US20130017765A1 - Lapping carrier and method of using the same - Google Patents

Lapping carrier and method of using the same Download PDF

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Publication number
US20130017765A1
US20130017765A1 US13/489,132 US201213489132A US2013017765A1 US 20130017765 A1 US20130017765 A1 US 20130017765A1 US 201213489132 A US201213489132 A US 201213489132A US 2013017765 A1 US2013017765 A1 US 2013017765A1
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United States
Prior art keywords
carrier
lapping
base
layer
outer polymer
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Abandoned
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US13/489,132
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English (en)
Inventor
Eric C. Coad
Vincent D. Romero
Gary M. Falmgren
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3M Innovative Properties Co
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3M Innovative Properties Co
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Priority to US13/489,132 priority Critical patent/US20130017765A1/en
Assigned to 3M INNOVATIVE PROPERTIES COMPANY reassignment 3M INNOVATIVE PROPERTIES COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COAD, ERIC C., PALMGREN, GARY M., ROMERO, VINCENT D.
Priority to KR1020147003124A priority patent/KR20140046458A/ko
Priority to PCT/US2012/045926 priority patent/WO2013009685A1/en
Priority to JP2014520236A priority patent/JP2014522737A/ja
Priority to CN201280034326.5A priority patent/CN103648716A/zh
Priority to TW101124822A priority patent/TW201309418A/zh
Publication of US20130017765A1 publication Critical patent/US20130017765A1/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces

Definitions

  • the present disclosure broadly relates to lapping carriers and processes for abrading a workpiece using them.
  • Such grinding or polishing operations, differing in the rate of material removal and final surface finish, may be referred to collectively as lapping.
  • a typical lapping machine used for finishing the disks may include two superposed platens respectively disposed over and under one or more of the disks, so that opposing surfaces of the disks can be ground or polished simultaneously.
  • the lapping machine may include lapping carriers that position and retain the disks during the grinding or polishing operation.
  • Such lapping carriers may be adapted to rotate relative to the platens.
  • the lapping machine may also include an outer ring gear, disposed around an outer periphery of the platens, and an inner gear, that projects through a hole formed in a center of the platens.
  • the lapping carriers can have a toothed outer periphery, which engages with the teeth or pins of the outer ring gear and the teeth or pins of the inner gear.
  • Rotation of the inner gear and outer gear in opposite directions thus causes the lapping carrier to rotate globally around the inner gear, and about an axis of the lapping carrier.
  • the surfaces of the platens are relatively flat and planar, and are suitable for most polishing operations using a lapping technique.
  • a workpiece is disposed within an aperture of the lapping carrier, the platens are brought together to exert a predetermined pressure upon the workpiece, and the lapping carrier and workpiece are rotated, thus planarizing, polishing, and/or thinning the surface(s) of the workpiece.
  • the lapping carrier is made of a durable material such as, for example, steel, such contact between the lapping carrier and the fixed abrasive article typically results in premature wear of the fixed abrasive article.
  • a lapping carrier comprising:
  • the lapping carrier further comprises:
  • lapping carriers according to the present disclosure may exhibit wear characteristics during lapping-type abrading processes that are comparable or superior to those of commercial lapping carriers.
  • Lapping carriers according to the present disclosure are useful for lapping a workpiece. Accordingly, in another aspect, the present disclosure provides a method of lapping comprising:
  • FIG. 1 is a schematic side view of an exemplary lapping carrier according to the present disclosure.
  • FIG. 2 is a plan view of an exemplary lapping carrier according to the present disclosure.
  • FIGS. 3A-3C are exemplary partial sections of workpiece carriers according to the present disclosure.
  • exemplary lapping carrier 110 comprises base 112 having first and second opposed major surfaces 115 , 116 .
  • Wear layers 114 are disposed on respective first and second major surfaces 115 , 116 .
  • Wear layers 114 comprise outer polymer layers 150 secured to base 112 by adhesive layers 130 .
  • Outer polymer layers 150 comprise at least one of polyether ether ketone or ultrahigh molecular weight polyethylene.
  • Optional base adhesion promoting layers 120 are disposed between adhesive layers 130 and the first and second major surfaces 115 , 116 of base 112 .
  • Optional polymer adhesion promoting layers 140 are disposed between adhesive layers 130 and outer polymer layers 150 .
  • the optional components in the wear layers may be present in one wear layer and not in the other.
  • the base may comprise any dimensionally stable material such as, for example, metal, glass, polymer, or ceramic.
  • Exemplary metals include titanium and steels (e.g., mild steel and stainless steel).
  • Exemplary polymers include thermoset polymers, thermoplastic polymers and combinations thereof.
  • the polymer may contain one or more fillers or additives, chosen for a specific purpose. Inorganic fillers may be employed to lower the cost of the carrier. Additionally, reinforcing fillers such as particles or fibers may be added to the polymer (e.g., a fiberglass/epoxy composite). Typical reinforcing fillers are inorganic in nature and may comprise surface modification to improve the reinforcing effect, although these are not requirements.
  • Nanoparticles may also be of utility.
  • the polymer may also contain layers or regions of reinforcing matting, typically woven materials, e.g., polymeric fiber matting, fiber glass matting or a metal screen.
  • the base may have any thickness, typically depending on the intended workpiece, but advantageously is suitable for use at minimal thicknesses.
