CN103515372A - 光感测式芯片封装结构 - Google Patents
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Abstract
本发明提供一种光感测式芯片封装结构,其包含有一基板;一发光芯片;以及一具有环境光线感测单元与近接感测单元的光学感测芯片。基板包含有一第一凹槽、一第二凹槽与一光线导引槽,第一凹槽与第二凹槽的开放端方向相异。光线导引槽的一开放端与第一凹槽的开放端同侧,另一开放端连通至第二凹槽。发光芯片是设置于第一凹槽内,光学感测芯片是设置于第二凹槽内。发光芯片产生的光线与环境光源经由光线导引槽导引至光学感测芯片,以使光学感测芯片进行作动。
Description
技术领域
本发明涉及一种光感测式芯片封装结构,特别涉及一种具有环境光线感测单元与近接感测单元的光感测式芯片封装结构。
背景技术
消费性电子产品,例如手机,使用越来越多的感测器,以达到节省能源并且增进人机间的互动性。举例来说,目前最新的手机使用到十种以上的感测器。因此工程师们无不汲汲寻求将感测器整合的方法,以期减少能源、空间与成本。
环境光线感测器(ambient light sensor)是用来感测环境光源的变化,改变手机面板的使用亮度。当周遭亮度较暗时,面板亮度跟着变暗避免刺激眼睛,在户外光源较强时,手机面板背光会跟着变亮增加可视度。环境光线感测器根据环境光源改变面板使用亮度,也能达到节能效果,增加手机使用时间。近距感测器(proximity sensor)是一种非接触的物体侦测感应器,在行动装置方面的应用,例如手机的接听防触控功能,一旦使用者的头部靠近听筒,手机触控功能会自动关闭,防止讲电话时脸与面板接触造成的功能误触。环境光线感测器与近接感测器两者因同样都是感测光线,进行作动的光学系统,因此被整合于一封装结构,以共享空间、耗材并且合并电力供应的线路布局。
请参阅图1,为现有的光感测式芯片封装结构示意图。如图所示,现有的结构是将一具有环境光线感测单元10与近接感测单元12的感测器13与一IR LED14并列整合于一封装体16内,也就是目前所谓的三合一封装结构,以节省后续将此封装体16设置于电路板上时所需占据的空间,并简化系统设计时的复杂度。IR LED 14是用以发射红外线光线经靠近手机的物体反射后,供近接感测单元12接收进行作动。但在IR LED 14发光的特性下,IR LED 14的光线也会从IR LED14的侧面射出,使得光信号干扰难以处理。因此,在此结构下的解决方式是在感测器13与IR LED 14间利用各种不同的厚阻光材及封装结构,形成一阻光墙18,来防止IR LED 14与感测器13间的干扰,再者增加感测器13与IR LED14的间距。但厚的阻光材以及感测器与IR LED的间距导致封装面积无法缩小,且因为阻光材的存在也使得封装结构较为复杂。
有鉴于此,本发明遂针对上述现有技术的缺失,提出一种崭新的光感测式芯片封装结构,以有效克服上述问题。
发明内容
本发明的主要目的在提供一种光感测式芯片封装结构,其采迭的设计,因此可缩小封装面积。
本发明的另一目的在提供一种光感测式芯片封装结构,其无须使用现有的阻光墙,因此简化封装结构及制程。
本发明的再一目的在提供一种光感测式芯片封装结构,其能降低光信号干扰的问题。
为达上述目的,本发明提出一种光感测式芯片封装结构,其主要包含有一基板;一发光芯片;以及一光学感测芯片。
