CN103492449B - 环氧树脂及其制备方法及环氧树脂组合物 - Google Patents
环氧树脂及其制备方法及环氧树脂组合物 Download PDFInfo
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Abstract
本发明提供化学式1的环氧树脂模塑料用自熄性环氧树脂。确认到,本发明的环氧树脂(组合物)即使不使用卤素类阻燃剂或磷类阻燃剂也呈现优秀的阻燃性,并且发现与现在最为商用化的日本化学药品公司的NC3000相比阻燃性为同等以上、收缩率也较低而尺寸稳定性优秀、具有更低的弯曲模数的同时玻璃化转变温度更高的环氧树脂模塑料组合物用环氧树脂是具有最理想的物性平衡性的高档级别的环氧树脂模塑料用自熄性环氧树脂。
Description
技术领域
本发明涉及一种环氧树脂模塑料(EMC)用自熄性环氧树脂及其制备方法以及环氧树脂模塑料用环氧树脂组合物。更详细地,提供不使用溴类、磷类等的阻燃剂而在环氧树脂模塑料中具有自熄性的高档(HighEnd)级别的环氧树脂模塑料用自熄性环氧树脂及其制备方法以及环氧树脂模塑料用环氧树脂组合物。
背景技术
环氧树脂模塑料(EMC,EpoxyMoldingCompound)作为使用二氧化硅、环氧树脂、苯酚树脂、碳黑、阻燃剂等10种原料的复合材料,主要用途为,作为用于防止晶体管、二极管、微处理器、半导体存储器等受到热量、水分、冲击等的影响而进行密封的材料的半导体封装材料(密封材料)来使用。
环氧树脂模塑料虽然与半导体的价格相比,其比重小,但是由于是用于保护半导体元器件的结构材料,因此对半导体的功能起到非常重要的影响。尤其,环氧树脂模塑料的混合技术属于决定半导体的质量的核心技术。
可以将高档级别的环氧树脂模塑料的设计定义为平衡工程。由于环氧树脂模塑料要满足总是相克的许多要求特性,例如高玻璃化转变温度Vs低弯曲模量,因此需要高难度的技术。能够最有效地满足相克的要求特性的方法是使用物性平衡性优秀的高性能的环氧树脂。即,在开发高档级别的环氧树脂模塑料方面,高性能的环氧树脂是代表性的核心技术。
在本发明中提出的新颖的环氧树脂可以确保与作为现在商业上最常使用的半导体密封材料的联苯酚醛型环氧树脂的日本化学药品公司的NC3000相比,类似或更优秀的机械特性和可靠性。
另一方面,韩国专利第946206号(苯酚类聚合物及其制备方法以及用途)中提出一种作为用于半导体密封材料的固化剂的新颖结构的苯酚类聚合物,但是在实施例中将上述NC3000作为环氧树脂来使用。
发明内容
本发明起因于发现在对现有技术(韩国专利第946206号)中提出的苯酚类聚合物进行环氧化的情况下,能够提供优秀的物性的环氧树脂模塑料(EMC)用自熄性环氧树脂。
因此,本发明的目的在于,提供下述化学式1的环氧树脂模塑料用自熄性环氧树脂。
化学式1
R1、R3、R4为H或CH3或烷基(Alkylgroup),
R2为(联苯基)或(苄基)
其中,n=1~100的自然数。
并且,本发明提供利用上述化学式1的树脂的环氧树脂模塑料用环氧树脂组合物。
确认到,本发明的环氧树脂(组合物)即使不使用卤素类阻燃剂或磷类阻燃剂也呈现优秀的阻燃性,并且,发现了阻燃性相比现在最商用化的日本化学药品公司的NC3000为同等以上、且因收缩率低而尺寸稳定性优秀、具有更低的弯曲模数的同时玻璃化转变温度则更高的环氧树脂模塑料组合物用环氧树脂是具有最理想的物性平衡性的高档级别的环氧树脂模塑料用自熄性环氧树脂。
为了解决上述问题,本发明者发现了如果将化学式1的环氧树脂作为环氧树脂模塑料组合物来利用,则为了环保而不使用卤素类阻燃剂和磷类阻燃剂,也可以在环氧树脂模塑料中获得具有自熄性且还具有优秀的物性平衡性(balance)的高档级别(高增值)的环氧树脂。
