CN103648716A - 研磨载体及其使用方法 - Google Patents

研磨载体及其使用方法 Download PDF

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Publication number
CN103648716A
CN103648716A CN201280034326.5A CN201280034326A CN103648716A CN 103648716 A CN103648716 A CN 103648716A CN 201280034326 A CN201280034326 A CN 201280034326A CN 103648716 A CN103648716 A CN 103648716A
Authority
CN
China
Prior art keywords
carrier
layer
base
abrasive
outer polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280034326.5A
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English (en)
Chinese (zh)
Inventor
E·C·科德
V·D·罗梅罗
G·M·帕姆格伦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN103648716A publication Critical patent/CN103648716A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201280034326.5A 2011-07-11 2012-07-09 研磨载体及其使用方法 Pending CN103648716A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161506253P 2011-07-11 2011-07-11
US61/506,253 2011-07-11
US13/489,132 2012-06-05
US13/489,132 US20130017765A1 (en) 2011-07-11 2012-06-05 Lapping carrier and method of using the same
PCT/US2012/045926 WO2013009685A1 (en) 2011-07-11 2012-07-09 Lapping carrier and method of using the same

Publications (1)

Publication Number Publication Date
CN103648716A true CN103648716A (zh) 2014-03-19

Family

ID=46548849

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280034326.5A Pending CN103648716A (zh) 2011-07-11 2012-07-09 研磨载体及其使用方法

Country Status (6)

Country Link
US (1) US20130017765A1 (enExample)
JP (1) JP2014522737A (enExample)
KR (1) KR20140046458A (enExample)
CN (1) CN103648716A (enExample)
TW (1) TW201309418A (enExample)
WO (1) WO2013009685A1 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105128448A (zh) * 2015-09-28 2015-12-09 无锡贺邦金属制品有限公司 高耐磨金属制品
CN105881198A (zh) * 2014-12-29 2016-08-24 天津西美科技有限公司 一种抛光模板用吸附垫片
CN108603076A (zh) * 2016-02-16 2018-09-28 3M创新有限公司 抛光系统以及制备和使用抛光系统的方法
CN110000696A (zh) * 2017-12-29 2019-07-12 比亚迪股份有限公司 耐磨治具及其制备方法
CN111251174A (zh) * 2018-11-30 2020-06-09 台湾积体电路制造股份有限公司 晶圆清洁和抛光垫、晶圆清洁和抛光腔室及清洁和抛光晶圆的方法
CN113146465A (zh) * 2021-04-06 2021-07-23 安徽禾臣新材料有限公司 一种薄型晶片双面研磨用吸附垫及生产方法
CN115990825A (zh) * 2022-12-27 2023-04-21 西安奕斯伟材料科技股份有限公司 一种硅片双面抛光用的载具、双面抛光装置及硅片

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10058970B2 (en) 2014-05-02 2018-08-28 3M Innovative Properties Company Interrupted structured abrasive article and methods of polishing a workpiece
WO2015170556A1 (ja) * 2014-05-08 2015-11-12 冨士ベークライト株式会社 研磨キャリア及びその製造方法
JP6424809B2 (ja) * 2015-12-11 2018-11-21 信越半導体株式会社 ウェーハの両面研磨方法
US10556317B2 (en) 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
EP3707218A1 (en) * 2017-11-08 2020-09-16 3M Innovative Properties Company Adhesive primer for flexographic plate mounting tape
JP7205423B2 (ja) * 2018-12-17 2023-01-17 Ａｇｃ株式会社 ガラス基板の保持用膜体、及びガラス基板の研磨方法
EP3966294A1 (en) * 2019-05-07 2022-03-16 3M Innovative Properties Company Adhesive primer for flexographic plate mounting tape

