CN103488055A - 曝光装置、曝光方法 - Google Patents

曝光装置、曝光方法 Download PDF

Info

Publication number
CN103488055A
CN103488055A CN201310228361.7A CN201310228361A CN103488055A CN 103488055 A CN103488055 A CN 103488055A CN 201310228361 A CN201310228361 A CN 201310228361A CN 103488055 A CN103488055 A CN 103488055A
Authority
CN
China
Prior art keywords
substrate
exposure
maintaining part
exposure position
exposure device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310228361.7A
Other languages
English (en)
Chinese (zh)
Inventor
三宅健
高木俊博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanei Giken Co Ltd
Original Assignee
Sanei Giken Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanei Giken Co Ltd filed Critical Sanei Giken Co Ltd
Publication of CN103488055A publication Critical patent/CN103488055A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/265—Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Nonlinear Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
CN201310228361.7A 2012-06-12 2013-06-08 曝光装置、曝光方法 Pending CN103488055A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012132802A JP6082884B2 (ja) 2012-06-12 2012-06-12 露光装置、露光方法
JP2012-132802 2012-06-12

Publications (1)

Publication Number Publication Date
CN103488055A true CN103488055A (zh) 2014-01-01

Family

ID=49828382

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310228361.7A Pending CN103488055A (zh) 2012-06-12 2013-06-08 曝光装置、曝光方法

Country Status (4)

Country Link
JP (1) JP6082884B2 (enrdf_load_stackoverflow)
KR (1) KR102205976B1 (enrdf_load_stackoverflow)
CN (1) CN103488055A (enrdf_load_stackoverflow)
TW (1) TWI603158B (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105217311A (zh) * 2015-09-09 2016-01-06 合肥芯碁微电子装备有限公司 一种ldi单机自动装置
CN107436538A (zh) * 2016-05-26 2017-12-05 倍科有限公司 双面光刻装置以及双面光刻装置中掩膜与工件的对准方法
CN109656104A (zh) * 2018-12-26 2019-04-19 深圳市华星光电半导体显示技术有限公司 一种基板曝光方法及装置
CN110647017A (zh) * 2019-10-26 2020-01-03 东莞科视自动化科技有限公司 一种自动对位曝光设备及方法
CN115335772A (zh) * 2020-03-23 2022-11-11 三荣技研股份有限公司 曝光装置及曝光方法
CN116520643A (zh) * 2022-01-24 2023-08-01 成都辰显光电有限公司 基板制备方法及显示面板

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201643558A (zh) * 2015-03-31 2016-12-16 尼康股份有限公司 曝光裝置、平面顯示器之製造方法、元件製造方法、及曝光方法
TWI743845B (zh) * 2015-03-31 2021-10-21 日商尼康股份有限公司 曝光裝置、平面顯示器之製造方法、元件製造方法、及曝光方法
TW201704892A (zh) * 2015-03-31 2017-02-01 尼康股份有限公司 曝光裝置、平面顯示器之製造方法、元件製造方法、及曝光方法
CN110286563A (zh) * 2019-06-19 2019-09-27 深圳凯世光研股份有限公司 一种循环式扫描曝光机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005015615A1 (ja) * 2003-08-07 2005-02-17 Nikon Corporation 露光方法及び露光装置、ステージ装置、並びにデバイス製造方法
JP2008046457A (ja) * 2006-08-18 2008-02-28 Orc Mfg Co Ltd 描画装置
US20080187871A1 (en) * 2007-02-02 2008-08-07 Fujifilm Corporation Pattern forming apparatus and method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004012900A (ja) * 2002-06-07 2004-01-15 Fuji Photo Film Co Ltd 露光装置
JP2006350022A (ja) * 2005-06-16 2006-12-28 Fujifilm Holdings Corp 描画装置及び描画方法
US7429532B2 (en) 2005-08-08 2008-09-30 Applied Materials, Inc. Semiconductor substrate process using an optically writable carbon-containing mask
JP4887165B2 (ja) * 2007-02-02 2012-02-29 富士フイルム株式会社 描画装置及び方法
JP5420942B2 (ja) * 2009-03-19 2014-02-19 大日本スクリーン製造株式会社 パターン描画装置およびパターン描画方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005015615A1 (ja) * 2003-08-07 2005-02-17 Nikon Corporation 露光方法及び露光装置、ステージ装置、並びにデバイス製造方法
JP2008046457A (ja) * 2006-08-18 2008-02-28 Orc Mfg Co Ltd 描画装置
US20080187871A1 (en) * 2007-02-02 2008-08-07 Fujifilm Corporation Pattern forming apparatus and method

