CN1033672C - 电气薄膜元件 - Google Patents
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Abstract
一种可用于人体或其它离子液体环境中的电气薄膜元件。聚酰亚胺衬底系粘合到可用自动化设备进行装运的玻璃承载板上,多层金属导体则淀积在衬底上,并将其构成布线图形,以形成电路或生物传感器。聚酰亚胺和玻璃使两者粘合起来,这种粘合能经受加工操作过程但可用能适应生物体的脱除剂和方法破坏。为使衬底从承载板脱离的过程中减少断裂和脱层的可能性,聚酰亚胺衬底和玻璃承载板的热膨胀性能最好类似。金属导体上覆盖聚酰亚胺制成的绝缘层其固化温度低于导体的金属层中产生相互扩散时的温度。
Description
本发明涉及一种电气薄膜元件,特别涉及能制成布线图形使其起接插件、传感器或其它电气元件的作用的柔质、超小型、防水、适用于生物体的薄膜电路组件。更具体地说,本发明涉及薄膜电路组件在制造过程中在处理和成形方面的改进。
薄膜一般厚0.01微米至0.5微米至,它淀积在玻璃、陶瓷或半导体衬底上以形成电容器、电阻器、线圈或其它电路元件。薄膜集成电路就是完全由薄膜按布线图形淀积在衬底上构成的。
本发明的一个目的是研制一种经改进的适用于生物体的薄膜传感器或电路,以便在人体中使用。人们已经注意到,完全只依靠使用于制造常规薄膜结构的材料和技术,一般是不能生产出令人满意的适用于生物体的薄膜传感器或电路。
人体或其它离子液体环境中许多生物学状况的测试和监控能力可能会因小型柔质防水薄膜生物传感器的研制而得到提高。但一般薄膜结构通常并不是专为使其与人体生理相适应而设计的,而且是用不适于生物材料的工艺制造的。此外一般薄膜结构并不是柔质的。
硅圆片一般提供基片、基座或承载板其上制有常规的薄膜结构。薄膜结构一层层在硅圆片上形成时,硅圆片在各制造工位之间的传送采用自动输送设备。在本发明中采用粘合到承载板的第一薄膜层作为薄膜结构的衬底。薄膜结构一经构成,就使硅圆片承载板脱离薄膜结构的衬底,并将承载板扔掉。
酸腐蚀溶液或其它脱离剂用以破坏薄膜结构的衬底连接至其硅圆片承载板的粘合,如薄膜结构是由任一不能与上述酸或脱离剂相适应的材料制成,则当薄膜结构脱离硅圆片承载板时可能受到损伤。人们已经知道,许多那种可适应生物体的薄膜结构的生物材料在暴露于一般硅圆片脱除剂中时会损伤或失去作用。通常溶解硅圆片承载板用的腐蚀溶液是不适用于能与生物体相适应的包含在薄膜结构中的生物材料的。
人们还知道,淀积在接合到承载板的聚合物衬底上的薄膜金属导体脱离其承载板基片时往往会断裂和脱层。一般认为,聚合物衬底及其承载板基片只要在热膨胀系数上有任何差别都会使聚合物衬底在热处理过程中产生内应力,因为其热膨胀系数与承载板的不同。如果不留意承载板基片和构制薄膜结构用的衬底材料的热膨胀系数就会产生薄膜结构断烈和脱层的问题。
大家都知道,一般薄膜结构中都含有粘性金属膜以提高贵金属膜及其下伏的聚合物衬底的粘合能力。这类粘性金属膜是极有用的粘合媒介,因为在薄膜结构中形成电路用的贵金属不能很好地直接与聚合物衬底粘合。因此在聚合物衬底与贵金属膜层之间设有粘性金属层。
人们知道,由于毗邻紧靠着的粘性金属层在薄膜结构进行任何高温处理(例如热固化聚合物母体溶液以便在金属膜层上形成聚合物绝缘层)过程中的相互扩散,会使薄膜结构丧失其性能。所指性能的丧失包括:例如,失去薄膜结构自身的柔韧性和产生金属薄膜层粘合的问题。除这些机械问题外,金属的相互扩散还会使贵金属层的电性能发生变化。
