130: mobile device
131A, 131B: pick-up 131A-1,131B-1: pickup end
PB: pickup block 131A-2,131B-2: link
132A, 132B: lifting drive source 133: movable power source
140: loading part 150: uninstalling portion
160L, 160R: clamping device 161: retaining member
161a: tool receptacle 162: cylinder
170: bolster 180: position acknowledging device
Detailed description of the invention
Hereinafter, with reference to the accompanying drawings of above-mentioned according to a preferred embodiment of the invention, and the terseness in order to illustrate, known or repeated content is then omitted or brief description as far as possible. Further, all directions in figure all define with Fig. 1 for benchmark.
Fig. 1 is the schematic plan pie graph of the separator 100 according to the present invention.
As it is shown in figure 1, the separator 100 according to the present invention includes test cabinet 110, reciprocating apparatus 120, mobile device 130, loading part 140 and uninstalling portion 150 etc.
Test cabinet 110 has the receiving space S for housing semiconductor element. Test cabinet 110 is configured to upper side wall and can slide along fore-and-aft direction, and front side wall and rear wall are fixed. Detailed content about this test cabinet 110 will be described later.
Reciprocating apparatus 120 for moving into the receiving space S of test cabinet 110 or taking out of from the receiving space S of test cabinet 110 by semiconductor element. For this, reciprocating apparatus 120 has a pair reciprocating member 121a, 121b and pair of guide rails 122a, 122b and moves left and right power source 123.
A pair reciprocating member 121a, 121b possess 8 at left end respectively and load capsule (LP) and possess 8 unloadings capsule (UP) at right-hand member, and move in left-right direction respectively, and are mutually link and move in the opposite direction.
Pair of guide rails 122a, 122b guide moving left and right of a pair reciprocating member 121a, 121b respectively.
Move left and right power source 123 a pair reciprocating member 121a, 121b to linking towards rightabout and locomotivity is provided.
Mobile device 130 is for loading the test jack (TS:TestSockets) that (loading) semiconductor element loaded in capsule LP in reciprocating member 121a, 121b moves to test machine, or is moved to the unloading capsule UP of reciprocating member 121a, 121b from test jack TS by the semiconductor element being completed. For this, as in figure 2 it is shown, mobile device 130 is arranged at, the upper side wall 111 constituting test cabinet 110 is supported, and includes a pair pick-up 131A, 131B and a pair and lift drive source 132A, 132B and movable power source 133.
A pair pick-up 131A, 131B are arranged side by side along the longitudinal direction, and are made up of pickup end 131A-1,131B-1 and link 131A-2,131B-2 respectively.
Pickup end 131A-1,131B-1 have for picking up semiconductor element in capsule from loading of reciprocating member 121a, 121b or release the pickup block (PB:PickerBlock) of pickup, and are positioned at the lower end of link 131A-2,131B-2. As reference, in the present embodiment, on a pickup block PB, 8 pickup units (p:Picker) for picking up 8 semiconductor elements together combine as same parts, and removably combine, thus constitute pickup end 131A-1,131B-1.
Pickup end 131A-1,131B-1 are connected to lifting drive source 132A, 132B by link 131A-2,131B-2. Therefore, the lifting action of pickup end 131A-1,131B-1 is performed by the work of lifting drive source 132A, 132B.
A pair lifting drive source 132A, 132B be combined with each other, and pick-up 131A, 131B of being connected to self respectively move up and down. Work by this lifting drive source 132A, 132B, pickup end 131A-1,131B-1 can descend to pick up semiconductor element from reciprocating member 121a, 121b of being positioned below or release the position of pickup, it is also possible to dropping to can to the position for making to be formed between the semiconductor element of pickup and test jack suitable electrical connection that can press while the test jack supplying semiconductor element being positioned below. As reference, for the ease of illustrating, in Fig. 2, the first pickup end 131A-1 in front is expressed as the state that is raised and the second pickup end 131B-1 at rear is expressed as the state that is lowered by. Further, test jack TS constitutes the key element of test machine (not shown) rather than constitutes the key element of separator 100, but for the ease of illustrating, has represented with dotted line in FIG.
