CN103560120B - 一种化学法镀钯铜键合丝及其制备方法 - Google Patents

一种化学法镀钯铜键合丝及其制备方法 Download PDF

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CN103560120B
CN103560120B CN201310559415.8A CN201310559415A CN103560120B CN 103560120 B CN103560120 B CN 103560120B CN 201310559415 A CN201310559415 A CN 201310559415A CN 103560120 B CN103560120 B CN 103560120B
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周晓光
杜连民
向翠华
苏宏福
陈彪
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BEIJING DOUBLINK SOLDERS Co Ltd
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Abstract

本发明公开了一种化学法镀钯铜键合丝及其制备方法。该键合丝的元素质量百分比为：铜的质量百分比大于99.95％，磷的质量百分比为0.003％-0.04％，锰的质量百分比为0.003％-0.01％，余量为不可避免的杂质。本方法通过熔铸和拉丝、成品退火前化学镀钯、退火、清洗、复绕等步骤完成制备，在制备过程中合理使用各种参数。本发明解决了传统镀钯铜丝生产和性能的诸多问题，是镀钯键合铜丝在生产过程中安全、环保、节能、简单，极大程度上的提高了丝材的生产效率，而生产出的丝材性能十分良好、稳定，可以满足高端封装领域对丝材性能质量的要求。