基板包含有一第一凹槽、一第二凹槽与一光线导引槽。基板具有不透光性。第一凹槽与第二凹槽的开放端方向相异。光线导引槽的一开放端与第一凹槽的开放端同侧,另一开放端连通至第二凹槽。发光芯片是设置于第一凹槽内,光学感测芯片是设置于第二凹槽内。光学感测芯片具有环境光线感测单元与近接感测单元,发光芯片产生的光线与环境光源经由光线导引槽导引至光学感测芯片,以使光学感测芯片进行作动。
与现有技术相比,本发明具有如下优点:
(1)因为采迭的设计,因此可缩小封装面积。
(2)无须使用现有的阻光墙,因此能简化为了防止光信号干扰的复杂封装结构及制程。
(3)能降低光信号干扰的问题。
附图说明
图1是现有的光感测式芯片封装结构示意图。
图2(a)、图2(b)、图2(c)与图2(d)分别为本发明的光感测式芯片封装结构的立体图、AA’线段剖视图、俯视图与仰视图。
图3是本发明的光感测式芯片封装结构感测光线时的作动示意图。
图4是本发明的光感测式芯片封装结构的另一实施例剖面示意图。
图5是本发明的光感测式芯片封装结构的另一实施例示意图。
附图标记说明:10-环境光线感测器;12-近接感测器;13-感测器;14-IRLED;16-封装体;18-阻光墙;20-光感测式芯片封装结构;22-基板;222-第一凹槽;224-第二凹槽;226-光线导引槽;24-发光芯片;26-光学感测芯片;262-环境光线感测单元;264-近接感测单元;28-金属凸块;30-光反射层;32-第一封装胶体;34-第二封装胶体;36-物体;38-焊垫;40、40’-陶瓷基板;41-开口;42-上盖;44-锡膏。
具体实施方式
请一并参阅图2(a)、图2(b)、图2(c)与图2(d),分别为本发明的光感测式芯片封装结构的立体图、剖视图、俯视图与仰视图。如图所示,本发明的光感测式芯片封装结构20主要包含有一基板22;一发光芯片24;以及一光学感测芯片26。
基板22包含有一第一凹槽222、一第二凹槽224与一光线导引槽226。基板22具有不透光性。第一凹槽222与第二凹槽224的开放端方向相异,且第一凹槽222与第二凹槽224至少有部分迭设。光线导引槽226的一开放端与第一凹槽222的开放端同侧,另一开放端连通至第二凹槽224。
发光芯片24是设置于第一凹槽222内,且此发光芯片24可以是红外线LED。光学感测芯片26是设置于第二凹槽224内。举例来说,光学感测芯片26是使用金属凸块28采覆晶方式装设于第二凹槽224内,并完成光学感测芯片26与基板22的连接。除了金属凸块外,也可以选择锡球或其他方式。
光学感测芯片26具有环境光线感测单元262与近接感测单元264,环境光线感测单元262与近接感测单元264面对光学导引槽226的开口范围内。发光芯片24产生的光线与环境光源经由光线导引槽226导引至光学感测芯片26,以使光学感测芯片26进行作动,降低因发光芯片24侧面发光造成的光信号干扰。
举例来说,第一凹槽222可以如图所示位于基板22的顶面,而第二凹槽224位于基板22的底面,第一凹槽222可以是与第二凹槽224有部分迭设,以缩小封装面积。在这情况下,基板22将形成类似H型的结构。
基板22可以是含有内部导线的单层陶瓷基板或印刷电路板或其他材料,并且在基板22底面含有焊垫38(Solder Pad),以成为SMD元件。此外,第一凹槽222的形状可以是采杯状或者任何形状,以缩小发光芯片24的视角或用以改善发光元件特性。第一凹槽222的底面或表面上有一光反射层30,以增加发光芯片24的发射距离,或形成有一阻光层,以减少光信号干扰。
此外,光线导引槽226在第一凹槽222侧的开放端大于第二凹槽224侧的开放端,如图中所示的采用杯状结构或其他结构,以提升导光率,利于采集发光芯片24产生的光线与环境光源,并导引至光学感测芯片26的感测区域。
