CN103390715B - A kind of LED of AlSiC composite base plate encapsulation - Google Patents
A kind of LED of AlSiC composite base plate encapsulation Download PDFInfo
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- CN103390715B CN103390715B CN201310301070.6A CN201310301070A CN103390715B CN 103390715 B CN103390715 B CN 103390715B CN 201310301070 A CN201310301070 A CN 201310301070A CN 103390715 B CN103390715 B CN 103390715B
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- copper film
- light source
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Abstract
The invention discloses the LED of a kind of AlSiC composite base plate encapsulation, including surface is coated with the AlSiC composite radiating substrate of copper film and silverskin, LED light source module, gold thread and aluminium oxide ceramics frame successively；Described LED light source module is encapsulated on AlSiC composite radiating substrate；Described aluminium oxide ceramics frame is located at outside LED light source module, bonding with LED light source module；Being coated with two copper film electrodes on described aluminium oxide ceramics frame, two copper film electrodes are connected with the positive and negative electrode of LED light source module by gold thread respectively.The LED of the present invention, AlSiC composite base plate and LED chip material thermal expansion coefficient match, the LED chip difficult drop-off of encapsulation on plate, improve the service life of LED.
Description
Technical field
The present invention relates to the LED of encapsulation on plate, particularly to the LED of a kind of AlSiC composite base plate encapsulation.
Background technology
As microelectronic component develops to high-performance, lightweight and miniaturization, microelectronics is to encapsulating material
Increasingly harsher requirement is proposed.Traditional encapsulating material includes silicon substrate, metal substrate and ceramic substrate etc..
Silicon and ceramic substrate processing difficulties, cost is high, and thermal conductivity is low；The thermal coefficient of expansion of metal material and microelectronics
Chip does not mates, in use the warpage by generation thermal stress.Therefore, these traditional encapsulating materials
It is difficult to meet the challenging needs of base plate for packaging.For great power LED, this is particularly important.
The heat-radiating substrate material of new research and development has metal-core printed circuit board (MCPCB), covers copper pottery both at home and abroad
Plate (DBC) and Metal Substrate low-temperature sintered ceramics substrate (LTCC-M).Wherein, metal-core printed circuit board
Thermal conductivity is limited by insulating barrier, and thermal conductivity is low, and can not realize encapsulating on plate；Cover copper ceramic wafer to use
Pottery together with metal bonding, is improve thermal conductivity by Direct Bonding mode, makes thermal coefficient of expansion simultaneously
Control is a suitable scope, but the respond of metal and pottery is low, and wetability is bad so that bonding
Difficulty is high, and interface bond strength is low, easy to fall off；Metal Substrate low-temperature sintered ceramics substrate is to compact dimensions precision
Require height, complex process, there is metal and a pottery wetability difficult problem bad, caducous too.
Content of the invention
In order to overcome disadvantages mentioned above and the deficiency of prior art, it is an object of the invention to provide one AlSiC
The LED of composite base plate encapsulation, AlSiC composite base plate matches with LED chip material thermal expansion coefficient, plate
The LED chip difficult drop-off of upper encapsulation, improves the service life of LED.
The purpose of the present invention is achieved through the following technical solutions:
The LED of a kind of AlSiC composite base plate encapsulation, including surface is coated with the AlSiC of copper film and silverskin successively
Composite radiating substrate, LED light source module, gold thread and aluminium oxide ceramics frame；Described LED light source module is sealed
It is contained on AlSiC composite radiating substrate；Described aluminium oxide ceramics frame is located at outside LED light source module, with
LED light source module bonding；It is coated with two copper film electrodes, two copper film electrodes on described aluminium oxide ceramics frame
It is connected with the positive and negative electrode of LED light source module by gold thread respectively.
Described copper film includes ground floor copper film and second layer copper film, and described ground floor copper film uses the method for chemical plating
Preparing on the surface of AlSiC composite radiating substrate, described second layer copper film uses electric plating method at ground floor
Prepared by the surface of copper film.
The thickness of described ground floor copper film is 0.8-1 μm.
The thickness of described second layer copper film is 10-20 μm.
Described silverskin uses the method for cyanideless electro-plating to prepare.
Described LED light source module uses COB(chip on board, is called for short COB) packaging technology is encapsulated in
On AlSiC composite radiating substrate.
Compared with prior art, the present invention has the following advantages and beneficial effect:
(1) present invention uses AlSiC composite radiating substrate, and the AlSiC composite prices of raw materials are cheap,
Can near-net-shape complicated shape, and have that thermal conductivity is high, the coefficient of expansion is adjustable, specific stiffness is big, density is little,
The LED structure of the present invention is simple, perfect heat-dissipating, described composite base plate and LED chip material heat expansion
Coefficient matches, and makes the LED chip difficult drop-off of encapsulation on plate, improves the service life of LED, and tool
Have the advantages such as power density height, reliability height and light weight.