本发明的下述化学式1的树脂是分别对苯酚类和二甲基联苯类及苯甲醛或4-苯基苯甲醛进行反应来进行酚醛化之后,分别对此进行环氧化的高增值用自熄性环氧树脂。
化学式1
R1、R3、R4为H或CH3或烷基,
R2为(联苯基)或(苄基),
其中,n=1~100的自然数。
本发明的效果如下。
1.将本发明的环氧树脂使用于环氧树脂模塑料组合物的情况下,阻燃性呈现出V-O等级,由此可知即使不使用卤素类阻燃剂或磷类阻燃剂也呈现出优秀的阻燃性。并且确认到,与现在商用化的作为日本化学药品公司的NC3000相比也呈现同等以上的阻燃性,并且可以了解到其他物性平衡性也呈现出同等以上的性能。
2.可知,由于收缩率低,因而不仅具有优秀的尺寸稳定性,而且收缩率低于现有商用产品NC3000。
3.一般来说,如果玻璃化转变温度(Tg)高,则存在模数也一同提高的倾向性,但在本发明的物质的情况下(实施例2和实施例5),相比现有商用产品NC3000(比较例1),呈现出高玻璃化转变温度的同时模数相似或更低,由此可知,这对于环氧树脂模塑料的物性而言,具有非常理想的物性平衡性。
具体实施方式
本发明的环氧树脂可通过如下过程制备而得:将对苯酚类和二甲基联苯化合物、芳香醛进行反应而得的苯酚类聚合物制备成环氧树脂并将此制备成环氧组合物。
更仔细地,将苯酚和4,4’-二甲氧基甲基联苯(4,4’-(bismethoxymethylbiphenyl))及4-苯基苯甲醛或苯甲醛制备成酚醛树脂之后,使环氧氯丙烷与酚醛树脂的羟基进行反应来制备环氧树脂。
以下,更加具体地说明本发明的具体实施方式。
实施例1利用4-苯基苯甲醛的酚醛树脂的制备
在附有搅拌机、冷却机的烧瓶放入212g的4-苯基苯甲醛(4-phenylbenzaldehyde)、550g的苯酚、242g的4,4’-二甲氧基甲基联苯(BMMB,4,4’-Bis[methoxy-methylbiphenyl])、58g的纯化水(PPW,purifiedprocesswater)并升温至90℃来进行溶解。作为催化剂投入1.41g的对甲苯磺酸一水合物(PTSA,paratoluenesulfonicacidmonohydrate)进行3小时反应之后,脱水至115℃之后,将苯酚回收至190℃×5torr。接着,滴下20g的纯化水来使残余苯酚含量最小化,从而合成了软化点为99℃、分子量为787、粘度为390cps(150℃)的化学式2的树脂。(第一步骤方法)
在附有搅拌机、冷却机的烧瓶投入212g的4-苯基苯甲醛、550g的苯酚、58g的纯化水并升温至90℃来进行溶解。作为催化剂投入1.41g的对甲苯磺酸一水合物进行1小时反应之后,投入242g的作为第二原料的4,4’-二甲氧基甲基联苯并进行3小时反应后,脱水至115℃后,将苯酚回收至190℃×5torr。接着,滴下20g的纯化水来使残余苯酚含量最小化,从而合成了软化点为99℃、分子量为787、粘度为390cps(150℃)的化学式2的树脂(第二步骤方法)。
化学式2
其中,n=1~100的自然数。
实施例2酚醛环氧树脂的制备
在附有搅拌机、冷却机的烧瓶投入600g的化学式2的树脂和949.6g的环氧氯丙烷(Epichlorohydrin)并进行溶解之后,将150g的50%NaOH水溶液催化剂滴下4小时进行反应之后,回收剩余的环氧氯丙烷。在合成的树脂投入750g的甲基异丁基酮(Methylisobutylketone)、264g的纯化水来进行分液、水洗而除去生成的盐之后回收溶剂,从而合成了当量为270.1g/eq、氯浓度为280ppm、软化点为60.7度(B&R)的化学式3。
化学式3
其中,n=1~100的自然数。
实施例3酚醛环氧树脂组合物的制备
混合作为环氧树脂的在实施例2中制备的化学式3的环氧树脂(100g)、作为固化剂的新酚(xylok)树脂(64.79g)、作为催化剂的三苯磷(1.5g)及作为填充剂(filler)的二氧化硅(1210g)来制备了环氧树脂组合物。
