TW201415568A - Handler for testing semiconductor device - Google Patents

Abstract

The present invention discloses a handler for testing semiconductor device to support the testing of a semiconductor device. According to the present invention, the specific walls constituting the testing chamber for receiving the semiconductor devices may slide to allow for more convenience for replacement of parts received inside the testing chamber. Because the parts, such as a pickup terminal, located within the receiving space of the testing chamber may be guided out of the testing chamber as a result of the sliding of specific walls, the replacement operation of corresponding parts becomes easier, so as to save the replacement time and efforts, and also enhance the handler performance.

Description

Semiconductor component test sorter

The present invention relates to a semiconductor element test sorting machine used when testing a semiconductor element.

A semiconductor element test sorting machine (hereinafter referred to as a sorting machine) is a device that classifies a semiconductor element based on a test result after electrically connecting a semiconductor element manufactured by a predetermined manufacturing process to a test machine.

A sorting machine for supporting semiconductor element testing has been disclosed in a number of patent documents such as Korean Laid-Open Patent Publication No. 10-2002-0053406, and Korean Patent No. 10-0866364.

In general, since the use environment of a semiconductor element (for example, a temperature environment) may be various, it is necessary to support the high temperature or low temperature test in addition to the normal temperature test. For this reason, the sorting machine needs to have a chamber that can block the semiconductor element to be tested from the external environment to a certain extent according to the type thereof.

In addition, due to the wide range of use of semiconductor components, a wide variety And due to the development of the integration technology, the size and the like are variable, so that when the semiconductor component to be tested is replaced, it is necessary to replace other components formed in the sorter.

However, since the member housed in the accommodating space inside the room is opened by opening the door and the tool is placed therein, there is interference between the other components, and the replacement work is very cumbersome and demanding. Moreover, this will eventually lead to manpower loss, increased replacement time, and reduced rate of operation of the sorter.

An object of the present invention is to provide a technique for allowing a member located in a housing space of a test chamber to be led out to a housing space of a test chamber while maintaining a state in which a wall surface of a test chamber is formed on the main body side.

In order to achieve the above object, a semiconductor device test sorting machine according to the present invention includes: a test chamber having a housing space for housing the semiconductor element; and a reciprocating device for carrying the loaded semiconductor element into the test chamber. The space is either carried out from the receiving space of the test chamber; the moving device moves the semiconductor component loaded on the reciprocating device to the test socket of the testing machine, or moves the tested semiconductor component from the test socket of the testing machine to the test socket a reciprocating device; a loading portion that loads a semiconductor element on the reciprocating device; and an unloading portion that unloads the semiconductor element from the reciprocating device, wherein a specific wall of the test chamber is slidable.

The moving device is disposed on the specific wall.

The mobile device includes: a picker having a pick-up location a pickup end of the semiconductor element inside the test chamber; a drive source for driving the pickup, wherein the movement of the specific wall is to detach the pickup end from the accommodating space or to make the accommodating space The pickup end of the detachment is moved to the range of the accommodating space, and the pickup includes a pickup block having at least one pickup unit for picking up semiconductor elements and the pickup unit being detachably coupled.

A side wall on the moving path of the specific wall is fixed to the specific wall to move together with the specific wall.

A clamping device for clamping the particular wall may also be included.

The clamping device includes: a retaining member for preventing detachment of the specific wall; and a cylinder for moving the retaining member forward and backward to prevent the specific wall from being detached or released from the detachment; the elastic member facing the The retaining member is elastically supported in a specific wall direction.

A tool jack for inserting a special tool is formed on the retaining member.

A cushioning member for cushioning the moving impact of the specific wall may also be included.

A position confirmation device for confirming the position of the specific wall may also be included.

According to the present invention, since the member (pickup end or the like) located in the accommodating space of the test chamber can be guided to the outside of the test chamber with the sliding of the specific wall, the replacement work of the corresponding member becomes easy, and in the end, it is possible to save the replacement. Time and manpower and improve the efficiency of the sorting machine.