半导体工业界解决金属相互扩散问题的一般方法是在粘结层与贵金属膜层之间加一层耐高温金属层(例如,钨或钽)。这个附加层起相互扩散阻挡层的作用。但要淀积这种附加耐高温金属膜层并将它们构成布线图形就使薄膜结构的加工大大复杂化。
本发明的一个目的是提供一种适用于人体或任何其它离子液体环境的能与生物体相适应的电气薄膜元件。
本发明的另一个目的是提供一种有一定形状和布线图形的薄膜电气元件,这种元件起作可装在植入人体内的医疗器件中的生物传感器所使用,以及制造这种电薄膜元件使其保持其生物传感功能的方法。
本发明的另一个目的是提供一种可以制造得不致在将薄膜结构衬底脱离其承载板衬底时产生应力损伤的薄膜结构。
本发明的电气薄膜元件包括一硬质玻璃承载板、一粘合到该硬质玻璃承载板上的衬底和提供电路用的装置。该衬底包括使衬底与硬质玻璃承载板粘合的聚合物,硬质玻璃承载板在其与衬底浸渍在沸水槽或室温下的生理盐水槽中时破裂,以使衬底脱离硬质玻璃承载板。提供电路的装置则粘合到衬底上,并在衬底脱离硬质玻璃承载板时保全下来。
本发明的一个特点是提供一种电气薄膜元件,该薄膜元件的聚合物衬底脱离其承载板时无需使用可能损及包含在衬底中的生物材料或形成在衬底上的电路装置的任何脱除剂或脱除技术。这里承载板玻璃和衬底聚合物的选择是否适当是解决问题的关键。特别是采用与玻璃粘合的强度仅足以经受电路制造过程的各种作用但遇到能与生物体相适应的沸水或温盐水时可以破裂的聚合物,这是本发明的一个重要特点。避免采用不能与生物体相适应、能腐蚀硅的脱除剂,这样做有好处。
熟悉本技术领域的人士都知道,未经改性的PMDA-ODA(PMDA-ODA=苯均四酸酐氧代二苯胺)型聚酰亚胺由于其与大多数承载板基片粘合时其粘合强度是勉强够格的,因而通常都认为它比其它可能使用的衬底材料差;因此在大多数薄膜的应用中都要往其中加入粘性促进剂,以便对这种聚酰亚胺进行改性,从而提高其粘合能力。然而在本发明中却是希望能有这种勉强够格的粘合强度,以便可以采用能适应生物体的脱除剂和脱除技术使玻璃承载板脱离聚酰亚胺衬底。因此在本发明的最佳实施例中,聚合物衬底由未经改性的PMDA-ODA型聚酰亚胺组成。
在一些最佳实施例中,硬质玻璃承载板由具特别热膨胀数、低膨胀型的玻璃构成,形成衬底的聚合物则由热膨胀系数与该低膨胀玻璃基本相等的聚酰亚胺组成。热膨胀系数的这种匹配使硬质玻璃承载板和承载有电路装置的聚合物衬底在薄膜结构遇到高温时以大致相同的速率膨胀。其好处是,在聚合物衬底脱离硬质玻璃承载板时避免了电路装置从衬底上分离开来。
因此本发明的另一个特点在于,仔细选取承载板玻璃和衬底聚合物,使它们的热膨胀系数大致相等。热性能上的这种匹配有利地减少了聚合物衬底脱离玻璃承载板时产生严重断裂和脱层问题的可能性。
本发明还有另一个特点,即设置了一个固化温度较低的聚合物绝缘层。在无需考虑金属的相互扩散的情况下,对这种绝缘层合理的选择应该选用一种可以光学成象的聚酰亚胺,这样,该绝缘层就可以无需使用附加的光致抗蚀工序以形成布线图形。遗憾的是,目前能搞到可光学成象的聚酰亚胺需要很高的固化温度(450℃)来排出光敏剂。在本发明的最佳实施例中,采用了BTDA-ODA(BTDA-ODA=4,4′-碳酰=(邻苯二甲酸酐)-氧代二苯胺)聚酰亚胺连同正性光致抗蚀剂来形成有布线图形的绝缘涂层。这种材料可在低至250℃的温度下进行固化,从而大大减少了相互扩散以及由此引起的一些问题。