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1158223A (ja) * 1997-08-12 1999-03-02 Nitto Shinko Kk 研磨治具及びその製造方法
JP2002371262A (ja) * 2001-06-14 2002-12-26 Nitto Denko Corp ウエハ加工用粘着シート用粘着剤およびウエハ加工用粘着シート
CN1883033A (zh) * 2003-11-19 2006-12-20 先进医疗科学股份有限公司 在大批量制造中的背研磨期间保护薄半导体晶片
CN101269476A (zh) * 2007-03-19 2008-09-24 硅电子股份公司 同时研磨多个半导体晶片的方法
CN101530988A (zh) * 2005-05-17 2009-09-16 东洋橡胶工业株式会社 研磨垫
WO2010078312A1 (en) * 2008-12-31 2010-07-08 3M Innovative Properties Company Coated carrier for lapping and methods of making and using

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0373265A (ja) * 1989-05-02 1991-03-28 Sekisui Chem Co Ltd 被研磨物保持用キャリヤ及びその製造方法
US5193316A (en) * 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5882245A (en) * 1997-02-28 1999-03-16 Advanced Ceramics Research, Inc. Polymer carrier gears for polishing of flat objects
US6030280A (en) * 1997-07-23 2000-02-29 Speedfam Corporation Apparatus for holding workpieces during lapping, honing, and polishing
US6419555B1 (en) 1999-06-03 2002-07-16 Brian D. Goers Process and apparatus for polishing a workpiece
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
US20040040656A1 (en) * 2002-08-28 2004-03-04 Hengel Raymond J. Method and apparatus for CMP retaining ring
US20040261945A1 (en) * 2002-10-02 2004-12-30 Ensinger Kunststofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US7008308B2 (en) * 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
WO2008064158A2 (en) * 2006-11-21 2008-05-29 3M Innovative Properties Company Lapping carrier and method
WO2010009242A2 (en) * 2008-07-16 2010-01-21 Zimmer, Inc. Thermally treated ceramic coating for implants

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1158223A (ja) * 1997-08-12 1999-03-02 Nitto Shinko Kk 研磨治具及びその製造方法
JP2002371262A (ja) * 2001-06-14 2002-12-26 Nitto Denko Corp ウエハ加工用粘着シート用粘着剤およびウエハ加工用粘着シート
CN1883033A (zh) * 2003-11-19 2006-12-20 先进医疗科学股份有限公司 在大批量制造中的背研磨期间保护薄半导体晶片
GB2424516B (en) * 2003-11-19 2007-09-05 Advanced Material Sciences Inc Protecting thin semiconductor wafers during back-grinding in high-volume production
CN101530988A (zh) * 2005-05-17 2009-09-16 东洋橡胶工业株式会社 研磨垫
CN101269476A (zh) * 2007-03-19 2008-09-24 硅电子股份公司 同时研磨多个半导体晶片的方法
WO2010078312A1 (en) * 2008-12-31 2010-07-08 3M Innovative Properties Company Coated carrier for lapping and methods of making and using

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105881198A (zh) * 2014-12-29 2016-08-24 天津西美科技有限公司 一种抛光模板用吸附垫片
CN105128448A (zh) * 2015-09-28 2015-12-09 无锡贺邦金属制品有限公司 高耐磨金属制品
CN108603076A (zh) * 2016-02-16 2018-09-28 3M创新有限公司 抛光系统以及制备和使用抛光系统的方法
CN110000696A (zh) * 2017-12-29 2019-07-12 比亚迪股份有限公司 耐磨治具及其制备方法
CN111251174A (zh) * 2018-11-30 2020-06-09 台湾积体电路制造股份有限公司 晶圆清洁和抛光垫、晶圆清洁和抛光腔室及清洁和抛光晶圆的方法
CN113146465A (zh) * 2021-04-06 2021-07-23 安徽禾臣新材料有限公司 一种薄型晶片双面研磨用吸附垫及生产方法
CN115990825A (zh) * 2022-12-27 2023-04-21 西安奕斯伟材料科技股份有限公司 一种硅片双面抛光用的载具、双面抛光装置及硅片

Also Published As

Publication number Publication date
JP2014522737A (ja) 2014-09-08
TW201309418A (zh) 2013-03-01
US20130017765A1 (en) 2013-01-17
WO2013009685A1 (en) 2013-01-17
KR20140046458A (ko) 2014-04-18

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Application publication date: 20140319