100‧‧‧Semiconductor component test sorter

110‧‧‧Test room

111‧‧‧ upper side wall

114‧‧‧back side wall

111a‧‧‧Hooking parts

111b‧‧‧connection hole

111R, 111L‧‧‧ rail frame

120‧‧‧Reciprocating device

130‧‧‧Mobile devices

131A, 131B‧‧‧ picker

131A-1, 131B-1‧‧‧ Pickup

PB‧‧‧ pick up block

131A-2, 131B-2‧‧‧ connecting frame

132A, 132B‧‧‧ Lift drive source

Moving power source before and after 133‧‧

140‧‧‧Loading Department

150‧‧‧Unloading Department

160L, 160R‧‧‧ clamping device

161‧‧‧Removal parts

161a‧‧‧Tool jack

162‧‧‧ cylinder

170‧‧‧ cushioning parts

180‧‧‧Location confirmation device

H ₁ , H ₂ ‧‧‧ Through Hole

P‧‧‧ picking unit

R‧‧‧rail

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic plan view of a sorting machine in accordance with the present invention.

Fig. 2 is a schematic perspective view of the main part of the sorting machine shown in Fig. 1.

Fig. 3 is a reference diagram for explaining the movement of a semiconductor element in the sorting machine shown in Fig. 1.

4 and 5 are reference diagrams for explaining main parts of the sorting machine shown in Fig. 1.

6a to 6d are reference diagrams for explaining a component replacement operation in the sorting machine according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings, and for the sake of brevity of description, the known or repetitive contents are omitted or briefly described as much as possible. Moreover, all directions in the figure are defined on the basis of FIG.

1 is a schematic plan configuration view of a sorter 100 in accordance with the present invention.

As shown in FIG. 1, a sorting machine 100 according to the present invention includes a test chamber 110, a reciprocating device 120, a moving device 130, a loading portion 140, an unloading portion 150, and the like.

The test chamber 110 has a housing space S for housing a semiconductor element. The test chamber 110 is constructed such that the upper side wall is slidable in the front-rear direction, and the front side wall and the rear side wall are fixed. Details of such a test chamber 110 will be described later.

The reciprocating device 120 is used to carry the semiconductor component into the test chamber 110 The volume S is carried out from the accommodating space S of the test chamber 110. To this end, the reciprocating device 120 has a pair of reciprocating members 121a, 121b and a pair of rails 122a, 122b and a left and right moving power source 123.

Each of the pair of reciprocating members 121a and 121b has eight loading pockets (LP) at the left end and eight unloading bladders (UP) at the right end, and moves in the left-right direction, respectively, and moves in opposite directions in conjunction with each other.

The pair of guide rails 122a, 122b guide the left and right movement of the pair of shuttles 121a, 121b, respectively.

The left and right moving power source 123 supplies a moving force to the pair of reciprocating members 121a, 121b that are linked in opposite directions.

The mobile device 130 is for moving the semiconductor components loaded in the loading capsule LP of the reciprocating members 121a, 121b to the test socket (TS: Test Sockets) of the testing machine, or moving the tested semiconductor components from the test socket TS To the unloading bladder UP of the shuttles 121a, 121b. To this end, as shown in FIG. 2, the mobile device 130 is supported on the upper side wall 111 constituting the test chamber 110, and includes a pair of pickups 131A, 131B and a pair of lifting drive sources 132A, 132B and front and rear moving power. Source 133.

The pair of pickups 131A, 131B are arranged side by side in the front-rear direction, and are constituted by the pickup ends 131A-1, 131B-1 and the connection frames 131A-2, 131B-2, respectively.

The pickup ends 131A-1, 131B-1 have pick-up blocks (PB: Picker Blocks) for picking up or unpicking semiconductor elements from the loading pockets of the reciprocating members 121a, 121b, and are located at the connecting frames 131A-2, 131B-2. Lower end. For reference, in the present embodiment, on one pickup block PB, eight pickup units (p: Picker) for picking up eight semiconductor elements are combined as one component. And detachably coupled, thereby constituting the pickup ends 131A-1, 131B-1.

The connecting brackets 131A-2 and 131B-2 connect the pickup ends 131A-1 and 131B-1 to the elevation drive sources 132A and 132B. Therefore, the lifting operation of the pickup ends 131A-1, 131B-1 is performed by the operation of the elevation drive sources 132A, 132B.