  • the base has one or more apertures for introduction of a workpiece, and the base has one or more apertures for delivery of a slurry.
  • the base has one or more apertures for introduction of a workpiece, but may optionally have no aperture(s) for introduction of polishing slurry. It is believed that eliminating such apertures increases rigidity of the lapping carrier and decreases wear of the lapping carrier and fixed abrasive surfaces that it may contact. Increasing thickness of the base typically increases rigidity, and balancing between the thickness of the base relative to the thickness of the wear layer is generally desired for optimal wear properties.
  • a stainless steel base may have a thickness in a range of from about 400 microns to about 800 microns.
  • a stainless steel base may have a thickness in a range of from about 500 to about 950 microns.
  • a base adhesion promoting layer may optionally be included in the wear layer between the adhesive layer and the base.
  • the polymer adhesion promoting layer may comprise any material(s) or treatments that enhance bonding between the base and the adhesive layer. Examples include plasma treatments of the major surface(s) of the base, inorganic coatings, organic coatings, silane coupling agents, polymeric primers, surface texturing or abrasion and combinations thereof.
  • the base adhesion promoting layer may be formed by chemical modification of one or more of the base's surfaces or by providing a coating on one or more of the base's surfaces.
  • Chemical modification of the base's surface may be accomplished by conventional techniques, e.g., plasma, e-beam or ion beam processing.
  • An exemplary process is plasma processing in the presence of one or more gases.
  • Useful gases include, for example, tetramethylsilane, oxygen, nitrogen, hydrogen, butane, and argon.
  • Plasma surface treatment results in the formation of various functional groups on the surface of the base. Desirable functional groups include atom pairs that comprise oxygen bonded to carbon, oxygen bonded to silicon, nitrogen bonded to carbon and hydrogen bonded to nitrogen.
  • Plasma processing can also be used to clean the surface of the base prior to applying the base adhesion promoting layer. Argon gas is useful for this purpose.
  • Modification of the surface may also be accomplished by treatment with a cleaning or etching solution such as, for example, an alkali metal metasilicate treatment, and ALKONOX detergent wash (from Alconox, Inc., White Plains, N.Y.), or a phosphate wash.
  • a cleaning or etching solution such as, for example, an alkali metal metasilicate treatment, and ALKONOX detergent wash (from Alconox, Inc., White Plains, N.Y.), or a phosphate wash.
  • the base adhesion promoting layer may comprise an inorganic coating and/or organic coating.
  • Useful inorganic coatings include metals and metal oxides.
  • Physical vapor deposition techniques such as sputtering, ion plating, and cathodic arc type techniques are useful in precisely controlling the thickness and uniformity of the coatings for metals, alloys, nitrides, oxides, and carbides. These vacuum deposition techniques allow for a solvent-free, dry and clean process.
  • Useful organic coatings can vary widely in chemical composition and form.
  • an organic base adhesion promoting layer has chemical characteristics, e.g., one or more functional groups that enhance the adhesion between the base and the wear layer.
  • the organic coatings, in final form, are typically polymeric, although low molecular weight compounds may also be useful in enhancing adhesion.
  • Polymeric primers may initially comprise monomers and/or oligomers that are polymerized and/or crosslinked after coating onto the appropriate surface.
  • polymeric primers When applied to the base, polymeric primers may be substantially one hundred percent in solids content or it may contain solvent that is substantially removed after coating.
  • Polymeric primers may also be a polymer solution in which the solvent is substantially removed after coating.
  • the polymeric primers may be polymerized and/or crosslinked after coating via standard techniques, including thermal curing and radiation curing.
  • polymeric primers examples include alkyd polymers, epoxy ester polymers, epoxy novolac polymers, vinyl polymers, chlorinated rubber polymers, polyamide-cured epoxy polymers, polyurethane polymers (aromatic or aliphatic), amine-cured epoxy polymers, phenolic polymer, organic zinc-rich coating, inorganic zinc-rich coating, phosphate conversion coatings, chromate conversion coatings, chromate-free conversion coatings, polyurea polymers, alkali silicate polymers, acrylic polymers, and combinations thereof.
  • Acrylic polymeric primers such as that available as 3M TAPE PRIMER 94 from 3M Company, St. Paul, Minn., may be particularly useful.
  • Adhesion Promoter 111 adhesion promoter available from 3M Company may also be useful.
  • Silane coupling agents e.g., aminosilanes, epoxysilanes, vinylsilanes, isocyanatosilanes, and ureidosilanes may also be useful as, or as a component in, the base adhesion promoting layer.
  • An example of a useful epoxysilane coupling agent include 3-(glycidoxypropyl) trimethoxysilane (available from Gelest, Inc., Morrisville, Pa.).
  • the adhesive layer may comprise any material capable of adhering the wear layer to the base.
  • suitable materials include hot melt adhesives, pressure-sensitive adhesives, glues, and structural adhesives.
  • the adhesive layer is comprises a pressure-sensitive adhesive in order to facilitate fabrication of the lapping carrier.
  • Acrylic pressure-sensitive adhesives are typically useful in this regard. Examples include 3M 300 LSE 2 mil pressure-sensitive adhesive transfer tape, 3M 501F1 mil pressure-sensitive adhesive transfer tape, 3M 9457 1 mil pressure-sensitive adhesive transfer tape, 3M 9458 1 mil pressure-sensitive adhesive transfer tape, 3M 9009 2 mil pressure-sensitive adhesive transfer tape, 3M 9471 2 mil pressure-sensitive adhesive transfer tape, 3M 9461P 1 mil pressure-sensitive adhesive, all available from 3M Company.