(2) it is coated with ground floor copper film, second layer copper film and silver successively on the AlSiC composite radiating substrate of the present invention
Film, can improve substrate reflectivity after plated film silver, improve the light extraction efficiency of LED light source module, it is adaptable to efficiently
The manufacture of great power LED.
(3) present invention uses aluminium oxide ceramics frame to encapsulate, with ceramic frame as insulating barrier.AlSiC is
Semi-conducting material, has certain electric conductivity, directly does copper film electrode on AlSiC substrate and may result in
The generation of short circuit phenomenon.Therefore, on AlSiC substrate, LED chip periphery pastes a upper ceramic frame,
And on pottery, do the circuits such as electrode, it is possible to prevent the appearance of short circuit phenomenon, simultaneously ceramic frame low cost,
Easily install, be suitable for large-scale production.
Brief description
Fig. 1 is the LED profile with the encapsulation of AlSiC composite base plate of embodiments of the invention 1.
Fig. 2 is the LED top view with the encapsulation of AlSiC composite base plate of embodiments of the invention 1.
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, the present invention is described in further detail, but the enforcement of the present invention
Mode is not limited to this.
Embodiment
As shown in Fig. 1～2, the LED of a kind of AlSiC composite base plate encapsulation of the present embodiment, including surface
It is coated with AlSiC composite radiating substrate the 1st, LED light source module the 4th, gold thread 6 and of copper film 2 and silverskin 3 successively
Aluminium oxide ceramics frame 8；Described LED light source module 4 uses COB packaging technology to be encapsulated in AlSiC and is combined
On heat-radiating substrate 1；Described aluminium oxide ceramics frame 8 is located at outside LED light source module 4, with LED light source
Module 4 bonding；It is coated with two copper film electrodes 7,7 points of two copper film electrodes on described aluminium oxide ceramics frame 8
Tong Guo gold thread 6 not be connected with the positive and negative electrode of LED light source module 4, transparent silica gel 5 wraps up gold thread the 6th, copper
The part that membrane electrode 7 is connected with gold thread 6.
Described copper film includes ground floor copper film and second layer copper film, and described ground floor copper film uses the side of chemical plating
Method is prepared on the surface of AlSiC composite radiating substrate, and thickness is 0.8 μm；Described second layer copper film uses plating
Method prepare on the surface of ground floor copper film, thickness is 10 μm.
The size of described LED light source module 4 can be 30mm*30mm, 40mm*40mm or
50mm*50mm, corresponding respectively is the LED that power is 20W-40W, 40W-60W, 60W-100W
Light source module.
The preparation process with the LED of AlSiC composite base plate encapsulation of the present embodiment is as follows:
(1) the AlSiC composite base plate without polished and cleaned is polished to minute surface.After polishing, use acetone respectively
With the AlSiC composite base plate described in soaked in absolute ethyl alcohol, and put it in ultrasonic washing instrument clean 15 points
Clock, to remove the foreign material such as the grease adhering on substrate.
(2) metalized is carried out to AlSiC composite base plate: useization on the surface of AlSiC composite base plate
Learning the method plating ground floor copper film of plating, thickness is 0.8 μm.The purpose of plating ground floor copper film is to make AlSiC
Composite base plate conducts electricity, and prepares for plating below.The size of described ground floor copper film and LED light source module chi
Very little consistent.
(3) on the surface of ground floor copper film, second layer copper film, the position of second layer copper film are plated with electric plating method
Putting and size being consistent with ground floor copper film, thickness is 10 μm.
(4) method at the surface cyanideless electro-plating of second layer copper film plates silverskin, at room temperature, electroplates 30
Minute, the position of silverskin is consistent with second layer copper film with size.
(5) after the process of the silver-plated film of AlSiC composite base plate, according to method for packing on traditional plate, by LED
Light source module is encapsulated on described silverskin.At the outer one piece of aluminum oxide frame of side bonds of LED light source module；Described
It is coated with two copper film electrodes on aluminum oxide frame.Utilize gold thread that two copper film electrodes are connected LED light source respectively
The both positive and negative polarity of module.Finally by the part that transparent silica gel wraps up gold thread, copper film electrode is connected with gold thread.
Embodiment 2
The present embodiment is in addition to following characteristics, and remaining feature is same with embodiment 1.
The thickness with the ground floor copper film of the LED of AlSiC composite base plate encapsulation of the present embodiment is 1 μm, institute
The thickness stating second layer copper film is 20 μm.
