JP2013004928A - 研磨ヘッド、研磨装置及びワークの研磨方法 - Google Patents

研磨ヘッド、研磨装置及びワークの研磨方法 Download PDF

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Publication number
JP2013004928A
JP2013004928A JP2011137789A JP2011137789A JP2013004928A JP 2013004928 A JP2013004928 A JP 2013004928A JP 2011137789 A JP2011137789 A JP 2011137789A JP 2011137789 A JP2011137789 A JP 2011137789A JP 2013004928 A JP2013004928 A JP 2013004928A
Authority
JP
Japan
Prior art keywords
polishing
workpiece
shape
holding plate
polishing head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011137789A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013004928A5 (https=
Inventor
Hisashi Masumura
寿 桝村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Priority to JP2011137789A priority Critical patent/JP2013004928A/ja
Priority to US14/117,566 priority patent/US20140101925A1/en
Priority to DE112012002411.7T priority patent/DE112012002411T5/de
Priority to PCT/JP2012/003454 priority patent/WO2012176376A1/ja
Priority to SG2013084462A priority patent/SG194964A1/en
Priority to CN201280029952.5A priority patent/CN103702798A/zh
Priority to KR1020137033820A priority patent/KR20140048887A/ko
Priority to TW101121349A priority patent/TW201321130A/zh
Publication of JP2013004928A publication Critical patent/JP2013004928A/ja
Publication of JP2013004928A5 publication Critical patent/JP2013004928A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/10—Auxiliary devices, e.g. bolsters, extension members
    • B23Q3/106—Auxiliary devices, e.g. bolsters, extension members extendable members, e.g. extension members
    • B23Q3/107—Auxiliary devices, e.g. bolsters, extension members extendable members, e.g. extension members with positive adjustment means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2011137789A 2011-06-21 2011-06-21 研磨ヘッド、研磨装置及びワークの研磨方法 Pending JP2013004928A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2011137789A JP2013004928A (ja) 2011-06-21 2011-06-21 研磨ヘッド、研磨装置及びワークの研磨方法
US14/117,566 US20140101925A1 (en) 2011-06-21 2012-05-28 Polishing head, polishing apparatus, and method for polishing workpiece
DE112012002411.7T DE112012002411T5 (de) 2011-06-21 2012-05-28 Polierkopf, Poliervorrichtung und Verfahren zum Polieren eines Werkstücks
PCT/JP2012/003454 WO2012176376A1 (ja) 2011-06-21 2012-05-28 研磨ヘッド、研磨装置及びワークの研磨方法
SG2013084462A SG194964A1 (en) 2011-06-21 2012-05-28 Polishing head, polishing apparatus, and method for polishing workpiece
CN201280029952.5A CN103702798A (zh) 2011-06-21 2012-05-28 研磨头、研磨装置及工件的研磨方法
KR1020137033820A KR20140048887A (ko) 2011-06-21 2012-05-28 연마헤드, 연마장치 및 워크의 연마방법
TW101121349A TW201321130A (zh) 2011-06-21 2012-06-14 研磨頭、研磨裝置及工件的研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011137789A JP2013004928A (ja) 2011-06-21 2011-06-21 研磨ヘッド、研磨装置及びワークの研磨方法

Publications (2)

Publication Number Publication Date
JP2013004928A true JP2013004928A (ja) 2013-01-07
JP2013004928A5 JP2013004928A5 (https=) 2014-01-09

Family

ID=47422242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011137789A Pending JP2013004928A (ja) 2011-06-21 2011-06-21 研磨ヘッド、研磨装置及びワークの研磨方法

Country Status (8)

Country Link
US (1) US20140101925A1 (https=)
JP (1) JP2013004928A (https=)
KR (1) KR20140048887A (https=)
CN (1) CN103702798A (https=)
DE (1) DE112012002411T5 (https=)
SG (1) SG194964A1 (https=)
TW (1) TW201321130A (https=)
WO (1) WO2012176376A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150080696A (ko) * 2014-01-02 2015-07-10 주식회사 엘지실트론 웨이퍼 연마 장치
JP2019153801A (ja) * 2014-10-13 2019-09-12 サンエディソン・セミコンダクター・リミテッドＳｕｎＥｄｉｓｏｎ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｌｉｍｉｔｅｄ 凹所およびキャップを有する、中心部が可撓性の片面研磨ヘッド
JP7363978B1 (ja) 2022-07-04 2023-10-18 株式会社Sumco ウェーハ研磨条件の決定方法、ウェーハの製造方法およびウェーハ片面研磨システム