  • the adhesive layer may have any thickness, but is desirably thin.
  • the adhesive layer may have a thickness in a range of from about 10 to about 75 microns, from about 15 to about 30 microns, or even from about 20 to about 30 microns.
  • the outer polymer layer comprises at least one of polyether ether ketone (PEEK) or ultrahigh molecular weight polyethylene (UHMW PE).
  • PEEK polyether ether ketone
  • UHMW PE ultrahigh molecular weight polyethylene
  • Ultrahigh molecular weight polyethylene which is also known as high-modulus polyethylene (HMPE) or high-performance polyethylene (HPPE), is a polyethylene characterized by extremely long polymer chains, with molecular weight numbering in the millions (e.g. above one million grams per mole), usually between 2 and 6 million grams per mole. It is resistant to corrosive chemicals, with the exception of oxidizing acids.
  • UHMW PE may be readily obtained from commercial sources as film, pellets, or granules. Examples include 3M SQUEAK REDUCTION TAPE 9325—5 mil and 3M UHMW-PE 5425—4.5 mil (both from 3M Company), and UHMW-PE Ultra High Molecular Weight Polyethylene from McMaster Carr, Chicago, Ill.
  • PEEK is a generally colorless organic polymer thermoplastic used in engineering applications. PEEK has the structural formula
  • PEEK polymers are obtained by step-growth polymerization by the dialkylation of bisphenolate salts. Typical is the reaction of 4,4′-difluorobenzophenone with the disodium salt of hydroquinone, which is generated in situ by deprotonation with sodium carbonate. The reaction is conducted around 300° C. in polar aprotic solvents such as, e.g., diphenylsulfone.
  • polar aprotic solvents such as, e.g., diphenylsulfone.
  • PEEK is highly resistant to thermal degradation as well as attack by both organic and aqueous environments. It is attacked by halogens and strong Br ⁇ nsted and Lewis acids as well as some halogenated compounds and aromatic hydrocarbons at high temperatures.
  • the outer polymer layer typically consists or consists essentially of UHMW-PE and/or PEEK, it may further comprise additional components such as, e.g., lubricants, antioxidants, fillers, plasticizers, melt processing aids, and anti-static agents. Additionally, the outer polymer layer can be optionally textured through molding, scoring, embossing, etc.
  • the outer polymer layer is provided a film prior to incorporation into the wear layer.
  • the film may be obtained, for example, from a commercial source or extruded into a film from pellets or granules.
  • a commercial source of PEEK is available as VICTREX PEEK from Victrex Plc, Lancashire, England.
  • One commercial source of UHMW PE is under the trade designation GUR UHMW PE from Ticona Polymers, Dallas, Tex.
  • Examples of commercially available PEEK films include PEEK POLYETHER ETHER KETONE FILM—2 mil and PEEK Polyether Ether Ketone film—3 mil (both from McMaster Carr), and PEEK POLYETHER ETHER KETONE FILM—3 mil from C.S.
  • the outer polymer layer may have any thickness, depending, e.g., on the workpiece chosen. In some embodiments, the outer polymer layer has a thickness in a range of from 25 microns to 155 microns.
  • outer polymer layers according to the present disclosure exhibit relatively lower coefficients of friction as compared to a commercially successful lapping carrier, and also have good durability.
  • the lapping carrier may have any thickness, typically depending on the intended workpiece and the thickness of the included components, but advantageously is suitable for use at minimal thicknesses.
  • the lapping carrier may have a maximum thickness in a range of from about 600 to about 975 microns
  • a polymer adhesion promoting layer may optionally be included in the wear layer between the outer polymer layer and the adhesive layer.
  • the polymer adhesion promoting layer may comprise any material(s) or treatments that enhance bonding between the outer polymer layer and the adhesive layer. Examples include plasma treatments (e.g., corona discharge or plasma etch) of the bonding surface of the outer polymer layer, a polymeric primer, and combinations thereof. Examples of such are given hereinabove with regard to the base adhesion promoting layer.
  • the outer polymer layer may be texturized.
  • Different lapping applications may require different levels of adhesion between the base and the outer polymer layer.
  • a lapping process employing corrosive polishing solutions, high temperatures or having high degrees of shear transferred to the carrier may require higher adhesion between the base and wear layers compared to a process employing less severe conditions.
  • the selection of the various adhesion promoting layers subsequently may depend on the lapping process conditions and or workpieces being abraded.
  • exemplary lapping carrier 110 has an aperture 22 within lapping carrier 110 and teeth 24 around its perimeter.
  • the aperture corresponds to the dimensions of the workpiece with which it is intended to be used, but in some instances, the circumference of the aperture in the lapping carrier is fabricated to be larger and may be of a different shape than the required circumference and shape to hold the workpiece.
  • An insert (not shown), having a second aperture of the desired circumference and shape to facilitate holding of the workpiece, may then be mounted within the lapping carrier aperture. Any known insert can be used, e.g., those described in U.S. Pat. No. 6,419,555 (Goers). The insert typically comprises a different material from that of the lapping carrier.