Above-described embodiment is the present invention preferably embodiment, but embodiments of the present invention are not by described reality
Execute the restriction of example, the change made under other any Spirit Essence without departing from the present invention and principle, modification,
Substitute, combine, simplify, all should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (5)
1. the LED with the encapsulation of AlSiC composite base plate, it is characterised in that include that surface is coated with copper successively
The AlSiC composite radiating substrate of film and silverskin, LED light source module, gold thread and aluminium oxide ceramics frame；Institute
State LED light source module to be encapsulated on AlSiC composite radiating substrate；Described aluminium oxide ceramics frame is located at LED
Outside light source module, bonding with LED light source module；It is coated with two copper film electricity on described aluminium oxide ceramics frame
Pole, two copper film electrodes are connected with the positive and negative electrode of LED light source module by gold thread respectively；Described copper film bag
Including ground floor copper film and second layer copper film, described ground floor copper film uses the method for chemical plating to be combined at AlSiC
Prepared by the surface of heat-radiating substrate, described second layer copper film uses electric plating method in the surface system of ground floor copper film
Standby.
2. the LED of AlSiC composite base plate according to claim 1 encapsulation, it is characterised in that institute
The thickness stating ground floor copper film is 0.8-1 μm.
3. the LED of AlSiC composite base plate according to claim 1 encapsulation, it is characterised in that institute
The thickness stating second layer copper film is 10-20 μm.
4. the LED of AlSiC composite base plate according to claim 1 encapsulation, it is characterised in that institute
Stating silverskin uses the method for cyanideless electro-plating to prepare.
5. the LED of AlSiC composite base plate according to claim 1 encapsulation, it is characterised in that institute
Stating LED light source module uses COB packaging technology to be encapsulated on AlSiC composite radiating substrate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310301070.6A CN103390715B (en) | 2013-07-16 | 2013-07-16 | A kind of LED of AlSiC composite base plate encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310301070.6A CN103390715B (en) | 2013-07-16 | 2013-07-16 | A kind of LED of AlSiC composite base plate encapsulation |
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| CN103390715A CN103390715A (en) | 2013-11-13 |
| CN103390715B true CN103390715B (en) | 2016-10-05 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109309065B (en) * | 2017-07-27 | 2023-05-05 | 比亚迪股份有限公司 | Heat dissipation element, preparation method thereof and IGBT module |
| CN108358641B (en) * | 2018-03-23 | 2021-01-05 | 陕西科技大学 | Al (aluminum)4SiC4Method for preparing ceramic material |
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| CN101673790A (en) * | 2008-09-11 | 2010-03-17 | 先进开发光电股份有限公司 | Light-emitting diode and manufacturing method thereof |
| CN201435407Y (en) * | 2009-07-06 | 2010-03-31 | 晶诚（郑州）科技有限公司 | Novel substrate used for encapsulating LED |
| CN201927604U (en) * | 2010-10-29 | 2011-08-10 | 京东方科技集团股份有限公司 | LED (light-emitting diode) light source |
| CN102270730A (en) * | 2011-07-27 | 2011-12-07 | 晶科电子（广州）有限公司 | LED (light emitting diode) device free of gold wires |
| CN102569625A (en) * | 2012-01-05 | 2012-07-11 | 中国计量学院 | Copper line-clad aluminum silicon carbide ceramic substrate applicable to radiation of high-power LED |
| CN203434193U (en) * | 2013-07-16 | 2014-02-12 | 华南理工大学 | LED packaged by use of AlSiC composite substrate |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201795340U (en) * | 2010-08-26 | 2011-04-13 | 杭州创元光电科技有限公司 | LED chip light source module manufactured by display chips |
| CN202454557U (en) * | 2012-02-14 | 2012-09-26 | 张家港市金港镇东南电子厂 | LED integrated module |
| CN102891141A (en) * | 2012-10-26 | 2013-01-23 | 张家港东能电子科技有限公司 | Waterproof anti-corrosion high-heat dispersion and high-insulation LED (Light-Emitting Diode) ceramic integrated light source and manufacturing method of the same |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101673790A (en) * | 2008-09-11 | 2010-03-17 | 先进开发光电股份有限公司 | Light-emitting diode and manufacturing method thereof |
| CN201435407Y (en) * | 2009-07-06 | 2010-03-31 | 晶诚（郑州）科技有限公司 | Novel substrate used for encapsulating LED |
| CN201927604U (en) * | 2010-10-29 | 2011-08-10 | 京东方科技集团股份有限公司 | LED (light-emitting diode) light source |
| CN102270730A (en) * | 2011-07-27 | 2011-12-07 | 晶科电子（广州）有限公司 | LED (light emitting diode) device free of gold wires |
| CN102569625A (en) * | 2012-01-05 | 2012-07-11 | 中国计量学院 | Copper line-clad aluminum silicon carbide ceramic substrate applicable to radiation of high-power LED |
| CN203434193U (en) * | 2013-07-16 | 2014-02-12 | 华南理工大学 | LED packaged by use of AlSiC composite substrate |
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