Movable power source 133 makes a pair be combined with each other lifting drive source 132A, 132B move in front-rear direction in the lump. Therefore, by the work of movable power source 133, pickup end 131A-1,131B-1 of being connected to a pair lifting drive source 132A, 132B also move in front-rear direction.
Above-mentioned Fig. 2 illustrates the state that upper side wall 111 rearward moves, and the part being represented by dashed line is constitute right side wall 113 and the rear wall 114 of test cabinet. And, undeclared symbol H1、H2For the through hole that reciprocating member 121a, 121b can pass through. Receiving space S can pass through this through hole H1、H2And outwardly expose, but can pass through at the interlude of reciprocating member 121a, 121b or through hole H1、H2The degree that side arranges shutter (not shown) and makes receiving space outwardly expose minimizes, and this shutter can realize with the flexible material that can bend.
And, in Fig. 2, part discloses, the upper side wall 111 of test cabinet 110 is formed the connecting hole 111b extended along the longitudinal direction, for making pickup end 131A-1,131B-1 of being positioned at test cabinet 110 internal (receiving space) are connected on lifting drive source 132A, the 132B outside test cabinet 110 by link 131A-2,131B-2, make pick-up 131A, 131B be capable of the movement on fore-and-aft direction simultaneously. Wherein, according to different embodiments, it is possible to independent plate (not shown) is arranged at link 131A-2,131B-2 upper end, thus also being able to when link 131A-2,131B-2 move make the degree that the connecting hole of extension is exposed to the external world minimize.
As reference, as shown in Figure 1, when the second reciprocating member 121b that the first reciprocating member 121a in front moves to right side rear moves to left side, the semiconductor element loading capsule LP being arranged in the first reciprocating member 121a moves to test jack TS after moving the first pick-up 131A pickup of device 130, and the semiconductor element being completed moves the unloading capsule UP to the second reciprocating member 131b after moving the second pick-up 131B pickup of device 130. While carrying out this process, in the first enterprising line position of reciprocating member 121a in the unloading of the semiconductor element unloaded in capsule UP, and on the second reciprocating member 121b, carry out the semiconductor element loading to loading capsule LP.
And, as shown in Figure 3, make if by moving left and right power source 123 that first reciprocating member 121a moves to the left and the second reciprocating member 121b moves to the right, the semiconductor element being completed then being positioned on test jack TS will move the unloading capsule UP to the first reciprocating member 121a after the first pick-up 131A pickup of mobile device 130, and the semiconductor element loading capsule LP being arranged in the second reciprocating member 121b will move to test jack TS after the second pick-up 131B pickup of mobile device 130. While carrying out this process, the first reciprocating member 121a carries out semiconductor element to the loading loading capsule LP, and on the second reciprocating member 121b, carry out unloading the unloading of the semiconductor element in capsule UP.
Loading part 140 for being loaded into the loading capsule of reciprocating member 121a, 121b by semiconductor element to be tested, and uninstalling portion 150 is for unloading the semiconductor element being completed from the unloading capsule of reciprocating member 121a, 121b. Owing to this loading part 140 does not associate with inventive feature with uninstalling portion 150, and being disclosed as various ways, to service the handling of semiconductor element, therefore description is omitted.
Then test cabinet 110 and the relevant composition thereof as feature of present invention is described in more detail.
As shown in Figure 2 and Figure 4, the upper side wall 111 of test cabinet 110 is configured to can rearward slide discretely from left side wall 112 and right side wall 113 or return to front.For this, upper side wall 111 has guide rail bracket 111R, 111L of being formed with the guide rail (R:Rail) extended along the longitudinal direction in side around. And, the rear wall 114 of the test cabinet 110 being positioned on pickup end 131A-1,131B-1 mobile route towards the rear is fixed on upper side wall 111 and together moves to front-rear direction with upper side wall 111, to avoid the rear hindering pick-up 131A, 131B of the mobile device 130 moved together with upper side wall 111 to move. And, the lower end on the rear end of guide rail bracket 111R, 111L has hanging member 111a.