  • the lapping carrier may include one or more apertures for holding one or more workpieces.
  • the lapping carrier teeth engage corresponding teeth or pins (not shown) disposed around an outer periphery of the platens of a lapping machine, and an inner gear, sometimes referred to as a sun gear, that projects through a hole formed in a center of the platens.
  • the lapping carriers can then have a toothed outer periphery, which engages with the teeth or pins of the outer ring gear and the teeth or pins of the inner gear. Rotation of the inner gear and outer gear in opposite directions, for example, thus causes the lapping carrier to rotate globally around the inner gear, and about an axis of the lapping carrier.
  • Lapping carriers also can be designed to rotate about a platen using a sun gear and a ring gear, which may move in the same direction but at different speeds.
  • FIG. 3 a is illustrative of an exemplary embodiment of a cross-section corresponding to section A-A of FIG. 2 of lapping carrier 110 .
  • lapping carrier 110 comprises wear layers 114 disposed on first and second opposed major faces 115 , 116 of base 112 .
  • wear layers 114 extend from the periphery of base 112 to aperture 22 (see FIG. 2 ).
  • FIG. 3 b is illustrative of an exemplary embodiment of a cross-section corresponding to section A-A of FIG. 2 of lapping carrier 110 .
  • lapping carrier 110 comprises wear layers 114 disposed on first and second opposed major faces 115 , 116 of base 112 .
  • wear layers 114 extend peripherally from aperture 22 (see FIG. 2 ), but terminate inwardly from teeth 24 (see FIG. 2 ).
  • FIGS. 3 a - 3 c indicate that substantially all of both major surfaces of the carrier, with the possible exception of the toothed region, are covered by the wear layers, it should be appreciated that the wear layers may be discontinuous in other embodiments and may be present in multiple regions on either or both major surfaces of the carrier. Continuous or discontinuous wear layers covering at least a portion of the major surfaces of the carrier may be desirable to optimize (e.g., reduce) the overall friction between the workpiece and carrier and the abrasive surfaces of the lapping platens and/or to provide enhanced flow of a working fluid for cooling, lubrication, chemical modification of the surfaces being abraded, swarf removal, and the like.
  • the wear layers or regions may be textured to reduce contact drag or to improve working fluid flow.
  • the polymeric region or regions on one major surface of the carrier may be connected to the polymeric region or regions on the opposite major surface.
  • a third surface, corresponding to the surface area of the base defining the aperture circumference, may be at least partially coated by the polymer comprising the polymeric layers.
  • the coated lapping carrier must remain sufficiently rigid to drive the workpiece or workpieces between the abrasive platens while remaining thin enough to be used to lap the very thin workpieces desired in the electronics and related industries.
  • the thickness of the wear layer(s) should be selected such that the total thickness of the lapping carrier to be less than the desired final thickness of the workpiece.
  • the wear layer should not cause undue dulling of the abrasive or undue wear of fixed abrasive surfaces which it contacts, and it should be resistant to chemicals present in any working fluid that may be present.
  • wear layers with substantial wear resistance and/or low coefficient of friction are desirable.
  • the wear layer may have any thickness, but advantageously is thinner than the final lapped thickness of an intended workpiece (e.g., a silicon wafer).
  • an intended workpiece e.g., a silicon wafer.
  • the wear layer may have a thickness in a range of from about 25 to about 300 microns, from about 75 to about 250 microns, or even from about 100 to about 200 microns.
  • the wear layer may have a thickness in a range of from about 25 to about 300 microns, from about 75 to about 275 microns, or even from about 125 to about 250 microns
  • Lapping carrier can be used to abrading (e.g., lapping) a surface of a workpiece.
  • a working fluid is provided at the interface between the workpiece and the lapping surfaces.
  • the working fluid comprises water.
  • working fluid comprises abrasive particles.
  • the working fluid comprises surfactant.
  • the method of the invention includes the use of a double-sided lapping machine wherein at least one of the two opposed lapping surfaces comprises a three-dimensional, textured, fixed-abrasive article.
  • the disclosed method employs pellet laps on at least one of the two opposed lapping surfaces of the lapping machine.
  • the double-sided lapping machine is replaced by a single-sided lapping machine and the base includes at least one polymeric region on the surface of the carrier which contacts the abrasive surface of the lapping machine.
  • the present disclosure provides a lapping carrier comprising:
  • the present disclosure provides a lapping carrier according to the first embodiment, wherein the first outer polymer layer comprises polyether ether ketone.
  • the present disclosure provides a lapping carrier according to the first embodiment, wherein the first outer polymer layer comprises ultrahigh molecular weight polyethylene.
  • the present disclosure provides a lapping carrier according to any one of the first to third embodiments, further comprising a first base adhesion promoting layer, disposed between the first adhesive layer and the first major surface of the base, wherein the first base adhesion promoting layer is selected from the group consisting of plasma treatments, polymeric primers, silane coupling agents, and combinations thereof.
  • the present disclosure provides a lapping carrier according to any one of the first to fourth embodiments, further comprising a first polymer adhesion promoting layer disposed between the first adhesive layer and the first outer polymer layer, wherein the first polymer adhesion promoting layer is selected from the group consisting of plasma treatments, polymeric primers, and combinations thereof.