实施例4利用苯甲醛的酚醛树脂的制备
在附有搅拌机、冷却机的烧瓶投入182g的苯甲醛(benzaldehyde)、470g的苯酚、231g的4,4’-二甲氧基甲基联苯、47g的纯化水并升温至90℃来进行溶解。作为催化剂投入1.41g的对甲苯磺酸一水合物进行3小时反应后,脱水至115℃之后,将苯酚回收至190℃×5torr。接着,滴下20g的纯化水来使残余苯酚含量最小化,从而合成了软化点为92℃、分子量为859、粘度为67cps(150℃)的化学式4的树脂。(第一步骤方法)
在附有搅拌机、冷却机的烧瓶投入182g的苯甲醛、470g的苯酚、47g的纯化水并升温至90℃来进行溶解。作为催化剂投入1.41g的对甲苯磺酸一水合物来进行1小时反应后,投入231g的作为第二原料的4,4’-二甲氧基甲基联苯并进行3小时反应后,进行脱水至115℃之后,将苯酚回收至190℃×5torr。接着,滴下20g的纯化水来使残余苯酚含量最小化,从而合成了软化点为92℃、分子量为859、粘度为67cps(150℃)的化学式4的树脂。(第二步骤方法)
化学式4
其中,n=1~100的自然数。
实施例5酚醛环氧树脂的制备
在附有搅拌机、冷却机的烧瓶投入208g的化学式4的树脂和412g的环氧氯丙烷来进行溶解之后,将80g的50%NaOH水溶液催化剂滴下4小时进行反应之后回收剩余的环氧氯丙烷。在合成的树脂投入528g的甲基异丁基酮、264g的纯化水并进行分液、水洗而除去生成的盐之后回收溶剂,从而合成当量为237.8g/eq、氯浓度为87ppm、软化点为60度(B&R)的化学式5。
化学式5
其中,n=1~100的自然数。
实施例6酚醛环氧树脂组合物的制备
混合作为环氧树脂的在实施例5中制备的化学式5的环氧树脂(100g)、作为固化剂的新酚树脂(73.6g)、作为催化剂的三苯磷(1.5g)及作为填充剂(filler)的二氧化硅(1283g)来制备了环氧树脂组合物。
比较例1
除了作为自熄性环氧树脂使用作为最商用化的树脂的NC-3000(日本化学药品公司)以外,通过与实施例3相同的方法制备了环氧树脂组合物。
比较例2
除了作为环氧树脂使用作为普通类型的邻甲酚酚醛环氧树脂的YDCN-500-4P(韩国国都化学有限公司产品)来代替自熄性环氧树脂以外,通过与实施例3相同的方法制备了环氧树脂组合物。
在表1中表示了通过上述方法制备的环氧树脂(使用通过第二步骤方法制备的树脂)及在比较例中使用的环氧树脂的普通特性。
表1
通过实施例2和实施例5获得的环氧树脂的特性及在比较例1和比较例2中使用的环氧树脂的特性
环氧树脂组合物的成分和含量见表2。
表2
环氧树脂模塑料组合物的原料物质成分及含量
胶化时间(GelTime)的测定
为了评价环氧树脂组合物的反应性而测定了胶化时间等。将脱离干燥状态的树脂并制备成粉末(powder)形态的1g的试样放在175℃的加热板(hotplate)上测定时间,即测定利用牙签搅拌并抬起时树脂像纱线一样延伸的时间。
阻燃性的测定
为了测定环氧树脂组合物的阻燃性,根据UL-94标准利用垂直燃烧法来评价了阻燃性。上述阻燃性的测定,用火焰烧焦试样10秒钟之后,除去火焰,并确认了在几秒钟内熄灭,如果在10秒钟内熄灭则呈现出ULV-0等级的阻燃性。
收缩率的测定
准备模具和试验片,并根据用卡尺测定的环氧树脂模塑料的收缩率测定方法来测定了模具和试验片的长度。
耐热性的测定
在90℃下维持2小时环氧树脂组合物之后,在150℃下维持4小时来进行固化后,通过差示扫描量热法(DSC,differentialscanningcalorimetry)分析来测定了玻璃化转变温度(Tg)。
弯曲强度及弯曲模量
准备试验片,以微米测定了试验片的宽度和厚度,并通过利用U.T.M试验机的方法测定了弯曲强度及弯曲模量。