在最佳实施例中,用一种聚酰亚胺来形成聚合物衬底,用另一种聚酰亚胺来形成聚合物绝缘体。“衬底”聚酰亚胺的选择取决于其脱离玻璃承载板的难易程度以及其与玻璃承载板在热膨胀系数方面的适应性。举例说,无论是PMAD-ODA或是BPDA-PPD型聚酰亚胺都合适。另一方面,“绝缘体”聚酰亚胺的选择则取决于其固化温度与电气薄膜元件中的金属开始相互扩散的最低温度比较的量值,并取决于下伏的聚合物和金属层的粘结强度。举例说,如上所述,BTDA-ODA型聚酰亚胺是合适的。
此外,本发明还提供了制造电气薄膜元件的一种方法。该方法包括下列步骤:配备一个平面硬质玻璃承载板,用第一种聚胺酸母体液涂敷该平面,以第一温度的热量固化第一种聚酰胺酸母体溶液以形成粘合到该平面的聚酰亚胺层。在本发明的一个最佳实施例中,聚酰亚胺膜的热膨胀系数基本上等于硬质玻璃承载板的热膨胀系数,从而避免了在处理过程中在聚酰亚胺膜中产生内应力。在其它某些实施例中,可以采用热膨胀系数基本上不同的玻璃承载板和聚酰亚胺膜。
涂敷工序最好还包括:将第一种聚酰胺酸母体溶液撒布到硬质玻璃承载板平面,和将硬质玻璃承载板绕垂直于该平面的轴线旋转以便在整个该平面上形成厚度基本均匀的聚酰胺酸母体溶液平滑涂层的步骤。这是半导体工业界常用的一般旋转涂敷法。在旋转步骤中,令硬质玻璃承载板以1,000与6,000转/分之间的转速旋转。
本方法还包括在聚酰亚胺膜上形成电路装置的步骤,和将硬质玻璃承载板、聚酰亚胺膜和电路装置暴露在热水槽或体温生理盐水槽一段时间以破坏聚酰亚胺与硬质玻璃承载板的粘合的步骤。温盐水槽有一种能与生物体相适应的脱除剂,这种脱除剂工作时能促使聚酰亚胺膜脱离硬质玻璃承载板而不致使电路装置与聚酰亚胺膜分离。
在电气薄膜元件中以这样的方式形成电路:在聚酰亚胺膜上淀积第一粘性金属层,在第一粘性金属层上淀积一贵金属层,再在该贵金属层上淀积第二粘性金属层,使贵金属层夹在第一和第二粘性金属层之间,并将淀积出来的贵金属层和第一粘性金属层构成布线图形,由此在聚酰亚胺膜上形成电路装置。其次用以下方式在电路装置上涂敷第二种聚酰胺酸母体溶液:将第二种聚酰胺酸母体溶液撒布到电路装置上,再将由硬质玻璃承载板、聚酰亚胺膜和电路装置组成的组件绕垂直于硬质玻璃承载板平面的轴线旋转。旋转该组件的目的是为了在聚酰亚胺膜和电路装置的预定暴露部分上形成第二种聚酰胺酸母体溶液的涂层。
接着就用第二温度的热量对第二种聚酰胺酸母体溶液进行固化,以便在电路装置上形成聚酰亚胺绝缘涂层。如果贵金属层与粘性金属层之间的相互扩散成问题,就使第二温度小于贵金属层与第一和第二粘性金属层发生相互扩散的最低特性温度,以便避免贵金属层与第一和第二粘性金属层在热固化第二种聚酰胺酸母体溶液的过程中以相当大的速率相互扩散。
参阅下面,以举例说明目前所设想的实施本发明的最佳实施例所作的详细说明,熟悉本技术领域的人士即可清楚了解本发明的其它目的、特点和优点。
本详细说明是参照各附图进行的。附图中:
图1是往玻璃承载板平面上淀积聚合物母体溶液过程中的玻璃承载板的示意剖视图;
图2是图1的玻璃承载板上的聚合物衬底的示意正视图;
图3是图2的聚合物衬底上由三个金属层组成的金属复合导体的示意图;