  • the present disclosure provides a lapping carrier according to any one of the first to sixth embodiments, further comprising:
  • the present disclosure provides a lapping carrier according to the seventh embodiment, wherein the second outer polymer layer comprises polyether ether ketone.
  • the present disclosure provides a lapping carrier according to the seventh embodiment, wherein the second outer polymer layer comprises ultrahigh molecular weight polyethylene.
  • the present disclosure provides a lapping carrier according to any one of the seventh to tenth embodiments, further comprising a second polymer adhesion promoting layer disposed between the second adhesive layer and the second outer polymer layer, wherein the second polymer adhesion promoting layer is selected from the group consisting of plasma treatments, polymeric primers, and combinations thereof.
  • the present disclosure provides a lapping carrier according to any one of the seventh to eleventh embodiments, wherein the second adhesive layer comprises a pressure-sensitive adhesive.
  • the present disclosure provides a lapping carrier according to any one of the seventh to twelfth embodiments, wherein the base comprises a steel.
  • the present disclosure provides a lapping carrier according to any one of the first to thirteenth embodiments, wherein the lapping carrier has a maximum thickness of less than 975 microns.
  • the present disclosure provides a method according to the fifteenth embodiment, further comprising providing a working fluid at the interface between the workpiece and the at least one lapping surface.
  • the present disclosure provides a method according to the fifteenth or sixteenth embodiment, wherein the working fluid comprises water.
  • Carrier blanks were cleaned as in ST1 (above). The blanks were then treated with an Epoxy Silane solution.
  • the Epoxy Silane surface treatment solution was prepared by stirring 50 grams of absolute ethanol with 50 grams of Epoxy Silane and 11.5 grams of de-ionized water. The solution was equilibrated 15-20 minutes, and the solution was diluted to a 10 weight percent solution of Epoxy Silane by adding 388 grams of absolute ethanol. After dilution, the carrier blanks were treated by dip coating into the Epoxy Silane solution, drying in an electric oven for 30-45 minutes at 110-120° C. The parts were allowed to cool. The carrier teeth, work holes, and slurry holes were masked with 442DL adhesive, and the carrier blanks were laminated as indicated.
  • Carrier blanks were cleaned as in ST1 (above). The blanks were then treated with a sodium metasilicate (SMS) solution prepared by stirring 950 parts by weight (pbw) of deionized water, 25 pbw sodium metasilicate, 11 pbw of tetrasodium pyrophosphate, 11 pbw of sodium hydroxide, and 3 pbw of sodium dodecylbenzenesulfonate. The solution was brought to a temperature of 71-82° C. to completely dissolve the solid materials. The carrier blanks were treated for 10 minutes with the SMS solution, rinsed with de-ionized water, dried. The carrier teeth, work holes, and slurry holes were masked with 442DL adhesive. The carrier blanks were laminated as indicated.
  • SMS sodium metasilicate
  • Carrier blanks were cleaned as in ST1 (above). The blanks were placed on a clean surface. A thin layer of Adhesion Promoter 111 was painted on one side and allowed to dry. The sample was flipped and a thin layer of 3Adhesion Promoter 111 was painted on the other side and allowed to dry. The carrier teeth, work holes, and slurry holes were masked with 442DL adhesive. The carrier blanks were laminated as indicated.
  • Pressure-sensitive adhesive was applied to polymer film as received using the following method. A suitable size piece of film and adhesive was selected for lamination. The adhesive liner was removed and the adhesive was carefully applied to the film, while avoiding the lamination of bubbles in between the adhesive and the film. The film was then rolled against the liner backed adhesive with a small hand roller. The lamination was at room temperature.
  • the polymer film was treated with ST2 by applying a thin layer of ST2 with a varnish brush over the entire surface of the polymer film to be treated.
  • the primer was allowed to dry at least 5 minutes before adhesive lamination.
  • the adhesive liner was removed and the adhesive with the ST2-treated polymer film was carefully applied to the film, while avoiding the lamination of bubbles in between the adhesive and the film.
  • the film was then rolled against the liner-backed adhesive with a small had roller. The lamination was at room temperature.
  • the polymer film was corona treated with a handheld corona treater operated at an input power of 30 watts.
  • the handheld corona treater Model BD-20AC, was from Electro Technic Products Inc., Chicago, Ill.
  • the corona-treated polymer film and the adhesive with the liner removed were carefully laminated, while avoiding the lamination of bubbles in between the adhesive and the film.
  • the film was then rolled against the liner-backed adhesive with a small had roller. The lamination was at room temperature.
  • Both sides of the carrier blank were wiped with isopropanol.
  • a suitable size piece of the indicated adhesive-backed film was selected for each masked blank to be laminated.
  • the adhesive liner was removed and the adhesive side of the indicated adhesive-backed film was carefully applied to the steel blank while avoiding the lamination of bubbles in between the steel and the film.
  • the film was then rolled against the steel blank with a hand roller. After lamination, the film was removed from areas of the steel part where no metal was present by using a razor blade or X-Acto knife.
  • the carrier was then placed on metal sheet and both sides were slowly run through the laminator with the roll pressure set to 100 psi (690 kPa), and with the heated roll set at 200° F. (93° C.).
  • Both sides of the carrier blank were wiped with isopropanol.
  • a thin layer of the indicated primer was applied using a brush over the entire surface of the carrier to be laminated.
