CN103430282A - 显示面板用基板的制造装置 - Google Patents
显示面板用基板的制造装置 Download PDFInfo
- Publication number
- CN103430282A CN103430282A CN201280013987XA CN201280013987A CN103430282A CN 103430282 A CN103430282 A CN 103430282A CN 201280013987X A CN201280013987X A CN 201280013987XA CN 201280013987 A CN201280013987 A CN 201280013987A CN 103430282 A CN103430282 A CN 103430282A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- air
- heat treatment
- display panel
- treatment chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-090107 | 2011-04-14 | ||
JP2011090107 | 2011-04-14 | ||
PCT/JP2012/059455 WO2012141081A1 (ja) | 2011-04-14 | 2012-04-06 | 表示パネル用基板の製造装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103430282A true CN103430282A (zh) | 2013-12-04 |
Family
ID=47009256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280013987XA Pending CN103430282A (zh) | 2011-04-14 | 2012-04-06 | 显示面板用基板的制造装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5639262B2 (ja) |
CN (1) | CN103430282A (ja) |
WO (1) | WO2012141081A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014173095A1 (zh) * | 2013-04-22 | 2014-10-30 | 合肥京东方光电科技有限公司 | 检测设备 |
WO2016165285A1 (zh) * | 2015-04-15 | 2016-10-20 | 京东方科技集团股份有限公司 | 液晶面板的制造方法及加热装置 |
CN106647173A (zh) * | 2017-02-24 | 2017-05-10 | 武汉华星光电技术有限公司 | 烘烤设备 |
CN112460995A (zh) * | 2019-09-09 | 2021-03-09 | 佰世尔科技有限公司 | 显示面板热处理室装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104385778B (zh) * | 2014-10-27 | 2017-05-17 | 合肥京东方光电科技有限公司 | 一种取向膜印刷设备和取向膜印刷系统 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001116458A (ja) * | 1999-10-19 | 2001-04-27 | Nec Kagoshima Ltd | クリーンオーブン及びその使用方法 |
JP2002359180A (ja) * | 2001-06-01 | 2002-12-13 | Toshiba Corp | ガス循環システム |
CN101314516A (zh) * | 2007-05-29 | 2008-12-03 | 爱斯佩克株式会社 | 热处理装置 |
JP2009243879A (ja) * | 2006-07-13 | 2009-10-22 | Espec Corp | 熱処理装置 |
JP2011023530A (ja) * | 2009-07-15 | 2011-02-03 | Tokyo Electron Ltd | 基板処理装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS64738A (en) * | 1988-05-20 | 1989-01-05 | Hitachi Ltd | Heat treatment of semiconductor wafer |
JP3225344B2 (ja) * | 1996-01-26 | 2001-11-05 | 東京エレクトロン株式会社 | 処理装置 |
JP4341978B2 (ja) * | 2007-03-02 | 2009-10-14 | 東京エレクトロン株式会社 | 基板処理装置 |
JP4542577B2 (ja) * | 2007-09-19 | 2010-09-15 | 東京エレクトロン株式会社 | 常圧乾燥装置及び基板処理装置及び基板処理方法 |
-
2012
- 2012-04-06 WO PCT/JP2012/059455 patent/WO2012141081A1/ja active Application Filing
- 2012-04-06 JP JP2013509871A patent/JP5639262B2/ja not_active Expired - Fee Related
- 2012-04-06 CN CN201280013987XA patent/CN103430282A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001116458A (ja) * | 1999-10-19 | 2001-04-27 | Nec Kagoshima Ltd | クリーンオーブン及びその使用方法 |
JP2002359180A (ja) * | 2001-06-01 | 2002-12-13 | Toshiba Corp | ガス循環システム |
JP2009243879A (ja) * | 2006-07-13 | 2009-10-22 | Espec Corp | 熱処理装置 |
CN101314516A (zh) * | 2007-05-29 | 2008-12-03 | 爱斯佩克株式会社 | 热处理装置 |
JP2011023530A (ja) * | 2009-07-15 | 2011-02-03 | Tokyo Electron Ltd | 基板処理装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014173095A1 (zh) * | 2013-04-22 | 2014-10-30 | 合肥京东方光电科技有限公司 | 检测设备 |
WO2016165285A1 (zh) * | 2015-04-15 | 2016-10-20 | 京东方科技集团股份有限公司 | 液晶面板的制造方法及加热装置 |
US9709840B2 (en) | 2015-04-15 | 2017-07-18 | Boe Technology Group Co., Ltd. | Method for producing liquid crystal panel and heating device |
CN106647173A (zh) * | 2017-02-24 | 2017-05-10 | 武汉华星光电技术有限公司 | 烘烤设备 |
CN112460995A (zh) * | 2019-09-09 | 2021-03-09 | 佰世尔科技有限公司 | 显示面板热处理室装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2012141081A1 (ja) | 2012-10-18 |
JP5639262B2 (ja) | 2014-12-10 |
JPWO2012141081A1 (ja) | 2014-07-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131204 |