CN103377904A - 一种多晶硅沟槽回刻蚀方法 - Google Patents
一种多晶硅沟槽回刻蚀方法 Download PDFInfo
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- CN103377904A CN103377904A CN2012101333366A CN201210133336A CN103377904A CN 103377904 A CN103377904 A CN 103377904A CN 2012101333366 A CN2012101333366 A CN 2012101333366A CN 201210133336 A CN201210133336 A CN 201210133336A CN 103377904 A CN103377904 A CN 103377904A
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- polycrystalline silicon
- polysilicon
- etching
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- photoresistance
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CN2012101333366A CN103377904A (zh) | 2012-04-28 | 2012-04-28 | 一种多晶硅沟槽回刻蚀方法 |
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CN2012101333366A CN103377904A (zh) | 2012-04-28 | 2012-04-28 | 一种多晶硅沟槽回刻蚀方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107507771A (zh) * | 2017-07-24 | 2017-12-22 | 武汉华星光电技术有限公司 | 一种多晶硅蚀刻方法 |
CN107910260A (zh) * | 2017-11-14 | 2018-04-13 | 扬州扬杰电子科技股份有限公司 | 一种多晶硅回刻方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5773974A (en) * | 1980-10-27 | 1982-05-08 | Toshiba Corp | Manufacture of most type semiconductor device |
CN101126161A (zh) * | 2006-08-15 | 2008-02-20 | 上海华虹Nec电子有限公司 | 超厚多晶硅回刻的方法 |
US20090140330A1 (en) * | 2007-12-04 | 2009-06-04 | Rohm Co., Ltd. | Semiconductor device and method of manufacturing semiconductor device |
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2012
- 2012-04-28 CN CN2012101333366A patent/CN103377904A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5773974A (en) * | 1980-10-27 | 1982-05-08 | Toshiba Corp | Manufacture of most type semiconductor device |
CN101126161A (zh) * | 2006-08-15 | 2008-02-20 | 上海华虹Nec电子有限公司 | 超厚多晶硅回刻的方法 |
US20090140330A1 (en) * | 2007-12-04 | 2009-06-04 | Rohm Co., Ltd. | Semiconductor device and method of manufacturing semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107507771A (zh) * | 2017-07-24 | 2017-12-22 | 武汉华星光电技术有限公司 | 一种多晶硅蚀刻方法 |
CN107910260A (zh) * | 2017-11-14 | 2018-04-13 | 扬州扬杰电子科技股份有限公司 | 一种多晶硅回刻方法 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140110 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20140110 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Applicant before: Shanghai Huahong NEC Electronics Co., Ltd. |
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Application publication date: 20131030 |