  • the primer was allowed to dry at least 5 minutes before applying 442DL adhesive mask to the carrier teeth, work holes, and slurry holes.
  • the adhesive-backed film was cut to size and spliced together the 3M Blue Painters Tape from 3M Company.
  • the masked carrier was laid on a flat plastic sheet or metal plate. About 2 inches (5.1 cm) of release liner was removed from one edge of the adhesive-backed film. The edge of the adhesive-backed film was laid down about one inch (2.5 cm) in front of the carrier edge.
  • a plate or plastic sheet was placed on a roll laminator (Shore 55 A durometer).
  • the roll pressure was about 100 psi (690 kPa).
  • the roll drive was slowly turned to laminate the film to the primed carrier.
  • the mask was removed using a razor blade to cut along the edges of the tape mask.
  • the carrier was flipped over and the procedure was repeated.
  • the top roll was heated to 200° F. (93° C.).
  • the carrier was placed on metal sheet and slowly run the carrier through the laminator on both sides
  • Sample preparation consisted of the following steps. A 4-inch ⁇ 6.5-inch (10-cm ⁇ 17-cm) 431 SS metal plate was cleaned with isopropanol. 3M TAPE PRIMER 94 was applied to the SS surface with a varnish brush and let dry 5 minutes. The pressure-sensitive adhesive side of a 4-inch ⁇ 4-inch (10-cm ⁇ 10-cm) film specimen to be tested was laminated to the primed metal surface. The film was positioned so it covered about half of the metal surface (4-inch ⁇ 4-inch (10-cm ⁇ 10-cm) area) over the length of the metal plate. The sample had a 2-inch (5.1-cm) overhang off the edge of the length of the metal plate. Samples were prepared as 0.280-inch (7.11-mm) strips.
  • the Shear Strength Test procedure is used to obtain tensile strength data for laminated film samples.
  • the procedure was generally according to ASTM D638-10 “Standard Test Method for Tensile Properties of Plastics” with differences as noted below.
  • Sample preparation consisted of the following steps. A 4-inch ⁇ 4-inch (10-cm ⁇ 10-cm) 431 SS metal plate was cleaned with isopropanol. 3M TAPE PRIMER 94 was applied to the SS surface with a varnish brush and let dry 5 minutes. The pressure-sensitive adhesive side of a 4-inch ⁇ 4-inch (10-cm ⁇ 10-cm) film specimen to be tested was laminated to the primed metal surface. The film was positioned so it covered 0.5 inch (1.3 cm) of the metal surface (4-inch ⁇ 4-inch (10-cm ⁇ 10-cm) area) over the length of the metal plate. The sample had a 3.5-inch (8.9-cm) overhang off the edge of the length of the metal plate. Samples were prepared as 0.5-inch (1.3-cm) strips.
  • a Taber Abraser (Taber Industries, Buffalo, N.Y.) was run using 4-inch (10-cm) round blanks for each laminated or sprayed sample which were soaked at 60° C.
  • the list of Surface Treatments, Coatings, and Laminate Material Abbreviations can be found in Table 2 (above) in a phosphate buffer for 24 hours before testing.
  • the phosphate buffer was 0.348 pbw K 2 HPO 4 , 0.087 pbw KH 2 PO 4 , and 99.565 pbw de-ionized Water by weight.
  • the pH of the phosphate buffer was between 7.3 and 7.5.
  • the Taber Abraser Test was run wet with de-ionized water unless otherwise indicated, using Tungsten Carbide Wheels S-35 with a load of 1 kg weight for 10 minutes or the indicated amount of time. Comparative Example 1 was used as a control reference point for the Taber Abraser Testing.
  • the Taber Abraser Test results were reported in microns of thickness loss or in grams of weight loss. In cases when the laminate film was raised from being roughed up by the Tungsten Carbide Wheel the thickness loss in microns was not reported since the measurement was not as accurate as the weight loss in grams.
  • the test was run using 45-tooth carriers from PR Hoffman, Carlisle, Pa.
  • the spray coated or laminated carriers were soaked at 60° C. in a phosphate buffer for 24 hours before testing.
  • the phosphate buffer was 0.348 pbw K 2 HPO 4 , 0.087 pbw KH 2 PO 4 , and 99.565 pbw of de-ionized water.
  • the pH of the phosphate buffer was between 7.3 and 7.5.
  • the test was run using a Peter-Wolters AC500 (Peter-Wolters of America, Des Plaines, Ill.) double-sided lapping machine.
  • TDT6EL was installed on the bottom plate of the double-sided polisher, using a rubber roller to insure the abrasive was adhered well.
  • the TDT6EL was dressed in the following manner. A piece of 268XA was cut into fourths. The 268XA wedges were applied onto an epoxy carrier blank that has a weight of 400 grams. The segments were evenly spaced around the carrier with the large curvature edge toward the teeth.
  • the pump was set up to deliver 100 mL per minute of de-ionized water to the TDT6EL pad near the inner opening.
  • the bottom platen was set to run at 69 rpm, clockwise.
  • the ring speed was set to 13 rpm, clockwise.
  • the carrier blank was placed on the TDT6EL with the 268XA wedge laminated side down, contacting the diamond abrasive. Weight (7.397 kg) was placed on top of the carrier blank.
  • the de-ionized water was turned on, and a 60 second dressing cycle was run. The weight and the carrier blank were then removed.
