KR20140048887A - 연마헤드, 연마장치 및 워크의 연마방법 - Google Patents

연마헤드, 연마장치 및 워크의 연마방법 Download PDF

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Publication number
KR20140048887A
KR20140048887A KR1020137033820A KR20137033820A KR20140048887A KR 20140048887 A KR20140048887 A KR 20140048887A KR 1020137033820 A KR1020137033820 A KR 1020137033820A KR 20137033820 A KR20137033820 A KR 20137033820A KR 20140048887 A KR20140048887 A KR 20140048887A
Authority
KR
South Korea
Prior art keywords
polishing
workpiece
shape
work
holding plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020137033820A
Other languages
English (en)
Korean (ko)
Inventor
히사시 마스무라
Original Assignee
신에쯔 한도타이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에쯔 한도타이 가부시키가이샤 filed Critical 신에쯔 한도타이 가부시키가이샤
Publication of KR20140048887A publication Critical patent/KR20140048887A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/10—Auxiliary devices, e.g. bolsters, extension members
    • B23Q3/106—Auxiliary devices, e.g. bolsters, extension members extendable members, e.g. extension members
    • B23Q3/107—Auxiliary devices, e.g. bolsters, extension members extendable members, e.g. extension members with positive adjustment means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020137033820A 2011-06-21 2012-05-28 연마헤드, 연마장치 및 워크의 연마방법 Withdrawn KR20140048887A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011137789A JP2013004928A (ja) 2011-06-21 2011-06-21 研磨ヘッド、研磨装置及びワークの研磨方法
JPJP-P-2011-137789 2011-06-21
PCT/JP2012/003454 WO2012176376A1 (ja) 2011-06-21 2012-05-28 研磨ヘッド、研磨装置及びワークの研磨方法

Publications (1)

Publication Number Publication Date
KR20140048887A true KR20140048887A (ko) 2014-04-24

Family

ID=47422242

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137033820A Withdrawn KR20140048887A (ko) 2011-06-21 2012-05-28 연마헤드, 연마장치 및 워크의 연마방법

Country Status (8)

Country Link
US (1) US20140101925A1 (https=)
JP (1) JP2013004928A (https=)
KR (1) KR20140048887A (https=)
CN (1) CN103702798A (https=)
DE (1) DE112012002411T5 (https=)
SG (1) SG194964A1 (https=)
TW (1) TW201321130A (https=)
WO (1) WO2012176376A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101596561B1 (ko) * 2014-01-02 2016-03-07 주식회사 엘지실트론 웨이퍼 연마 장치
US9566687B2 (en) * 2014-10-13 2017-02-14 Sunedison Semiconductor Limited (Uen201334164H) Center flex single side polishing head having recess and cap
CN104282545A (zh) * 2014-10-15 2015-01-14 易德福 一种晶片研磨方法
GB2534130B (en) * 2015-01-06 2018-12-19 Smart Separations Ltd Apparatus and methods
JP6394569B2 (ja) * 2015-11-06 2018-09-26 信越半導体株式会社 ウェーハの研磨方法及び研磨装置
JP6508123B2 (ja) * 2016-05-13 2019-05-08 信越半導体株式会社 テンプレートアセンブリの選別方法及びワークの研磨方法並びにテンプレートアセンブリ
JP6312229B1 (ja) * 2017-06-12 2018-04-18 信越半導体株式会社 研磨方法及び研磨装置
CN111434458A (zh) * 2019-01-11 2020-07-21 株式会社 V 技术 研磨头及研磨装置
CN111390750B (zh) * 2020-03-25 2021-09-03 福建北电新材料科技有限公司 晶片面型加工装置
JP7363978B1 (ja) * 2022-07-04 2023-10-18 株式会社Sumco ウェーハ研磨条件の決定方法、ウェーハの製造方法およびウェーハ片面研磨システム
CN118528086B (zh) * 2024-07-29 2024-09-17 万向钱潮股份公司 一种轴承双端面加工方法及系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0970750A (ja) * 1995-09-07 1997-03-18 Sony Corp 基板研磨装置
JP2000198069A (ja) * 1998-10-30 2000-07-18 Shin Etsu Handotai Co Ltd 研磨用ワ―ク保持盤およびその製造方法ならびにワ―クの研磨方法および研磨装置
WO2000025981A1 (en) * 1998-10-30 2000-05-11 Shin-Etsu Handotai Co., Ltd. Unpolished work holding board and production method thereof and work polishing method and device
US6758726B2 (en) * 2002-06-28 2004-07-06 Lam Research Corporation Partial-membrane carrier head
CN100468646C (zh) * 2005-02-02 2009-03-11 联华电子股份有限公司 化学机械研磨方法

Also Published As

Publication number Publication date
JP2013004928A (ja) 2013-01-07
CN103702798A (zh) 2014-04-02
WO2012176376A1 (ja) 2012-12-27
US20140101925A1 (en) 2014-04-17
TW201321130A (zh) 2013-06-01
SG194964A1 (en) 2013-12-30
DE112012002411T5 (de) 2014-04-30

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