CN103268772A - 读出放大器 - Google Patents
读出放大器 Download PDFInfo
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- CN103268772A CN103268772A CN 201310217369 CN201310217369A CN103268772A CN 103268772 A CN103268772 A CN 103268772A CN 201310217369 CN201310217369 CN 201310217369 CN 201310217369 A CN201310217369 A CN 201310217369A CN 103268772 A CN103268772 A CN 103268772A
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CN 201310217369 CN103268772A (zh) | 2013-06-03 | 2013-06-03 | 读出放大器 |
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CN 201310217369 CN103268772A (zh) | 2013-06-03 | 2013-06-03 | 读出放大器 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104979012A (zh) * | 2015-08-07 | 2015-10-14 | 上海华虹宏力半导体制造有限公司 | 存储器电路 |
CN105225693A (zh) * | 2015-09-16 | 2016-01-06 | 上海华虹宏力半导体制造有限公司 | 虚拟接地闪存电路 |
WO2021051548A1 (zh) * | 2019-09-17 | 2021-03-25 | 华中科技大学 | 忆阻器的读写电路及读写方法 |
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2013
- 2013-06-03 CN CN 201310217369 patent/CN103268772A/zh active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104979012A (zh) * | 2015-08-07 | 2015-10-14 | 上海华虹宏力半导体制造有限公司 | 存储器电路 |
CN104979012B (zh) * | 2015-08-07 | 2019-04-19 | 上海华虹宏力半导体制造有限公司 | 存储器电路 |
CN105225693A (zh) * | 2015-09-16 | 2016-01-06 | 上海华虹宏力半导体制造有限公司 | 虚拟接地闪存电路 |
CN105225693B (zh) * | 2015-09-16 | 2019-04-30 | 上海华虹宏力半导体制造有限公司 | 虚拟接地闪存电路 |
WO2021051548A1 (zh) * | 2019-09-17 | 2021-03-25 | 华中科技大学 | 忆阻器的读写电路及读写方法 |
US11238928B2 (en) | 2019-09-17 | 2022-02-01 | Huazhong University Of Science And Technology | Read-write circuit and read-write method of memristor |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent for invention or patent application | ||
CB02 | Change of applicant information |
Address after: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
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COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI TO: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING CORPORATION |
|
C53 | Correction of patent for invention or patent application | ||
CB02 | Change of applicant information |
Address after: 201203 Shanghai Zhangjiang hi tech park Zuchongzhi Road No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Shanghai Huahong Grace Semiconductor Manufacturing Corporation |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130828 |