  • the TDT6EL pad was rinsed off with tap water, and spin dried.
  • the carrier was checked for urethane flash near the areas that were masked, and the flash was removed.
  • Side A of the carrier was placed on the TDT6EL abrasive.
  • Weight 20.36 kg (44.78 lbs) was evenly distributed on the top of the carrier.
  • the weight that was directly in contact with the carrier had the same dimensions as the carrier.
  • the first weight was checked for high spots and dirt on the surface to avoid high pressure areas on the carrier during the test.
  • the weight and thickness measurements were taken from the carrier before starting the test.
  • the pump was set to deliver 100 ml per minute of pH 7.4 buffer solution (same as soak solution above) to the TDT6EL pad near the inner opening.
  • the bottom platen was set to run at 69 rpm, clockwise.
  • the ring speed was set to 13 rpm, clockwise.
  • the pH 7.4 buffer was turned on and the bottom platen and ring were turned on.
  • the buffer solution was used only once and was not recycled.
  • the test was run for 3 minutes.
  • the weights and carrier were removed and the carrier was rinsed with de-ionized water.
  • the carrier was dried and the weight and thickness measurements were taken from the carrier after the test
  • the weight and thickness measurements were taken from the carrier before testing side B.
  • Side B of the carrier was placed on the TDT6EL abrasive. 20,355 g (44.78 lbs) of weight were evenly distributed on the top of the carrier.
  • the weight that was directly in contact with the carrier had the same dimensions as the carrier.
  • the first weight was checked for high spots and dirt on the surface to avoid high pressure areas on the carrier during the test.
  • the pump was set to deliver 100 ml per minutes of pH 7.4 buffer solution (same as soak solution above) to the TDT6EL pad near the inner opening.
  • the bottom platen was set to run at 69 rpm, clockwise.
  • the ring speed was set to 13 rpm, clockwise.
  • the pH 7.4 buffer was turned on and the bottom platen and ring were turned on.
  • the buffer solution was used only once and was not recycled.
  • the test was run for 10 minutes.
  • the weights and carrier were removed, and the carrier was rinsed with de-ionized water.
  • the carrier was dried and the weight and thickness measurements were taken from the carrier after the test
  • test blank was observed for delamination and rated on a scale from 0 to 5 per carrier side as reported in Table 3 (below).
  • Example 3 Five carriers were prepared as described in Example 3 using ST2 and L1. The five carriers were used to determine if the laminated L1 film had a negative effect upon the removal rate while polishing silicon wafers on a model PW AC 500 double-sided lapping machine from Peter Wolters, Rendsburg, Germany, using TDT6EL abrasive. The material removal rate from the silicon wafers was monitored during the testing to evaluate the stability of the wear rate and average wear rate. The total TDT6EL abrasive wear rate, and the total carrier wear rate from last measurement of each set were reported at the end of each set. Results are reported in Table 9 (below), wherein “cw” means clockwise and “ccw” means counter-clockwise.
  • Results show an average silicon wafer removal rate for Set 1 of 5.9+/ ⁇ 0.5 ⁇ m/min with new rough-lapped wafers and 4.9+/ ⁇ 0.4 um/min with used wafers at 14 psi (96 kPa), 50 rpm, 200 mL/min deionized water, and an average silicon wafer removal rate for Set 2 of 13.0+/ ⁇ 1.0 ⁇ m/min with new rough-lapped wafers and 10.0+/ ⁇ 0.6 ⁇ m/min with used wafers at 14 psi (96 kPa), 96 rpm, 500 mL/min deionized water. These values show a stable wear rate for each set of wafers under the polishing conditions used.
  • the average TDT6EL 6 micron EL Pad wear rate for Set 1 was 0.067 ⁇ m/min.
  • the average carrier wear rate for Set 1 over the 120 minute interval was 0.059 ⁇ m/min.
  • the average TDT6EL 6 micron EL Pad wear rate for Set 2 was 0.174 ⁇ m/min.
  • the average carrier wear rate for Set 2 over the 115 minute interval was 0.060 ⁇ m/min.
  • the carrier wear rate was stabile under the Set 1 and Set 2 polishing conditions.
  • the increase in the average Silicon Wafer Removal rate and the average TDT6EL 6 micron EL Pad wear rate from Set 1 to Set 2 is due to the increase from the 50 rpm in Set 1 to the 96 rpm in Set 2.
  • Coefficients of friction were measured using the horizontal plane method in which a sled of a single material is drawn across the sample at constant velocity. Seven samples were tested and CoFs calculated to assist in determining wear resistance. Testing was done using a circular steel sled of 15.85 mm diameter 220 grit polished and weight of 80 g. Static CoFs may assess a material's ability to minimize stiction (stick-slip), while kinetic CoFs may aid in predicting wear in dynamic contact with shear motion between two bodies.
  • Example 42 Five carriers were prepared as described in Example 42 using ST2 and X1. The five carriers were used to determine if the laminated X1 film had a negative effect upon the removal rate while polishing silicon wafers on a PW AC 500 double-sided lapping machine from Peter Wolters, Rendsburg, Germany, using TDT6EL abrasive. The material removal rate from the silicon wafers was monitored during the testing to evaluate the stability of the wear rate and average wear rate. The total TDT6EL wear rate, and the total carrier wear rate from last measurement of each set were reported at the end of each set. Results are reported in Table 17 (below), wherein “cw” means clockwise and “ccw” means counter-clockwise.