Description

一种化学法镀钯铜键合丝及其制备方法
技术领域
本发明涉及金属键合丝领域，尤其涉及一种化学法镀钯铜键合丝及其制备方法。
背景技术
近几年随着金价不断攀升，封装领域的成本越来越高，目前镀钯铜键合丝代替金丝已经日趋成熟，但是目前国产镀钯铜丝只能应用在低端封装中，而高端封装仍然被国外的镀钯铜丝垄断，而目前世界上的镀钯方法绝大部分为电化学镀钯，工艺繁琐，成本大，污染大。
发明内容
本发明的目的就是针对现有技术存在的问题，提供一种化学法镀钯铜键合丝的制备方法，该方法制备的镀钯铜键合丝性能优秀，并且生产方法安全、节能、环保、简单，极大程度上提高了丝材的生产效率。
上述目的是通过下述方案实现的：
一种制备化学镀钯铜键合丝的方法，所述铜键合丝的元素质量百分比为：铜的质量百分比大于99.95%，磷的质量百分比为0.003%-0.04%，锰的质量百分比为0.003%-0.01%，余量为不可避免的杂质，其特征在于，所述方法包括以下步骤：
（1）熔铸和拉丝：在熔铸过程中加入0.003%-0.04%的磷和0.003%-0.01%的锰，加热方式采用中频加热，连铸方式采用下引式真空连铸，并控制熔铸和拉丝条件为：熔铸温度为1100-1300°C，真空度1.0*10-5Mpa，精炼时间20-40分钟，连铸速度150-300mm/分钟，形成的铜坯直径为4-10mm，拉丝速度为70-120m/min；
（2）化学镀钯：将铜键合丝成品在退火后单根放入镀钯液进行化学镀钯，镀钯液的钯离子浓度为5-20克每升，镀钯条件为镀钯液的pH值控制在9.5-10.3，镀钯液的温度控制在40-60摄氏度；
（3）退火：利用无水乙醇还原氧化铜的特性（CuO+CH3CH2OH—CH3CHO+Cu+H2O），用氮气加无水乙醇代替氮氢混合气进行退火保护；退火温度为250~500°C；
（4）清洗：利用无水乙醇在高温蒸发时爆炸力打掉丝上的脏物；
（5）对清洗后的键合丝进行复绕。
根据上述的制备方法，其特征在于，所述步骤（2）中使用的镀钯液中各成分的浓度为6.67~26.67g/LPdCl、10~20g/LNaH2PO2、100~160ml/LNH4OH、10~60g/LNH4Cl。
根据上述的制备方法，其特征在于，所述化学镀钯、退火、清洗和复绕一体完成，镀钯退火复绕速度为50米每分钟。
本发明的有益效果：本发明将磷和锰元素微量合金运用在键合铜丝领域中，磷元素微量在铜基体可以提高熔体的流动性，改善铜及合金的焊接性能、耐蚀性能，锰可以提高铜的强度和耐蚀性能。本发明的工艺解决了传统镀钯铜丝生产和性能的诸多问题，使镀钯键合铜丝在生产过程中安全、环保、节能、简单，极大程度上的提高了丝材的生产效率，而生产出的丝材性能十分良好、稳定，可以满足高端封装领域对丝材性能质量的要求。
具体实施方式
本发明的化学法镀钯铜键合丝，其元素质量百分比为：铜的质量百分比大于99.95%，磷的质量百分比为0.003%-0.04%，锰的质量百分比为0.003%-0.01%，余量为不可避免的杂质。
本发明将磷和锰元素微量合金第一次运用在键合铜丝领域中，磷元素微量在铜基体可以提高熔体的流动性，改善铜及合金的焊接性能、耐蚀性能，锰可以提高铜的强度和耐蚀性能。使铜基体在均匀合金化过程中提高了强度和抗氧化性。
本发明的制备方法包括以下步骤：
（1）熔铸和拉丝：在熔铸过程中加入0.003%-0.04%的磷和0.003%-0.01%的锰，加热方式采用中频加热，连铸方式采用下引式真空连铸，并控制熔铸和拉丝条件为：熔铸温度为1100-1300°C，真空度1.0*10-5Mpa，精炼时间20-40分钟，连铸速度150-300mm/min（即毫米/分钟），形成的铜坯直径为4-10mm（即毫米），拉丝速度为70-120m/min（即米/分钟）；
（2）化学镀钯：将铜键合丝成品在退火后单根放入镀钯液进行化学镀钯，镀钯液的钯离子浓度为5-20克每升，镀钯条件为镀钯液的pH值控制在9.5-10.3，镀钯液的温度控制在40-60摄氏度；化学还原钯法中使用的镀钯液为弱碱性，使用后为中性，较为环保。成品化学镀钯法的镀后钯层均匀，并且钯层厚度可控。另外传统工艺是在半成品时镀钯，这样丝材变硬，在后道加工时模具消耗量极大，本专利的化学镀钯方法可以最大程度的减小模具用量，节省资源。
（3）退火：利用无水乙醇还原氧化铜的特性（CuO+CH3CH2OH—CH3CHO+Cu+H2O），用氮气加无水乙醇代替氮氢混合气进行退火保护，比氢气还原安全；退火温度为250~500°C；
（4）清洗：利用无水乙醇（无水乙醇在突然达到它的沸点以上的温度时它会轻微无危害的爆炸的原理）在高温蒸发时的爆炸力打掉丝上的脏物；利用无水乙醇在高温蒸发时爆力打掉丝上的脏东西，代替去离子水清洗的步骤，可以节省用水量，节约用水。
（5）对清洗后的键合丝进行复绕。化学镀钯、退火、清洗和复绕一体完成，镀钯退火复绕速度为50米每分钟。
实施例1
（1）熔铸和拉丝：在熔铸过程中加入0.003%的磷和0.003%的锰，加热方式采用中频加热，连铸方式采用下引式真空连铸，并控制熔铸和拉丝条件为：熔铸温度为1100°C，真空度1.0*10-5Mpa，精炼时间20分钟，连铸速度150mm/min，形成的铜坯直径为4mm，拉丝速度为70m/min；
（2）化学镀钯：将铜键合丝成品在退火后单根放入镀钯液进行化学镀钯，镀钯液的，镀钯液成分为6g/LPdCl、10g/LNaH2PO2、100ml/LNH4OH、10g/LNH4Cl，镀钯液的pH值控制在9.5附近，镀钯液的温度控制在40摄氏度；化学还原钯法中使用的包钯液为弱碱性，使用后为中性，较为环保。成品化学镀钯法的镀后钯层均匀，并且钯层厚度可控。另外传统工艺是在半成品时镀钯，这样丝材变硬，在后道加工时模具消耗量极大，本专利的化学镀钯方法可以最大程度的减小模具用量，节省资源。
（3）退火：利用无水乙醇还原氧化铜的特性（CuO+CH3CH2OH—CH3CHO+Cu+H2O），用氮气加无水乙醇代替氮氢混合气进行退火保护，比氢气还原安全；退火温度为250°C；
（4）清洗：利用无水乙醇，在高温蒸发时爆炸力打掉丝上的脏物；利用无水乙醇在高温蒸发时爆力打掉丝上的脏东西，代替去离子水清洗的步骤，可以节省用水量，节约用水。
（5）对清洗后的键合丝进行复绕。化学镀钯、退火、清洗和复绕一体完成，镀钯退火复绕速度为50米每分钟。
实施例3
（1）熔铸和拉丝：在熔铸过程中加入0.04%的磷和0.01%的锰，加热方式采用中频加热，连铸方式采用下引式真空连铸，并控制熔铸和拉丝条件为：熔铸温度为1300°C，真空度1.0*10-5Mpa，精炼时间40分钟，连铸速度300mm每分钟，形成的铜坯直径为10mm，拉丝速度为120m/min；
（2）化学镀钯：将铜键合丝成品在退火后单根放入镀钯液进行化学镀钯，镀钯液成分为6.67g/LPdCl（对应钯离子浓度为5克每升）、10g/LNaH2PO2、100ml/LNH4OH、10g/LNH4Cl，镀钯液的pH值控制在9.5附近，镀钯液的温度控制在40摄氏度；化学还原钯法中使用的包钯液为弱碱性，使用后为中性，较为环保。成品化学镀钯法的镀后钯层均匀，并且钯层厚度可控。另外传统工艺是在半成品时镀钯，这样丝材变硬，在后道加工时模具消耗量极大，本专利的化学镀钯方法可以最大程度的减小模具用量，节省资源。
（3）退火：利用无水乙醇还原氧化铜的特性（CuO+CH3CH2OH—CH3CHO+Cu+H2O），用氮气加无水乙醇代替氮氢混合气进行退火保护，比氢气还原安全；退火温度为500°C；
（4）清洗：利用无水乙醇在高温蒸发时爆炸力打掉丝上的脏物；利用无水乙醇在高温蒸发时爆力打掉丝上的脏东西，代替去离子水清洗的步骤，可以节省用水量，节约用水。
（5）对清洗后的键合丝进行复绕。化学镀钯、退火、清洗和复绕一体完成，镀钯退火复绕速度为50米每分钟。
实施例4
（1）熔铸和拉丝：在熔铸过程中加入0.04%的磷和0.01%的锰，加热方式采用中频加热，连铸方式采用下引式真空连铸，并控制熔铸和拉丝条件为：熔铸温度为1300°C，真空度1.0*10-5Mpa，精炼时间40分钟，连铸速度300mm每分钟，形成的铜坯直径为10mm，拉丝速度为120m/min；
（2）化学镀钯：将铜键合丝成品在退火后单根放入镀钯液进行化学镀钯，镀钯液成分为26.67g/LPdCl（对应钯离子浓度为20克每升）、20g/LNaH2PO2、160ml/LNH4OH、60g/LNH4Cl，镀钯液的pH值控制在10.3附近，镀钯液的温度控制在60摄氏度；化学还原钯法中使用的镀钯液为弱碱性，使用后为中性，较为环保。成品化学镀钯法的镀后钯层均匀，并且钯层厚度可控。另外传统工艺是在半成品时镀钯，这样丝材变硬，在后道加工时模具消耗量极大，本专利的化学镀钯方法可以最大程度的减小模具用量，节省资源。
（3）退火：利用无水乙醇还原氧化铜的特性（CuO+CH3CH2OH—CH3CHO+Cu+H2O），用氮气加无水乙醇代替氮氢混合气进行退火保护，比氢气还原安全；退火温度为500°C；
（4）清洗：利用无水乙醇在高温蒸发时爆炸力打掉丝上的脏物；利用无水乙醇在高温蒸发时爆力打掉丝上的脏东西，代替去离子水清洗的步骤，可以节省用水量，节约用水。
（5）对清洗后的键合丝进行复绕。化学镀钯、退火、清洗和复绕一体完成，镀钯退火复绕速度为50米每分钟。