图4是图3元件的顶视图,示出了形成电路元件的多层金属导体的结构;
图5是图4元件的示意剖视图,示出了在顶部金属层上形成的一个通道孔和金属导体覆盖有绝缘涂层的部分;
图6是图5元件的顶视平面图,示出了一对未加以绝缘的附有引线的部位;
图7是图5和6的元件浸渍在液体槽中以使玻璃承载板脱离聚合物衬底时的示意剖视图;
图8是本发明另一个实施例的元件的示意剖视图;
图9则是图8元件的顶部平面图,示出了一对未加以绝缘的附有引线的部位。
图1-7示意表示了制造电气薄膜元件的过程。图7示出了成品元件。如图1所示,干净的玻璃板10系在制造过程开始时用以形成电气薄膜元件的硬质承载板或基片的。这里最好采用“光掩模”种板,因为它极度平坦、光滑,热稳定性又好。在最佳实施例中,板10是膨胀小的玻璃,主要由60%的SiO2、18%的RO、15%的Al2O3、5%的B2O3、1%的Na2O和1%的K2O组成。不用说,RO表示“未知金属氧化物杂质”。
板10可采用方形或圆形的玻璃板,外部尺寸在3英寸(7.62厘米)至6英寸(15.24厘米)的范围,厚度约0.030英寸(0.076厘米)至0.090英寸(0.228厘米)。为适应自动输送和处理的设备,板10可选用标准的“硅圆片”或光掩模的尺寸。玻璃板10在使用之前可以用一般的清洗溶液清洗,而且可以在长时期内反复使用。
参看图1和图2。硬质石英玻璃板10绕垂直于平面14的轴线16旋转时,将液体聚酰胺酸12旋转涂敷到其上。举例说,玻璃承载板10以1,000与6,000转/分之间的转速旋转。之所以最好采用这种旋转涂敷法,是因为它可以涂敷出平滑均匀的涂层。
用二步热固化法将玻璃板10上的聚酰胺酸母体溶液12亚胺化,以形成由平坦均匀的聚酰亚胺片组成的聚合物衬底11。衬底11由具所要求的电性能、可淀积以金属的表面和由所要求的脱除性能的聚合物制成。优选采用的聚合物有不带粘性促进添加剂的PMDA-ODA(苯均四酸酐氧代二苯胺)型聚酰亚胺。这种材料与玻璃的粘合力非常小,遇到沸水或温盐水这个粘合就遭破坏。然而,聚酰亚胺与玻璃的粘合却足以承受薄膜电路制造过程的操作。举例说,聚酰亚胺与玻璃的这种粘合就足以承受一般诸如烘焙、酸蚀、光致抗蚀的显现和溅射等的光刻过程。此外,聚酰亚胺的热膨胀系数几乎与该优选采用的板10的热膨胀系数相等,因而聚酰亚胺衬底11脱离玻璃承载板10时,断裂和脱层问题不会对电气薄膜元件构件不利的影响。
聚合物衬底的厚度可以在10至100微米的范围。这是由聚酰胺酸母体溶液12的粘度和玻璃承载板10的转速加以控制的。通过涂敷处理的多重循环可以获取较厚(大于约25微米)的聚酰亚胺涂层。在另一实施例中,聚合物衬底11采用了预制的KAPTON(KAPTON=聚苯均四酸亚胺的商标名称)板,而不采用经过二步热固化工序的旋转涂敷液体聚酰胺酸12。
各金属层如图3和图4所示的那样淀积并构制成布线的图形。柔质导体18在聚合物衬底11的顶部表面20上形成,且包括粘合到顶部表面20上的粘性金属层22、粘合到第一粘性金属层22上的贵金属层24,和粘合到贵金属层24的第二粘性金属层26以将贵金属层24夹在第一和第二粘性金属层22、26之间。