将以上的结果表示在表3
表3
如表3所示,在使用本发明的环氧树脂的情况下,可以制备出即使不使用卤素类、磷类阻燃剂也具有优秀的阻燃性,尺寸稳定性优秀且物性平衡性也优秀的环氧树脂模塑料。
Claims (4)
1.一种环氧树脂,其特征在于,由下述化学式1表示:
R1、R3、R4为H或烷基,
R2为
其中,n=1~100的自然数。
2.一种制备环氧树脂的方法,其特征在于,包括如下步骤:
(1)在附有搅拌机、冷却机的烧瓶放入212g的4-苯基苯甲醛、550g的苯酚、242g的4,4’-二甲氧基甲基联苯、58g的纯化水并升温至90℃来进行溶解后,作为催化剂投入1.41g的对甲苯磺酸一水合物进行3小时反应后,进行脱水至115℃后,将苯酚回收至190℃×5torr之后,滴下20g的纯化水来使残余苯酚含量最小化,从而合成化学式2的树脂的步骤,或者
在附有搅拌机、冷却机的烧瓶放入212g的4-苯基苯甲醛、550g的苯酚、58g的纯化水并升温至90℃来进行溶解之后,作为催化剂投入1.41g的对甲苯磺酸一水合物进行1小时反应后,投入242g的作为第二原料的4,4’-二甲氧基甲基联苯并进行3小时反应后进行脱水至115℃之后,将苯酚回收至190℃×5torr之后,滴下20g的纯化水来使残余苯酚含量最小化,从而合成化学式2的树脂的步骤,
其中,n=1~100的自然数;
(2)在附有搅拌机、冷却机的烧瓶投入600g的化学式2的树脂和949.6g的环氧氯丙烷进行溶解之后,将150g的50%NaOH水溶液催化剂滴下4小时进行反应后回收剩余的环氧氯丙烷之后,在合成的树脂投入750g的甲基异丁基酮、264g的纯化水来进行分液、水洗而除去生成的盐之后回收溶剂,从而制备化学式3的环氧树脂的步骤,
其中,n=1~100的自然数。
3.一种合成环氧树脂的方法,其特征在于,包括如下步骤:
1)在附有搅拌机、冷却机的烧瓶投入182g的苯甲醛、470g的苯酚、231g的4,4’-二甲氧基甲基联苯、47g纯化水并升温至90℃来进行溶解之后,作为催化剂投入1.41g的对甲苯磺酸一水合物来进行3小时反应后,进行脱水至115℃后,将苯酚回收至190℃×5torr之后,滴下20g的纯化水来使残余苯酚含量最小化,从而制备化学式4的树脂的步骤,或者
在附有冷却机的烧瓶投入182g的苯甲醛、470g的苯酚、47g的纯化水并升温至90℃来进行溶解之后,作为催化剂投入1.41g的对甲苯磺酸一水合物来进行1小时反应后,投入231g的作为第二原料的4,4’-二甲氧基甲基联苯并进行3小时后,进行脱水至115℃后,将苯酚回收至190℃×5torr之后,滴下20g的纯化水来使残余苯酚含量最小化,从而合成化学式4的树脂的步骤,
其中,n=1~100的自然数;
2)在附有搅拌机、冷却机的烧瓶投入208g的化学式4的树脂和412g的环氧氯丙烷来进行溶解之后,将80g的50%NaOH水溶液催化剂滴下4小时进行反应之后回收剩余的环氧氯丙烷之后,在合成的树脂投入528g的甲基异丁基酮、264g的纯化水来进行分液、水洗而除去生成的盐之后回收溶剂,从而合成化学式5的树脂的步骤,
其中,n=1~100的自然数。
4.一种环氧树脂模塑料用环氧树脂组合物,其特征在于,上述环氧树脂模塑料用环氧树脂组合物在通过权利要求2或3所述的方法合成的环氧树脂中混合固化剂、催化剂及填充剂而形成。
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CN1962713A (zh) * | 2005-11-07 | 2007-05-16 | 中国科学院化学研究所 | 含氟酚醛树脂衍生物及其组合物与制备方法 |
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