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105217311A (zh) * 2015-09-09 2016-01-06 合肥芯碁微电子装备有限公司 一种ldi单机自动装置
CN107436538A (zh) * 2016-05-26 2017-12-05 倍科有限公司 双面光刻装置以及双面光刻装置中掩膜与工件的对准方法
CN107436538B (zh) * 2016-05-26 2019-03-12 倍科有限公司 双面光刻装置以及双面光刻装置中掩膜与工件的对准方法
CN109656104A (zh) * 2018-12-26 2019-04-19 深圳市华星光电半导体显示技术有限公司 一种基板曝光方法及装置
CN109656104B (zh) * 2018-12-26 2021-03-16 深圳市华星光电半导体显示技术有限公司 一种基板曝光方法及装置
CN110647017A (zh) * 2019-10-26 2020-01-03 东莞科视自动化科技有限公司 一种自动对位曝光设备及方法
CN115335772A (zh) * 2020-03-23 2022-11-11 三荣技研股份有限公司 曝光装置及曝光方法
CN116520643A (zh) * 2022-01-24 2023-08-01 成都辰显光电有限公司 基板制备方法及显示面板
CN116520643B (zh) * 2022-01-24 2025-08-01 成都辰显光电有限公司 基板制备方法及显示面板

Also Published As

Publication number Publication date
JP6082884B2 (ja) 2017-02-22
KR20130139170A (ko) 2013-12-20
TWI603158B (zh) 2017-10-21
TW201351067A (zh) 2013-12-16
JP2013257409A (ja) 2013-12-26
KR102205976B1 (ko) 2021-01-20

Similar Documents

Publication Publication Date Title
CN103488055A (zh) 曝光装置、曝光方法
CN103097959B (zh) 移动体装置、曝光装置、元件制造方法、平板显示器的制造方法、及物体交换方法
JP6522735B2 (ja) 部品実装機
CN101672800B (zh) 用于承载盘内的芯片的检测系统及其检测方法
CN105954976A (zh) 物体处理装置、曝光装置及曝光方法、以及元件制造方法
CN107017191A (zh) 搬送装置、搬送方法、曝光装置、以及元件制造方法
CN109324485A (zh) 曝光方法、制造方法和基板处理方法
KR101384440B1 (ko) 물체의 반출입 방법 및 반출입 장치, 노광 방법 및 노광장치와 디바이스 제조 방법
CN106019852A (zh) 曝光装置、物体的更换方法、曝光方法、以及元件制造方法
CN104249547A (zh) 位置检测装置、基板制造装置、位置检测方法及基板的制造方法
TW200907332A (en) Optical measurement apparatus and substrate holding apparatus
CN109557768A (zh) 曝光装置以及曝光方法
CN107211568A (zh) 检查辅助装置及检查辅助方法
CN101131545B (zh) 描画装置以及对位方法
CN104977812A (zh) 曝光装置以及用于制造物品的方法
CN101213494A (zh) 描绘装置及描绘方法
JP6964652B2 (ja) ３次元実装装置及び３次元実装方法
CN102389876B (zh) 透镜分拣设备和透镜分拣方法
JP6043993B2 (ja) 部品実装装置、情報処理装置、情報処理方法及び基板の製造方法
CN106461903A (zh) 透镜元件搬送机构、透镜驱动装置、光轴调整装置、光学模组制造设备及其制造方法
JP7458950B2 (ja) 描画システム
KR20230031140A (ko) 묘화 장치 및 묘화 방법
JPWO2019202678A1 (ja) 部品認識装置、部品実装機および部品認識方法
CN110199588A (zh) 元件安装装置
JPWO2019234822A1 (ja) 印刷装置および印刷装置の使用方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140101