三个金属层22、24和26用一般的薄膜真空淀积法依次进行淀积。直流磁控管溅射法的淀积速率较高,而且能形成高度粘性的薄膜,因此而优选采用这个方法。贵金属最好采用黄金,因为黄金的延展性大,但也适宜采用铂和钯等。粘性金属最好采用铬,但也适宜采用钛、钨和钽等。粘性金属层的厚度约0.01微米至0.02微米,贵金属层的厚度约0.1微米至0.2微米。应该理解的是,如下面即将谈到的那样,由于选用了热固化温度低的聚合物绝缘体,因而在各粘性金属层与贵金属层之间的界面处无需加耐高温金属层。
要在衬底11上形成电气元件,可采用各种一般的光刻法(图中未示出)将金属层22、24和26制成布线图形。图4示出了具代表性的电路图形27(例如电阻器)。不用说,电路图形27可以是任何电气元件、集成电路、传感器或其它元件,这取决于想达到的薄膜结构功能。
适用的光刻法是通常是在旋转涂敷过程中使用光致抗蚀剂或掩模材料。将此材料烘干。然后使紫外光通过含线路图形的掩模而将材料曝光。对光致抗蚀剂进行显影,只留下经选择的有掩蔽的部位。可以用湿式化学刻蚀法或干式等离子体刻蚀法除去经曝光的金属。然后可以用溶剂浸渍法或等离子体刻蚀法剥除光致抗蚀剂。在一最佳实施例中采用了正性光致抗蚀剂、湿式刻蚀和溶剂剥除法。这样可以制成小到5微米的线宽和间距,并可能达到小至1微米的尺寸。
这里需要有一个绝缘覆盖层28对导体20进行绝缘并防止可能会有腐蚀的粘性金属暴露在液体之中。在导体20中形成电路27所使用的同一种构成布线图形的方法现在也可用以除去导体20准备不加以绝缘的部位中的顶部金属粘性层26。如图5所示,第二金属粘性层26系制造得使其中有一对通道孔30,用以暴露下伏的金属层24的部分,从而在贵金属层24上形成附有引线的部位32。除去粘合层26中绝缘孔缘34应有的位置以外5~10微米处的金属。这个距离应足以确保粘性金属边缘30有最小量的覆盖,从而使大部分绝缘层28与粘性金属接触。聚酰亚胺和绝缘层11、28没有很好地直接粘合到贵金属24上。正是这种精密的调准布骤使本发明优先使用旋涂的衬底。要将随意翘曲的薄膜保持得充分平展从而在整个3英寸(7.62厘米)至6英寸(15.24厘米)的平板上达到5至10微米的调准精确度是有困难的。如图5所示,形成绝缘覆盖层28的聚酰亚胺涂层包括壁31,壁31延伸入在第二粘性金属层26中形成的通道孔30而与贵金属层22接触。
淀积绝缘层28并将其构成布线图形。在一个最佳实施例中,绝缘层28由BTDA-ODA型聚酰亚胺组成,这种聚酰亚胺可在低到250℃的温度下使其固化,从而尽量减小导体20中产生金属相互扩散问题的机会。绝缘层2 8的涂层厚度可取1-25微米。另一种做法是采用PMDA-ODA型的聚酰亚胺制成绝缘层28。由于不能进行光学成象的聚酰亚胺需要更多的加工步骤,因而最好采用能光学成象的聚酰亚胺。
绝缘层28是这样制造的:将聚酰胺酸母体溶液旋转涂敷到固定在聚合物衬底11上的导体20上;在低于贵金属层24与粘性金属层22、26发生相互扩散时的最低温度的温度下使母体溶液固化,以形成所选择的聚酰亚胺;然后涂上光致抗蚀剂,蚀刻,和剥除。贵金属层24与粘性金属层间相当大的相互扩散是通过在低温下固化处理形成绝缘覆盖层的聚酰胺酸母体溶液加以避免的,这样做有好处。应该理解的是,聚合物母体用以形成聚合物衬底的固化温度并不局限于此低温,因为这是在聚合物衬底上淀积上任何金属层22、24和26之前进行热固化的。
