CN103702798A - 研磨头、研磨装置及工件的研磨方法 - Google Patents

研磨头、研磨装置及工件的研磨方法 Download PDF

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Publication number
CN103702798A
CN103702798A CN201280029952.5A CN201280029952A CN103702798A CN 103702798 A CN103702798 A CN 103702798A CN 201280029952 A CN201280029952 A CN 201280029952A CN 103702798 A CN103702798 A CN 103702798A
Authority
CN
China
Prior art keywords
workpiece
shape
grinding
polishing
sealed space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280029952.5A
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English (en)
Chinese (zh)
Inventor
桝村寿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of CN103702798A publication Critical patent/CN103702798A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/10—Auxiliary devices, e.g. bolsters, extension members
    • B23Q3/106—Auxiliary devices, e.g. bolsters, extension members extendable members, e.g. extension members
    • B23Q3/107—Auxiliary devices, e.g. bolsters, extension members extendable members, e.g. extension members with positive adjustment means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201280029952.5A 2011-06-21 2012-05-28 研磨头、研磨装置及工件的研磨方法 Pending CN103702798A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011137789A JP2013004928A (ja) 2011-06-21 2011-06-21 研磨ヘッド、研磨装置及びワークの研磨方法
JP2011-137789 2011-06-21
PCT/JP2012/003454 WO2012176376A1 (ja) 2011-06-21 2012-05-28 研磨ヘッド、研磨装置及びワークの研磨方法

Publications (1)

Publication Number Publication Date
CN103702798A true CN103702798A (zh) 2014-04-02

Family

ID=47422242

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280029952.5A Pending CN103702798A (zh) 2011-06-21 2012-05-28 研磨头、研磨装置及工件的研磨方法

Country Status (8)

Country Link
US (1) US20140101925A1 (https=)
JP (1) JP2013004928A (https=)
KR (1) KR20140048887A (https=)
CN (1) CN103702798A (https=)
DE (1) DE112012002411T5 (https=)
SG (1) SG194964A1 (https=)
TW (1) TW201321130A (https=)
WO (1) WO2012176376A1 (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104282545A (zh) * 2014-10-15 2015-01-14 易德福 一种晶片研磨方法
CN107206568A (zh) * 2015-01-06 2017-09-26 智能分离有限公司 装置和方法
CN108290269A (zh) * 2015-11-06 2018-07-17 信越半导体株式会社 晶圆的研磨方法及研磨装置
CN109015115A (zh) * 2017-06-12 2018-12-18 信越半导体株式会社 研磨方法及研磨装置
CN111390750A (zh) * 2020-03-25 2020-07-10 福建北电新材料科技有限公司 晶片面型加工装置
CN111434458A (zh) * 2019-01-11 2020-07-21 株式会社 V 技术 研磨头及研磨装置
CN118528086A (zh) * 2024-07-29 2024-08-23 万向钱潮股份公司 一种轴承双端面加工方法及系统

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101596561B1 (ko) * 2014-01-02 2016-03-07 주식회사 엘지실트론 웨이퍼 연마 장치
US9566687B2 (en) * 2014-10-13 2017-02-14 Sunedison Semiconductor Limited (Uen201334164H) Center flex single side polishing head having recess and cap
JP6508123B2 (ja) * 2016-05-13 2019-05-08 信越半導体株式会社 テンプレートアセンブリの選別方法及びワークの研磨方法並びにテンプレートアセンブリ
JP7363978B1 (ja) * 2022-07-04 2023-10-18 株式会社Sumco ウェーハ研磨条件の決定方法、ウェーハの製造方法およびウェーハ片面研磨システム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0970750A (ja) * 1995-09-07 1997-03-18 Sony Corp 基板研磨装置
TW425627B (en) * 1998-10-30 2001-03-11 Shinetsu Handotai Kk Polishing work holding board and production method thereof and work polishing method and device
CN1665639A (zh) * 2002-06-28 2005-09-07 兰姆研究有限公司 局部膜片携载头
CN1815696A (zh) * 2005-02-02 2006-08-09 联华电子股份有限公司 化学机械研磨方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000198069A (ja) * 1998-10-30 2000-07-18 Shin Etsu Handotai Co Ltd 研磨用ワ―ク保持盤およびその製造方法ならびにワ―クの研磨方法および研磨装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0970750A (ja) * 1995-09-07 1997-03-18 Sony Corp 基板研磨装置
TW425627B (en) * 1998-10-30 2001-03-11 Shinetsu Handotai Kk Polishing work holding board and production method thereof and work polishing method and device
CN1665639A (zh) * 2002-06-28 2005-09-07 兰姆研究有限公司 局部膜片携载头
CN1815696A (zh) * 2005-02-02 2006-08-09 联华电子股份有限公司 化学机械研磨方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104282545A (zh) * 2014-10-15 2015-01-14 易德福 一种晶片研磨方法
CN107206568A (zh) * 2015-01-06 2017-09-26 智能分离有限公司 装置和方法
CN107206568B (zh) * 2015-01-06 2019-12-06 智能分离有限公司 装置和方法
CN108290269A (zh) * 2015-11-06 2018-07-17 信越半导体株式会社 晶圆的研磨方法及研磨装置
CN108290269B (zh) * 2015-11-06 2020-04-24 信越半导体株式会社 晶圆的研磨方法及研磨装置
CN109015115A (zh) * 2017-06-12 2018-12-18 信越半导体株式会社 研磨方法及研磨装置
CN109015115B (zh) * 2017-06-12 2021-08-31 信越半导体株式会社 研磨方法及研磨装置
CN111434458A (zh) * 2019-01-11 2020-07-21 株式会社 V 技术 研磨头及研磨装置
CN111390750A (zh) * 2020-03-25 2020-07-10 福建北电新材料科技有限公司 晶片面型加工装置
CN111390750B (zh) * 2020-03-25 2021-09-03 福建北电新材料科技有限公司 晶片面型加工装置
CN118528086A (zh) * 2024-07-29 2024-08-23 万向钱潮股份公司 一种轴承双端面加工方法及系统
CN118528086B (zh) * 2024-07-29 2024-09-17 万向钱潮股份公司 一种轴承双端面加工方法及系统

Also Published As

Publication number Publication date
JP2013004928A (ja) 2013-01-07
KR20140048887A (ko) 2014-04-24
WO2012176376A1 (ja) 2012-12-27
US20140101925A1 (en) 2014-04-17
TW201321130A (zh) 2013-06-01
SG194964A1 (en) 2013-12-30
DE112012002411T5 (de) 2014-04-30

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Application publication date: 20140402