And, left side wall 112 and fixing respectively and be provided with for supporting and the way block B of guiding rail R on right side wall 113.
It addition, the separator 100 according to the present invention also includes clamping device 160R, 160L and bolster 170 and position acknowledging device 180.
Clamping device 160R, 160L are individually fixed in left side wall 112 and right side wall 113 and are formed as paired, and include retaining member 161, cylinder 162 and spring 163.
Retaining member 161 prevents the arbitrariness of upper side wall 111 to be moved rearwards by the caused mounting departing from or releasing hanging member 111a for tangling hanging member 111a, so that upper side wall 111 is capable of being moved rearwards by. At this, as it is shown in figure 5, owing to having inclined plane in the abutment portion of retaining member 161 and aforementioned hanging member 111a, therefore upper side wall 111 forwards can be pressed by retaining member 161 while rising.
Cylinder 162 is used for making retaining member 161 lift, so that retaining member 161 can tangle hanging member 111a or the mounting of releasing and hanging member 111a.
Spring 163 is for the elastomeric element towards upper side wall 111 direction resiliency supported retaining member 161. Therefore, even if causing that air pressure is released from because cylinder 162 is bad, the solution without the arbitrariness of the hanging member 111a depending on retaining member 161 is hung. Further, in order to tackle this situation, retaining member 161 is formed with tool receptacle 161a, makes retaining member 161 decline for insertion into special instrument.
For bolster 170; the available elastomeric element such as spring etc. is provided to the front end of upper side wall 111; for alleviating contingent contact impact when upper side wall 111 rearward moves and return original position, thus protecting pick-up 131A, 131B and lifting drive source 132A, 132B and moving left and right power source 133 etc.
Position acknowledging device 180 is for judging whether the mobile upper side wall 111 to rear returns to origin-location smoothly, and it is made up of light source 181 and light absorbing part 182. Light source 181 is arranged at upper side wall 111 and light absorbing part 182 is fixed on the bottom surface of test cabinet 110, thus can determine whether to have been located in appropriate location for upper side wall 111 when the light that light source 181 irradiates is sensed by light absorbing part 182. Certainly, the position of light source 181 and light absorbing part 182 can be exchanged.
The parts (pickup block of pickup end) with separator 100 configured as described above are replaced operation illustrate.
When changing when needing the specification of semiconductor element of test to occur, the pickup block PB of pickup end 131A-1,131B-1 of pickup semiconductor element is also required to whole replacement.
Therefore, operating personnel should first as shown in Figure 6 a when upper side wall 111 be incorporated into left side wall 112 and right side wall 113 by clamping device 160R, 160L, cylinder 162 is driven and makes retaining member 161 decline, thus upper side wall 111 is easily separated from left side wall 112 and right side wall 113.If cylinder 162 is in malfunction, then by operating personnel, special power tool (not shown) is inserted tool receptacle 161a and make retaining member 161 decline by means of manpower.
And, as shown in Figure 6 b, make upper side wall 111 and rear wall 114 in combination rearward move. Now, the guide rail R of upper side wall 111 obtains support and the guiding of the way block B on left side wall 112 and right side wall 113, and upper side wall 111 rearward slides and moves linearly simultaneously. At this, for the ease of being in the operating personnel (not shown) the being positioned at job position WP work departing from receiving space S, it is preferable that make pickup end 131A-1,131B-1 completely disengage from from receiving space S. Therefore, the movement on the fore-and-aft direction of upper side wall 111 preferably is in making pickup end 131A-1,131B-1 depart from from receiving space S or making to move from receiving space S pickup end 131A-1,131B-1 departed to carry out to the scope of receiving space S origin-location.
Then existing pickup block PB is sloughed as fig. 6 c, then as shown in fig 6d in conjunction with new pickup block (NPB:NewPickerBlock). At this, there are 8 pickup unit P owing to a pickup block being constituted in the lump, when therefore replacing a pickup block PB, 8 pickup unit P will be had to be replaced in the lump.