The pair of lifting drive sources 132A, 132B are coupled to each other, and the pickers 131A, 131B connected to themselves are respectively moved up and down. By the operation of the elevation drive sources 132A, 132B, the pickup ends 131A-1, 131B-1 can be lowered to pick up the semiconductor element from the reciprocating members 121a, 121b located below or to remove the pickup position, or can be lowered to the lower position. The test socket supplies the semiconductor component while being capable of applying a position to form an appropriate electrical connection between the picked-up semiconductor component and the test socket. For reference, for convenience of explanation, the first pickup end 131A-1 in the front direction in FIG. 2 is shown as being raised, and the second pickup end 131B-1 in the rear is shown as being lowered. Further, the test socket TS is an element constituting a testing machine (not shown) and is not an element constituting the sorting machine 100. However, for convenience of explanation, it is indicated by a broken line in FIG.

The front-rear moving power source 133 moves the pair of lifting drive sources 132A and 132B that are coupled to each other in the forward and backward directions. Therefore, by the operation of the front-rear moving power source 133, the pickup ends 131A-1, 131B-1 connected to the pair of lift driving sources 132A, 132B also move in the front-rear direction.

Fig. 2 shows a state in which the upper side wall 111 is moved rearward, and a portion indicated by a broken line is a right side wall 113 and a rear side wall 114 constituting the test chamber. Further, the symbols H ₁ and H ₂ are not illustrated as the through holes through which the reciprocating members 121a and 121b can pass. The accommodating space S can be exposed to the outside through the through holes H ₁ and H ₂ , but can be provided by providing a shielding plate (not shown) at the intermediate portion of the reciprocating members 121 a and 121 b or the through holes H ₁ and H _{2 .} The extent to which the containment space is exposed to the outside is minimized, and the baffle can be realized with a flexible material that can be bent.

Further, as partially disclosed in FIG. 2, the upper side wall 111 of the test chamber 110 is formed with a connecting hole 111b extending in the front-rear direction for the pickup ends 131A-1, 131B located inside the test chamber 110 (receiving space). 1 is connected to the elevation drive sources 132A, 132B outside the test chamber 110 through the connection brackets 131A-2, 131B-2, and at the same time, the pickups 131A, 131B can be moved in the front-rear direction. According to different embodiments, a separate plate (not shown) may be disposed at the upper ends of the connecting frames 131A-2 and 131B-2 so as to be extended when the connecting frames 131A-2 and 131B-2 are moved. The extent to which the connection holes are exposed to the outside is minimized.

For reference, as shown in FIG. 1, in a state where the front first reciprocating member 121a is moved to the right side and the rear second reciprocating member 121b is moved to the left side, the semiconductor element located in the loading pocket LP of the first reciprocating member 121a is The first pickup 131A of the mobile device 130 moves to the test socket TS after picking up, and the tested semiconductor element is picked up by the second pickup 131B of the mobile device 130 and then moved to the unloading bag UP of the second shuttle 131b. While this process is being performed, the unloading of the semiconductor element located in the unloading bladder UP is performed on the first reciprocating member 121a, and the loading of the semiconductor element into the loading pocket LP is performed on the second reciprocating member 121b.

Moreover, as shown in FIG. 3, if the first reciprocating member 121a is moved to the left side by the left and right moving power source 123 and the second reciprocating member 121b is moved to the right side, the tested semiconductor component on the test socket TS will be After being picked up by the first picker 131A of the mobile device 130, it is moved to the first shuttle 121a The unloading bladder UP, while the semiconductor component located in the loading pocket LP of the second shuttle 121b will be picked up by the second picker 131B of the mobile device 130 and then moved to the test socket TS. While this process is being performed, the loading of the semiconductor element to the loading pocket LP is performed on the first reciprocating member 121a, and the unloading of the semiconductor element in the unloading pouch UP is performed on the second reciprocating member 121b.

The loading portion 140 is used to load the semiconductor component to be tested on the reciprocating The loading pockets of the pieces 121a, 121b, and the unloading portion 150 are used to unload the tested semiconductor components from the unloading bladders of the shuttles 121a, 121b. Since the loading portion 140 and the unloading portion 150 are not related to the features of the present invention and have been disclosed in various forms to serve the loading and unloading of the semiconductor element, detailed description thereof will be omitted.

The test chamber 110, which is a feature of the present invention, and its related components will be described in more detail.