在从事本发明的过程中我们发现,若分别采用金和铬作为贵金属和粘性金属,则即使绝缘28是采用高固化温度的聚酰亚胺形成的,贵金属层与粘性金属层之间也不会产生(会导致传感器产生裂纹的)相互扩散现象。若采用金/铬金属组合物,则可用高温和低温的聚酰亚胺形成绝缘层28。我们观察到,如果用任何其它贵金属或上面列举的粘性金属代替金或铬,例如用铂代替金或用钛代替铬,则会出现金属层相互扩散现象。因此目前最佳的类型是金/铬组合物。
在图8和图9所示的本发明的另一个实施例中,编码与图1-7中相同的那些元件起相同或类似的作用。本实施例与上一个实施例不同的主要特点在于采用了室温固化温度的聚合物来形成绝缘层,而且在贵金属层与绝缘层之间没有粘性金属层。
如图8和图9所示,绝缘层128采用敷形涂覆法形成。在一个实施例中,涂敷料是聚合物弹性体,主要由硅酮树脂(例如二甲基硅氧烷)和粘性促进剂(例如甲氧基硅烷)组成。合适的涂料有MS-460TM树脂;这种树脂可从美国康湟狄格州,丹伯里的密勒·斯迪芬森化学公司买到。这种树脂有溶液状的,供旋转涂敷用,或气溶胶状的,供喷涂之用。喷涂法之所以优选采用是因为它更适宜大批生产。
形成绝缘层128用的硅酮树脂是能在适当位置下的室温中固化的单一部分组成的系统。它可以代替那种只能在高温下固化但会产生相互扩散问题的热固化型聚合物。上面说过,薄膜有时要用在金属导体不能暴露在固化聚合物绝缘屋薄膜所需要的温度的场合。
敷形涂覆料,特别是硅酮树脂的另一个好处是它们比其它材料(例如聚酰亚胺)的疏水性更好。敷形涂覆料特别是硅酮的疏水性使吸潮率下降。此外优选采用的敷形涂覆料能很好地粘合在金上,因而无需在贵金属层24与绝缘层128之间设粘性金属层。这一做法减少了制造电气薄膜元件加工工序的数目,从而降低元件的生产成本。
通道孔134在绝缘层128固化之后易在该层上形成。这些孔可以例如用干式等离子体蚀刻法或在贵金属层24涂上敷形涂覆料之前掩蔽这些部位形成。敷形涂覆料128是一种柔质材料,特别适用于使用时必须能加以弯曲的电气薄膜元件。
最后一个步骤是使聚合物衬底11脱离硬质玻璃承载板10,如图7所示。有两种适用的方法;在100℃水中浸渍3小时,或在37℃生理盐水槽中浸渍24小时。这些时间和温度可略加改变而仍然取得同样的效果。沸水法是生产效率最高的方法。当线路上附有诸如酶、抗体或其它生物材料之类对温度敏感的材料时,体温盐水法是有用的。
在衬底11脱离玻璃承载板10之前还可以加另一个步骤。可以用准分子激光器高度精确地切割电气薄膜元件的轮廓。这种激光器的紫外线波长能快速切割聚酰亚胺而不致损及形成承载板10所使用的玻璃。此外,这种切割机理不会产生可能会损及生物材料的机械碎裂或热碎裂。
生物传感器需用非常薄而柔韧的衬底。生物传感器必须小得足以将其装入皮下注射针或静脉或动脉导管中,而且能承受某种程度的弯曲。这种衬底不容易处理或保持平展,而这正是在成本和效果上都好的光刻法生产电气薄膜元件的两个必要条件。生物传感器衬底还必须是没有杂质的,而且能适应生物体。本发明的电气薄膜元件完全符合这些要求。可以使用高纯度且固化时对生物体较稳定的液体聚合物母体。玻璃板可使用非常平坦且可装入各种盒式自动装载和输送机构中的玻璃板。此外还配备有脱除薄膜结构而不致损及生物材料的装置。
制造本发明的电气薄膜元件用的线路的主要优点是柔韧性好。由于导体20质柔,因而可以构制弯曲的三维薄膜结构。电气薄膜元件的这种柔韧性还因此而不难提供能与待测量的表面或接插件相适应的传感器。相比之下,一般诸如硅、氧化铝和二氧化硅之类的薄膜或半导体衬底在这些部分是非常脆弱的。