Finally, cylinder 162 is driven and makes retaining member 161 increase after forwards promoting upper side wall 111 by operating personnel. Thus, rise along with retaining member 161 and make retaining member 161 abut with the inclined plane of hanging member 111a, and the continuation of retaining member 161 rising will make upper side wall 111 forwards pressurized, thus completing and the combination of left side wall 112, right side wall 113.
It addition, operation as above complete after, whether upper side wall 111 is combined as suitable in returning to original position in left side wall 112, right side wall 113 to utilize position acknowledging device 180 to judge.
Additionally, in the present invention 2 reciprocating members 121a, 121b are set on reciprocating apparatus 120 in order to improve processing speed, and be also provided with 2 pick-ups 131A, 131B on device 130 moving, but the difference according to embodiment a, it is also possible to reciprocating member and a pick-up are only set.
As mentioned above, with reference to accompanying drawing, the present invention is illustrated, being the preferred embodiments of the present invention yet with above-described embodiment, therefore must not believe that the present invention is limited only to above-described embodiment, the interest field of the present invention should pass through claims and equivalent concepts is understood.
Claims (9)
1. a semiconductor element test separator, it is characterised in that including:
Test cabinet, has the receiving space housing semiconductor element;
Reciprocating apparatus, moves into the semiconductor element of loading the receiving space of described test cabinet or takes out of from the receiving space of described test cabinet;
Mobile device, moves the semiconductor element being loaded into described reciprocating apparatus the test jack to test machine, or is moved to described reciprocating apparatus from the test jack of test machine by the semiconductor element being completed;
Loading part, is loaded into described reciprocating apparatus by semiconductor element;
Uninstalling portion, unloads semiconductor element from described reciprocating apparatus,
Wherein, the particular wall of described test cabinet can be slided, so that the parts within described receiving space are drawn out to outside described receiving space,
Described particular wall, as the upper side wall of test cabinet, is configured to the left side wall from test cabinet and right side wall comes and goes sliding discretely along the longitudinal direction.
2. semiconductor element test separator as claimed in claim 1, it is characterised in that described mobile device is arranged in described particular wall.
3. semiconductor element test separator as claimed in claim 2, it is characterised in that described mobile device includes:
Pick-up, has for picking up the pickup end being positioned at the semiconductor element within described test cabinet;
Drive source, is used for driving described pick-up,
Wherein, the movement of described particular wall is making described pickup end depart from from described receiving space or make the described pickup end departed from from described receiving space move to carry out to the scope of described receiving space,
And, described pick-up includes at least having one for pickup block that the pickup unit and this pickup unit that pick up semiconductor element are removably combined.
4. semiconductor element test separator as claimed in claim 1, it is characterised in that the sidewall being positioned on the mobile route of described particular wall is fixed on described particular wall and moves together with described particular wall.
5. semiconductor element test separator as claimed in claim 1, it is characterised in that also include the clamping device for clamping described particular wall.
6. semiconductor element test separator as claimed in claim 5, it is characterised in that described clamping device includes:
Retaining member, for preventing the disengaging of described particular wall;
Cylinder, makes described retaining member retreat mobile, thus preventing described particular wall from departing from or releasing anticreep;
Elastomeric element, towards retaining member described in the resiliency supported of described particular wall direction.
7. semiconductor element test separator as claimed in claim 6, it is characterised in that be formed with the tool receptacle for inserting specialist tools in described retaining member.
8. semiconductor element test separator as claimed in claim 1, it is characterised in that also include the bolster of mobile impact for cushioning described particular wall.