As shown in FIGS. 2 and 4, the upper side wall 111 of the test chamber 110 is configured to be slidable rearward or back to the front from the left side wall 112 and the right side wall 113. To this end, the upper side wall 111 has rail frames 111R and 111L formed with rails (R: Rail) extending in the front-rear direction on the left and right sides thereof. Further, the rear side wall 114 of the test chamber 110 on the moving path of the pickup end 131A-1, 131B-1 toward the rear is fixed to the upper side wall 111 and moves together with the upper side wall 111 in the front-rear direction to avoid obstruction with the upper side wall 111. The pickups 131A, 131B of the moving mobile device 130 move rearward. Further, the lower end of the rear end of the rail frames 111R, 111L has a hooking member 111a.

Further, the left side wall 112 and the right side wall 113 are respectively fixed and provided with a rail block B for supporting and guiding the guide rail R.

In addition, the sorting machine 100 according to the present invention further includes a gripping device 160R , 160L and buffer 170 and position confirmation device 180.

The clamping devices 160R, 160L are fixed to the left side wall 112 and the right side wall 113, respectively, and formed in pairs, and include a retaining member 161, a cylinder 162, and a spring 163.

The retaining member 161 is for catching the hooking member 111a to prevent the detachment of the upper side wall 111 from being detached or to release the hooking of the hooking member 111a, thereby enabling the upper side wall 111 to move rearward. Here, as shown in FIG. 5, since the contact portion of the retaining member 161 and the hooking member 111a has an inclined surface, the retaining member 161 can press the upper side wall 111 forward while raising.

The air cylinder 162 is for raising and lowering the retaining member 161, so that the retaining member 161 can catch the hooking member 111a or release the hooking with the hooking member 111a.

The spring 163 is an elastic member for elastically supporting the retaining member 161 in the direction toward the upper side wall 111. Therefore, even if the air pressure is released due to the failure of the air cylinder 162, the undue suspension depending on the hooking member 111a of the retaining member 161 does not occur. Further, in order to cope with such a situation, the retaining member 161 is formed with a tool insertion hole 161a for inserting a special tool to lower the retaining member 161.

For the cushioning member 170, an elastic member such as a spring or the like can be provided on the front end of the upper side wall 111 for relieving the contact shock which may occur when the upper side wall 111 moves rearward and returns to the original position, thereby protecting the pickup 131A, 131B and lifting drive sources 132A, 132B, left and right moving power source 133, and the like.

The position confirming device 180 is for determining whether or not the upper side wall 111 moved to the rear is smoothly returned to the original position, and is constituted by the light source 181 and the light receiving unit 182. The light source 181 is disposed on the upper sidewall 111 and the light receiving portion 182 is fixed to the bottom surface of the test chamber 110. Therefore, when the light irradiated by the light source 181 is sensed by the light receiving portion 182, it can be determined that the upper side wall 111 is already in the proper position. Of course, the positions of the light source 181 and the light receiving portion 182 can be reversed.

The replacement operation of the component (pickup block of the pickup end) having the sorter 100 configured as described above will be described.

When the specification of the semiconductor element to be tested is changed, the pickup block PB of the pickup terminals 131A-1, 131B-1 for picking up the semiconductor element also needs to be completely replaced.

Therefore, the operator should first drive the cylinder 162 to lower the retaining member 161 in a state where the upper side wall 111 is coupled to the left side wall 112 and the right side wall 113 by the clamping devices 160R, 160L as shown in FIG. 6a, thereby The upper side wall 111 is separated from the left side wall 112 and the right side wall 113. If the cylinder 162 is in a failure state, a special working tool (not shown) is inserted into the tool insertion hole 161a by the operator to lower the retaining member 161 by human power.

Further, as shown in Fig. 6b, the upper side wall 111 and the rear side wall 114 coupled thereto are moved rearward. At this time, the guide rail R of the upper side wall 111 is supported and guided by the guide rail block B on the left side wall 112 and the right side wall 113, while the upper side wall 111 slides rearward to linearly move. Here, in order to facilitate the operation of an operator (not shown) located at the work position WP from the accommodating space S, it is preferable to completely detach the pickup ends 131A-1 and 131B-1 from the accommodating space S. Therefore, the movement of the upper side wall 111 in the front-rear direction is preferably such that the pickup ends 131A-1 and 131B-1 are detached from the accommodating space S or the pickup ends 131A-1 and 131B-1 detached from the accommodating space S are moved to the accommodating position. The space S is performed within the range of the original position.

