CN103370771A - 复合喷嘴及具备该复合喷嘴的基板处理装置 - Google Patents

复合喷嘴及具备该复合喷嘴的基板处理装置 Download PDF

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Publication number
CN103370771A
CN103370771A CN201280008138.5A CN201280008138A CN103370771A CN 103370771 A CN103370771 A CN 103370771A CN 201280008138 A CN201280008138 A CN 201280008138A CN 103370771 A CN103370771 A CN 103370771A
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CN
China
Prior art keywords
gas
entrance hole
liquid
combining nozzle
ejiction opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280008138.5A
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English (en)
Chinese (zh)
Inventor
松下亮
广川昌利
林田充司
瓦力·盖尓塔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aqua Science Corp
Original Assignee
Aqua Science Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aqua Science Corp filed Critical Aqua Science Corp
Publication of CN103370771A publication Critical patent/CN103370771A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Nozzles (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
CN201280008138.5A 2011-02-17 2012-02-17 复合喷嘴及具备该复合喷嘴的基板处理装置 Pending CN103370771A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-032677 2011-02-17
JP2011032677A JP2012174741A (ja) 2011-02-17 2011-02-17 複連ノズル及び当該複連ノズルを備える基板処理装置
PCT/JP2012/053828 WO2012111809A1 (ja) 2011-02-17 2012-02-17 複連ノズル及び当該複連ノズルを備える基板処理装置

Publications (1)

Publication Number Publication Date
CN103370771A true CN103370771A (zh) 2013-10-23

Family

ID=46672720

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280008138.5A Pending CN103370771A (zh) 2011-02-17 2012-02-17 复合喷嘴及具备该复合喷嘴的基板处理装置

Country Status (5)

Country Link
JP (1) JP2012174741A (ko)
KR (1) KR20140042782A (ko)
CN (1) CN103370771A (ko)
TW (1) TWI579061B (ko)
WO (1) WO2012111809A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107710389A (zh) * 2015-06-02 2018-02-16 株式会社Ｎｓｃ 喷淋蚀刻装置
CN112074701A (zh) * 2018-05-01 2020-12-11 环宇制罐株式会社 喷嘴、干燥装置及罐体制造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI595332B (zh) 2014-08-05 2017-08-11 頎邦科技股份有限公司 光阻剝離方法
KR101835986B1 (ko) * 2016-07-25 2018-03-07 시오 컴퍼니 리미티드 유체 공급관
JP6811113B2 (ja) * 2017-02-14 2021-01-13 株式会社Ｓｃｒｅｅｎホールディングス 衝撃力測定装置、基板処理装置、衝撃力測定方法、および基板処理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07185434A (ja) * 1993-12-28 1995-07-25 Kao Corp 塗布装置
JP2005021894A (ja) * 1999-10-27 2005-01-27 Tokyo Electron Ltd 液処理装置
JP2003145064A (ja) * 2001-11-12 2003-05-20 Tokyo Electron Ltd ２流体ジェットノズル及び基板洗浄装置
JP2004237282A (ja) * 2003-01-16 2004-08-26 Kyoritsu Gokin Co Ltd 二流体ノズル
JP5022074B2 (ja) * 2006-05-02 2012-09-12 株式会社共立合金製作所 二流体ノズルとそれを用いた噴霧方法
WO2009013797A1 (ja) * 2007-07-20 2009-01-29 Aqua Science Corporation 対象物処理方法及び対象物処理システム
JP4447042B2 (ja) * 2007-12-06 2010-04-07 福岡県 微粒化装置および微粒化方法
TWI469832B (zh) * 2008-12-17 2015-01-21 Aqua Science Corp 對象物清洗方法及對象物清洗系統
WO2010125664A1 (ja) * 2009-04-30 2010-11-04 アクアサイエンス株式会社 剥離液及び対象物洗浄方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107710389A (zh) * 2015-06-02 2018-02-16 株式会社Ｎｓｃ 喷淋蚀刻装置
CN112074701A (zh) * 2018-05-01 2020-12-11 环宇制罐株式会社 喷嘴、干燥装置及罐体制造方法
CN112074701B (zh) * 2018-05-01 2023-06-02 环宇制罐株式会社 喷嘴、干燥装置及罐体制造方法

Also Published As

Publication number Publication date
JP2012174741A (ja) 2012-09-10
WO2012111809A1 (ja) 2012-08-23
TW201240743A (en) 2012-10-16
KR20140042782A (ko) 2014-04-07
TWI579061B (zh) 2017-04-21

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C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20131023