9. semiconductor element test separator as claimed in claim 1, it is characterised in that also include the position acknowledging device of position for confirming described particular wall.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120110424A KR101919087B1 (en) | 2012-10-05 | 2012-10-05 | Handler for testing semiconductor |
| KR10-2012-0110424 | 2012-10-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103706576A CN103706576A (en) | 2014-04-09 |
| CN103706576B true CN103706576B (en) | 2016-06-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310455809.9A Active CN103706576B (en) | 2012-10-05 | 2013-09-24 | Semiconductor element test separator |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101919087B1 (en) |
| CN (1) | CN103706576B (en) |
| TW (1) | TWI515814B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102312491B1 (en) * | 2015-08-11 | 2021-10-15 | (주)테크윙 | Handler for testing semiconductor |
| CN105253621A (en) * | 2015-09-21 | 2016-01-20 | 常州长川科技有限公司 | Testing device for sorting machine |
| CN105268651B (en) * | 2015-09-21 | 2018-02-23 | 杭州长川科技股份有限公司 | Integrated circuit separator test device |
| KR102483359B1 (en) * | 2015-12-09 | 2023-01-02 | (주)테크윙 | Handler for testing semiconductor devices and information processing method thereof |
| KR20170078209A (en) * | 2015-12-29 | 2017-07-07 | (주)테크윙 | Handler for testing semiconductor |
| CN105689278B (en) * | 2016-03-28 | 2017-11-21 | 京隆科技(苏州)有限公司 | IC appearance test devices |
| KR101872876B1 (en) * | 2016-10-17 | 2018-07-11 | (주)영우디에스피 | Apparatus for exchanging OLED probe unit |
| WO2019177326A1 (en) * | 2018-03-11 | 2019-09-19 | (주)제이티 | Device inspecting apparatus |
| WO2021006627A1 (en) * | 2019-07-08 | 2021-01-14 | (주)제이티 | Apparatus for inspecting element |
| KR20210043040A (en) | 2019-10-10 | 2021-04-21 | 삼성전자주식회사 | Apparatus for testing semiconductor device |
| CN111921903A (en) * | 2020-08-03 | 2020-11-13 | 扬州实略信息科技有限公司 | Collect in lithium cell production and detect and reject integrative device of NG article |
| KR102518783B1 (en) * | 2022-06-23 | 2023-04-06 | 큐알티 주식회사 | Beam controller capable of adaptive deformation, a test apparatus for semiconductor device using the same, and a test method for semiconductor device using the same |
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| CN1198534A (en) * | 1997-04-04 | 1998-11-11 | 三星电子株式会社 | Picking up and putting on device of mechanic finger system for testing semiconductor device |
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| CN102189082A (en) * | 2010-03-10 | 2011-09-21 | 鸿劲科技股份有限公司 | Electronic component test classifier |
| CN102233334A (en) * | 2010-04-21 | 2011-11-09 | 鸿劲科技股份有限公司 | Test device for electronic component test classifier |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3835271B2 (en) | 2001-12-04 | 2006-10-18 | セイコーエプソン株式会社 | Component detection method, component detection device, IC handler, and IC inspection device |
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2012
- 2012-10-05 KR KR1020120110424A patent/KR101919087B1/en active IP Right Grant
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2013
- 2013-09-24 CN CN201310455809.9A patent/CN103706576B/en active Active
- 2013-09-26 TW TW102134750A patent/TWI515814B/en active
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|---|---|---|---|---|
| CN1198534A (en) * | 1997-04-04 | 1998-11-11 | 三星电子株式会社 | Picking up and putting on device of mechanic finger system for testing semiconductor device |
| JP2002214135A (en) * | 2001-01-17 | 2002-07-31 | Kubota Corp | Internal quality measuring device |
| JP2006337043A (en) * | 2005-05-31 | 2006-12-14 | Mega Trade:Kk | Visual inspection device |
| JP2009219991A (en) * | 2008-03-14 | 2009-10-01 | Shibuya Kogyo Co Ltd | Classifying device |
| CN102189082A (en) * | 2010-03-10 | 2011-09-21 | 鸿劲科技股份有限公司 | Electronic component test classifier |
| CN102233334A (en) * | 2010-04-21 | 2011-11-09 | 鸿劲科技股份有限公司 | Test device for electronic component test classifier |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201415568A (en) | 2014-04-16 |
| KR20140048356A (en) | 2014-04-24 |
| TWI515814B (en) | 2016-01-01 |
| KR101919087B1 (en) | 2018-11-19 |
| CN103706576A (en) | 2014-04-09 |
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