Claims (3)

1.一种制备化学镀钯铜键合丝的方法，所述铜键合丝的元素质量百分比为：铜的质量百分比大于99.95%，磷的质量百分比为0.003%-0.04%，锰的质量百分比为0.003%-0.01%，余量为不可避免的杂质，其特征在于，所述方法包括以下步骤：
（1）熔铸和拉丝：在熔铸过程中加入0.003%-0.04%的磷和0.003%-0.01%的锰，加热方式采用中频加热，连铸方式采用下引式真空连铸，并控制熔铸和拉丝条件为：熔铸温度为1100-1300°C，真空度1.0*10-5Mpa，精炼时间20-40分钟，连铸速度150-300mm/分钟，形成的铜坯直径为4-10mm，拉丝速度为70-120m/min；
（2）化学镀钯：将铜键合丝成品在退火后单根放入镀钯液进行化学镀钯，镀钯液的钯离子浓度为5-20克每升，镀钯条件为镀钯液的pH值控制在9.5-10.3，镀钯液的温度控制在40-60摄氏度；
（3）退火：利用无水乙醇还原氧化铜的特性（CuO+CH3CH2OH—CH3CHO+Cu+H2O），用氮气加无水乙醇代替氮氢混合气进行退火保护；退火温度为250~500°C；
（4）清洗：利用无水乙醇在高温蒸发时爆炸力打掉丝上的脏物；
（5）对清洗后的键合丝进行复绕。
2.根据权利要求1所述的制备方法，其特征在于，所述步骤（2）中使用的镀钯液中各成分的浓度为6.67~26.67g/LPdCl、10~20g/LNaH2PO2、100~160ml/LNH4OH、10~60g/LNH4Cl。
3.根据权利要求1或2所述的制备方法，其特征在于，所述化学镀钯、退火、清洗和复绕一体完成，镀钯退火复绕速度为50米每分钟。
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