  • Results show an average silicon wafer removal rate of 7.9+/ ⁇ 0.6 ⁇ m/min for Set 1 when run at 14 psi (96 kPa), 96 rpm, 500 mL/minute deionized water, and an average silicon wafer removal rate of 5.4+/ ⁇ 0.7 ⁇ m/min for Set 2 when run at 14 psi (96 kPa), 60 rpm, 500 mL/minute deionized water. These values show a stable wear rate for each set of wafers under the polishing conditions used.
  • the average TDT6EL wear rate was 0.075 microns per minute and the average carrier wear rate was 0.083 micron per minute.
  • the average TDT6EL 6 micron EL Pad wear rate for Set 2 was 0.180 microns per minute.
  • the average carrier wear rate for Set 2 over the 115 minute interval was 0.0180 microns per minute.
  • the decrease in the average Silicon Wafer Removal rate from Set 1 to Set 2 is due to the decrease from the 96 rpm in Set 1 to the 60 rpm in Set 2.
  • Coefficients of friction were measured using the horizontal plane method in which a sled of a single material is drawn across the sample at constant velocity. Seven samples were tested and CoFs calculated to assist in determining wear resistance. Testing was done using a circular steel sled of 15.85 mm diameter 220 grit polished and weight of 80 g. Static CoFs may assess a material's ability to minimize stiction (stick-slip), while kinetic CoFs may aid in predicting wear in dynamic contact with shear motion between two bodies.
  • the spray coated sample CE1 gave a higher CoFs (Static 0.49, Kinetic 0.33) than the other Examples in Table 22.
  • Examples 31, 32, and 33 gave the lowest CoFs of Static 0.28, 0.27, and 0.28; Kinetic 0.21, 0.21, and 0.21.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
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PCT/US2012/045926 WO2013009685A1 (en) 2011-07-11 2012-07-09 Lapping carrier and method of using the same
JP2014520236A JP2014522737A (ja) 2011-07-11 2012-07-09 ラッピングキャリア及びその使用方法
CN201280034326.5A CN103648716A (zh) 2011-07-11 2012-07-09 研磨载体及其使用方法
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US10058970B2 (en) 2014-05-02 2018-08-28 3M Innovative Properties Company Interrupted structured abrasive article and methods of polishing a workpiece
US10556317B2 (en) * 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
CN111318958A (zh) * 2018-12-17 2020-06-23 Ａｇｃ株式会社 玻璃基板的保持用膜体和玻璃基板的研磨方法
US20200263061A1 (en) * 2017-11-08 2020-08-20 3M Innovative Properties Company Adhesive primer for flexographic plate mounting tape
US11298796B2 (en) * 2015-12-11 2022-04-12 Shin-Etsu Handotai Co., Ltd. Method for double-side polishing wafer
US20220204817A1 (en) * 2019-05-07 2022-06-30 3M Innovative Properties Company Adhesive primer for flexographic plate mounting tape

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JP5834331B1 (ja) * 2014-05-08 2015-12-16 冨士ベークライト株式会社 研磨キャリア及びその製造方法
CN105881198A (zh) * 2014-12-29 2016-08-24 天津西美科技有限公司 一种抛光模板用吸附垫片
CN105128448A (zh) * 2015-09-28 2015-12-09 无锡贺邦金属制品有限公司 高耐磨金属制品
WO2017142805A1 (en) * 2016-02-16 2017-08-24 3M Innovative Properties Company Polishing systems and methods of making and using same
CN110000696A (zh) * 2017-12-29 2019-07-12 比亚迪股份有限公司 耐磨治具及其制备方法
US20200171623A1 (en) * 2018-11-30 2020-06-04 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer backside cleaning apparatus and method of cleaning wafer backside
CN113146465B (zh) * 2021-04-06 2023-03-21 安徽禾臣新材料有限公司 一种薄型晶片双面研磨用吸附垫及生产方法
CN115990825A (zh) * 2022-12-27 2023-04-21 西安奕斯伟材料科技股份有限公司 一种硅片双面抛光用的载具、双面抛光装置及硅片

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Publication number Priority date Publication date Assignee Title
US10058970B2 (en) 2014-05-02 2018-08-28 3M Innovative Properties Company Interrupted structured abrasive article and methods of polishing a workpiece
US11298796B2 (en) * 2015-12-11 2022-04-12 Shin-Etsu Handotai Co., Ltd. Method for double-side polishing wafer
US10556317B2 (en) * 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
US11759910B1 (en) 2016-03-03 2023-09-19 P. R. Hoffman Machine Products, Inc. Method of manufacturing wafer holder
US20200263061A1 (en) * 2017-11-08 2020-08-20 3M Innovative Properties Company Adhesive primer for flexographic plate mounting tape
CN111318958A (zh) * 2018-12-17 2020-06-23 Ａｇｃ株式会社 玻璃基板的保持用膜体和玻璃基板的研磨方法
US20220204817A1 (en) * 2019-05-07 2022-06-30 3M Innovative Properties Company Adhesive primer for flexographic plate mounting tape

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KR20140046458A (ko) 2014-04-18
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JP2014522737A (ja) 2014-09-08
WO2013009685A1 (en) 2013-01-17

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