Then, as shown in FIG. 6c, the existing pickup block PB is removed, and then as shown in FIG. 6d. The new pickup block (NPB: New Picker Block) is shown. Here, since eight pickup units P are formed together on one pickup block, eight pickup units P are replaced together when one pickup block PB is replaced.

Finally, the operator pushes the upper side wall 111 forward and then the cylinder 162 is driven to raise the retaining member 161. As a result, as the retaining member 161 rises, the retaining member 161 abuts against the inclined surface of the hooking member 111a, and the continued rise of the retaining member 161 causes the upper side wall 111 to be pressed forward, thereby completing the left side wall. 112, the combination of the right side wall 113.

In addition, after the above-mentioned work is completed, the position confirmation is used. The setting 180 determines whether the upper side wall 111 is properly coupled to the left side wall 112 and the right side wall 113 to return to the original position.

In addition, in the present invention, in order to increase the processing speed, the reciprocating device Two reciprocating members 121a, 121b are provided on the 120, and two pickups 131A, 131B are also provided on the moving device 130. However, depending on the embodiment, only one reciprocating member and one pickup may be provided.

As described above, the present invention has been specifically described with reference to the drawings, but since the above-described embodiments are merely preferred embodiments of the present invention, the present invention is not limited to the above embodiments, and the scope of the present invention should be applied for. Scope and its equal concept understanding.

111‧‧‧ upper side wall

111a‧‧‧Hooking parts

111b‧‧‧connection hole

111R, 111L‧‧‧ rail frame

113‧‧‧ right wall

114‧‧‧back side wall

131A, 131B‧‧‧ picker

131A-1, 131B-1‧‧‧ Pickup

PB‧‧‧ pick up block

131A-2, 131B-2‧‧‧ connecting frame

132A, 132B‧‧‧ Lift drive source

Moving power source before and after 133‧‧

160L, 160R‧‧‧ clamping device

161‧‧‧Removal parts

161a‧‧‧Tool jack

162‧‧‧ cylinder

170‧‧‧ cushioning parts

H ₁ , H ₂ ‧‧‧ Through Hole

P‧‧‧ picking unit

R‧‧‧rail

Claims (9)

A semiconductor component testing sorting machine, comprising: a test chamber having a receiving space for accommodating a semiconductor element; and a reciprocating device for carrying the loaded semiconductor component into a receiving space of the test chamber or receiving from the test chamber Moving out the mobile device, moving the semiconductor component loaded on the reciprocating device to the test socket of the testing machine, or moving the tested semiconductor component from the test socket of the testing machine to the reciprocating device; loading portion, the semiconductor component Loading on the reciprocating device; unloading portion, unloading the semiconductor component from the reciprocating device, wherein a specific wall of the test chamber is slidable. The semiconductor component test sorting machine according to claim 1, wherein the moving device is disposed on the specific wall. The semiconductor component test sorting machine according to claim 2, wherein the moving device comprises: a pickup having a pick-up end for picking up a semiconductor element located inside the test chamber; and a drive source for Driving the pickup, wherein the movement of the specific wall is performed within a range in which the pickup end is detached from the accommodating space or the pickup end detached from the accommodating space is moved to the accommodating space And, the pickup includes a pickup block having at least one pickup unit for picking up semiconductor elements and the pickup unit being detachably coupled. A semiconductor component test sorting machine according to claim 1, characterized in that A side wall on the moving path of the specific wall is fixed to the specific wall to move together with the specific wall. The semiconductor component testing sorting machine according to claim 1, characterized by further comprising gripping means for clamping said specific wall. The semiconductor component testing sorting machine according to claim 5, wherein the holding device comprises: a retaining member for preventing detachment of the specific wall; and a cylinder for moving the retaining member forward and backward Thereby preventing the specific wall from being detached or releasing the detachment; the elastic member elastically supporting the detachment preventing member toward the specific wall direction. The semiconductor component testing sorting machine according to claim 6, wherein the retaining member is formed with a tool insertion hole for inserting a special tool. The semiconductor component test sorting machine according to claim 1, characterized by further comprising a buffer member for buffering a moving impact of said specific wall. A semiconductor component testing sorting machine according to claim 1, further comprising position confirming means for confirming a position of said specific wall.