本发明的光感测式芯片封装结构20更包含有一第一封装胶体32,填设于第一凹槽222内且覆盖发光芯片24,而第二凹槽224内填设有一第二封装胶体34,且覆盖光学感测芯片26。第一封装胶体32与第二封装胶体34可以是相同透光材质。第一封装胶体32与第二封装胶体34可以是透明的,以有最佳的导光性。
再者,基板22上方可再增加具备开口41的上盖42,如图5所示,并以封装胶材或锡膏44或其它方式结合,以增加抗光信号干扰能力。
请参阅图3,为本发明的光感测式芯片封装结构感测光线时的作动示意图。如图所述,环境光源可经由光线导引槽226导引至光学感测芯片26的环境光线感测单元262。当物体36接近时,则会将发光芯片24产生的光线反射并经由光线导引槽226导引至光学感测芯片26,以供近接感测单元264感测。
请参阅图4,为本发明的光感测式芯片封装结构的另一实施例剖面示意图。此实施例与先前实施例的差异在于基板22是由数个含有内部导线的陶瓷基板40、40’或印刷电路板或其他材料所迭置而成。
在本发明的光感测式芯片封装结构下,具有下列几项优点:
因为采迭的设计,因此可缩小封装面积。
无须使用现有的阻光墙,因此能简化为了防止光信号干扰的复杂封装结构及制程。
能降低光信号干扰的问题。
以上说明对本发明而言只是说明性的,而非限制性的,本领域普通技术人员理解,在不脱离以下所附权利要求所限定的精神和范围的情况下,可做出许多修改,变化,或等效,但都将落入本发明的保护范围内。
Claims (10)
1.一种光感测式芯片封装结构,其特征在于,包含有:
一基板,包含有一第一凹槽、一第二凹槽与一光线导引槽,该基板具有不透光性,该第一凹槽与该第二凹槽的开放端方向相异,该光线导引槽的一开放端与该第一凹槽的开放端同侧,另一开放端连通至该第二凹槽;
一发光芯片,设置于该第一凹槽内;以及
一光学感测芯片,其设置于该第二凹槽内,该光学感测芯片具有环境光线感测单元与近接感测单元,该光学发光芯片产生的光线与环境光源经由该光线导引槽导引至该光学感测芯片,以使该光学感测芯片进行工作。
2.如权利要求1所述的光感测式芯片封装结构,其特征在于,该第一凹槽位于该基板的顶部,该第二凹槽位于该基板的底部,且该第一凹槽与该第二凹槽至少有部分迭设。
3.如权利要求1所述的光感测式芯片封装结构,其特征在于,该第一凹槽的底面或表面上有一光反射层或阻光层。
4.如权利要求1所述的光感测式芯片封装结构,其特征在于,该发光芯片是红外线LED。
5.如权利要求1所述的光感测式芯片封装结构,其特征在于,该光学感测芯片是覆晶封装于该第二凹槽内。
6.如权利要求1所述的光感测式芯片封装结构,其特征在于,更包含有一第一封装胶体与一第二封装胶体,该第一封装胶体是填设于该第一凹槽内且覆盖该发光芯片,该第二封装胶体是填设于该第二凹槽内且覆盖该光学感测芯片,且该第一封装胶体与该第二封装胶体是透光材料。
7.如权利要求1所述的光感测式芯片封装结构,其特征在于,该光线导引槽的开放端在该第一凹槽侧大于该第二凹槽侧。
8.如权利要求1所述的光感测式芯片封装结构,其特征在于,该基板为含有内部导线的陶瓷基板或印刷电路板,且该基板底部设有焊垫,以形成SMD元件。
9.如权利要求8所述的光感测式芯片封装结构,其特征在于,该基板是由数个含有内部导线的陶瓷基板或印刷电路板迭置而成。
10.如权利要求1所述的光感测式芯片封装结构,其特征在于,该基板上方更设有一具备开口的上盖,以增加抗光信号干扰能力。
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