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104282545A (zh) * 2014-10-15 2015-01-14 易德福 一种晶片研磨方法
GB2534130B (en) * 2015-01-06 2018-12-19 Smart Separations Ltd Apparatus and methods
JP6394569B2 (ja) * 2015-11-06 2018-09-26 信越半導体株式会社 ウェーハの研磨方法及び研磨装置
JP6508123B2 (ja) * 2016-05-13 2019-05-08 信越半導体株式会社 テンプレートアセンブリの選別方法及びワークの研磨方法並びにテンプレートアセンブリ
JP6312229B1 (ja) * 2017-06-12 2018-04-18 信越半導体株式会社 研磨方法及び研磨装置
CN111434458A (zh) * 2019-01-11 2020-07-21 株式会社 V 技术 研磨头及研磨装置
CN111390750B (zh) * 2020-03-25 2021-09-03 福建北电新材料科技有限公司 晶片面型加工装置
CN118528086B (zh) * 2024-07-29 2024-09-17 万向钱潮股份公司 一种轴承双端面加工方法及系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0970750A (ja) * 1995-09-07 1997-03-18 Sony Corp 基板研磨装置
JP2000198069A (ja) * 1998-10-30 2000-07-18 Shin Etsu Handotai Co Ltd 研磨用ワ―ク保持盤およびその製造方法ならびにワ―クの研磨方法および研磨装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000025981A1 (en) * 1998-10-30 2000-05-11 Shin-Etsu Handotai Co., Ltd. Unpolished work holding board and production method thereof and work polishing method and device
US6758726B2 (en) * 2002-06-28 2004-07-06 Lam Research Corporation Partial-membrane carrier head
CN100468646C (zh) * 2005-02-02 2009-03-11 联华电子股份有限公司 化学机械研磨方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0970750A (ja) * 1995-09-07 1997-03-18 Sony Corp 基板研磨装置
JP2000198069A (ja) * 1998-10-30 2000-07-18 Shin Etsu Handotai Co Ltd 研磨用ワ―ク保持盤およびその製造方法ならびにワ―クの研磨方法および研磨装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150080696A (ko) * 2014-01-02 2015-07-10 주식회사 엘지실트론 웨이퍼 연마 장치
KR101596561B1 (ko) 2014-01-02 2016-03-07 주식회사 엘지실트론 웨이퍼 연마 장치
JP2019153801A (ja) * 2014-10-13 2019-09-12 サンエディソン・セミコンダクター・リミテッドＳｕｎＥｄｉｓｏｎ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｌｉｍｉｔｅｄ 凹所およびキャップを有する、中心部が可撓性の片面研磨ヘッド
JP2021044561A (ja) * 2014-10-13 2021-03-18 グローバルウェーハズ カンパニー リミテッドＧｌｏｂａｌＷａｆｅｒｓ Ｃｏ．，Ｌｔｄ． 凹所およびキャップを有する、中心部が可撓性の片面研磨ヘッド
JP7239539B2 (ja) 2014-10-13 2023-03-14 グローバルウェーハズ カンパニー リミテッド 凹所およびキャップを有する、中心部が可撓性の片面研磨ヘッド
JP7363978B1 (ja) 2022-07-04 2023-10-18 株式会社Sumco ウェーハ研磨条件の決定方法、ウェーハの製造方法およびウェーハ片面研磨システム
WO2024009580A1 (ja) * 2022-07-04 2024-01-11 株式会社Sumco ウェーハ研磨条件の決定方法、ウェーハの製造方法およびウェーハ片面研磨システム
JP2024006625A (ja) * 2022-07-04 2024-01-17 株式会社Sumco ウェーハ研磨条件の決定方法、ウェーハの製造方法およびウェーハ片面研磨システム

Also Published As

Publication number Publication date
CN103702798A (zh) 2014-04-02
KR20140048887A (ko) 2014-04-24
WO2012176376A1 (ja) 2012-12-27
US20140101925A1 (en) 2014-04-17
TW201321130A (zh) 2013-06-01
SG194964A1 (en) 2013-12-30
DE112012002411T5 (de) 2014-04-30

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