由于导体和绝缘体零件的体积小,因而使器件的总体积非常小。这对便携型或植入式器件特别有利,对那些与集成电路直接接口的高密度接插件也是有用的。在体积上至少比一般柔质电路减少十倍。
这种电路具防水性,因而它具有这样的好处:可以在不适宜一般电路的恶劣环境,包括:淡水、盐水、生理盐水(体液)、沸水和蒸汽中工作。这种电路为许多医学、工业和航海上的应用开辟了道路。
聚酰亚胺比起硅和其它一般微电路基础材料要便宜。这就是说,在如同一个衬底一样的有源电路上,人们能制作连接引线,这样可以无需将导线焊接或连接起来。我们知道,聚酰亚胺对生物体是不起反应的。现行的液体聚酰胺酸的纯度比片材聚酰亚胺高。
只要将金属层和绝缘层22、24、26和28构制成布线图形即可制成许多电气元件。这包括电阻器、电容器、接插件、天线、接触焊接区、电极、加热器、电感器、熔丝和热敏电阻等。
此外还可以敷上压电薄膜、光敏电阻薄膜或磁性薄膜制成力、光和磁场的传感元件。贵金属表面24经过电镀可制成可用于电化学的检测电极(即铂,银/氯化银)。上述电路加上有源器件(光电元件、晶体管、集成电路)即可执行放大、调节或其它功能。
本发明的电薄膜元件广泛应用于植入式的医疗器件中,例如电化学传感器、电极或其它应变、温度或流体导电率等物理传感器。还可以制造刺激耳蜗、心、脑或脊椎骨用的电极。元件的几何尺寸使这类器件可以制造得将其装入小型导管和皮下注射针内。
虽然本发明是参照某些最佳实施例详细说明的,但在不脱离本发明在后面的权利要求书中所述和规定的范围和精神实质下是可以进行各种更改和修改的。
Claims (8)
1.一种电气薄膜元件,其特征在于,它包括:
一聚合物衬底;
电路装置,粘合到衬底上;和
绝缘装置,在衬底上,用以在电路装置上形成绝缘覆盖,绝缘装置包括合成聚合物弹性体。
2.权利要求1的元件,其特征在于,电路装置包括一粘合到衬底上的粘性金属层和一粘合到粘性金属层上的贵金属层,合成聚合物弹性体直接粘合到贵金属层上。
3.根据权利要求2的元件,其特征在于,粘性金属层从主要由钛和铬组成的材料中选出,贵金属层从主要由金、铂和钯组成的材料群中选出。
4.权利要求1至3中任一权要求的元件,其特征在于,聚合物衬底为PMDA-ODA型聚酰亚胺或BPDA-PPD型聚酰亚胺。
5.根据权利要求1的元件,其特征在于,电路装置包括一个粘合到聚合物衬底的第一粘性金属层,一个粘合到第一粘性金属性金属层的贵金属层,以及一个粘合到该贵金属层的第二粘性金属层,贵金属层夹在第一和第二粘性金属层之问。
6.权利要求1的元件,其特征在于,它还包括一硬质玻璃承载板,聚合物衬底结合到硬质玻璃承载板上,以便于用自动化设备输送聚合物衬底。
7.权利要求5的元件,其特征在于,聚合物弹性体包括在热固化温度下固化、形成聚酰亚胺涂层的聚酰胺酸母体溶液,该聚酰胺酸母体溶液的热固化温度低于贵金属层与第一和第二粘性金属层相互扩散时的特性最低温度,从而防止贵金属层与第一和第二粘性金属层在聚酰胺酸母体溶液的热固化过程中有显著的相互扩散。
8.根据权利要求7的元件,其特征在于,聚合物弹性体至少被粘合到第一和第二粘性金属层,以覆盖住第一和第二粘性金属层来与聚合物衬底和贵金属层粘合的所有暴露表面。
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