CN103663348A - 电子装置 - Google Patents

电子装置 Download PDF

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Publication number
CN103663348A
CN103663348A CN201310397636.XA CN201310397636A CN103663348A CN 103663348 A CN103663348 A CN 103663348A CN 201310397636 A CN201310397636 A CN 201310397636A CN 103663348 A CN103663348 A CN 103663348A
Authority
CN
China
Prior art keywords
electronic installation
chip
semiconductor chip
mems
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310397636.XA
Other languages
English (en)
Chinese (zh)
Inventor
渡边贤哉
奥山规生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN103663348A publication Critical patent/CN103663348A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00238—Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H10W40/613—Bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
    • B81C2203/0792—Forming interconnections between the electronic processing unit and the micromechanical structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
CN201310397636.XA 2012-09-14 2013-09-04 电子装置 Pending CN103663348A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-202374 2012-09-14
JP2012202374A JP2014054718A (ja) 2012-09-14 2012-09-14 電子装置

Publications (1)

Publication Number Publication Date
CN103663348A true CN103663348A (zh) 2014-03-26

Family

ID=50273639

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310397636.XA Pending CN103663348A (zh) 2012-09-14 2013-09-04 电子装置

Country Status (3)

Country Link
US (1) US9437584B2 (https=)
JP (1) JP2014054718A (https=)
CN (1) CN103663348A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014221546A1 (de) * 2014-10-23 2016-04-28 Robert Bosch Gmbh Mikroelektronische Bauelementanordnung mit einer Mehrzahl von Substraten und entsprechendes Herstellungsverfahren
KR101720300B1 (ko) * 2015-07-21 2017-03-28 주식회사 오킨스전자 접촉성이 개선된 범프를 포함하는 테스트 소켓용 ｍｅｍｓ 필름
KR102534734B1 (ko) * 2018-09-03 2023-05-19 삼성전자 주식회사 반도체 패키지
JP7497604B2 (ja) * 2020-04-10 2024-06-11 セイコーエプソン株式会社 振動デバイス、電子機器および移動体

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005153067A (ja) * 2003-11-25 2005-06-16 Kyocera Corp 電子部品封止用基板およびそれを用いた電子装置の製造方法
JP2005335022A (ja) * 2004-05-28 2005-12-08 Sony Corp 微小デバイス及び電子機器
JP4688526B2 (ja) * 2005-03-03 2011-05-25 Ｏｋｉセミコンダクタ株式会社 半導体装置及びその製造方法
US7297574B2 (en) * 2005-06-17 2007-11-20 Infineon Technologies Ag Multi-chip device and method for producing a multi-chip device
WO2007147137A2 (en) 2006-06-15 2007-12-21 Sitime Corporation Stacked die package for mems resonator system
KR100807050B1 (ko) * 2006-08-23 2008-02-25 동부일렉트로닉스 주식회사 반도체 소자 및 그 제조방법
JP5276289B2 (ja) 2006-08-25 2013-08-28 アイメック 高アスペクト比ビアエッチング
US7807583B2 (en) 2006-08-25 2010-10-05 Imec High aspect ratio via etch
US7514775B2 (en) * 2006-10-09 2009-04-07 Taiwan Semiconductor Manufacturing Co., Ltd. Stacked structures and methods of fabricating stacked structures
KR100834826B1 (ko) 2007-01-25 2008-06-03 삼성전자주식회사 취급손상을 줄인 집적회로 모듈의 구조 및 모듈의 종단저항 배치방법
JP4792143B2 (ja) * 2007-02-22 2011-10-12 株式会社デンソー 半導体装置およびその製造方法
JP2008288384A (ja) 2007-05-17 2008-11-27 Sony Corp ３次元積層デバイスとその製造方法、及び３次元積層デバイスの接合方法
KR100891805B1 (ko) 2007-05-25 2009-04-07 주식회사 네패스 웨이퍼 레벨 시스템 인 패키지 및 그 제조 방법
JP4825778B2 (ja) 2007-11-16 2011-11-30 株式会社日立製作所 半導体装置およびその製造方法
US20090194829A1 (en) * 2008-01-31 2009-08-06 Shine Chung MEMS Packaging Including Integrated Circuit Dies
WO2010047228A1 (ja) * 2008-10-21 2010-04-29 日本電気株式会社 配線基板およびその製造方法
JP2010112763A (ja) 2008-11-04 2010-05-20 Toshiba Corp 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JP2014054718A (ja) 2014-03-27
US9437584B2 (en) 2016-09-06
US20140077390A1 (en) 2014-03-20

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C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140326