CN103258934B - 晶片型led线路板运用刷油墨防止封装过程溢胶的方法 - Google Patents
晶片型led线路板运用刷油墨防止封装过程溢胶的方法 Download PDFInfo
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- CN103258934B CN103258934B CN201210101898.2A CN201210101898A CN103258934B CN 103258934 B CN103258934 B CN 103258934B CN 201210101898 A CN201210101898 A CN 201210101898A CN 103258934 B CN103258934 B CN 103258934B
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CN201210101898.2A CN103258934B (zh) | 2012-04-09 | 2012-04-09 | 晶片型led线路板运用刷油墨防止封装过程溢胶的方法 |
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CN201210101898.2A CN103258934B (zh) | 2012-04-09 | 2012-04-09 | 晶片型led线路板运用刷油墨防止封装过程溢胶的方法 |
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CN103258934A CN103258934A (zh) | 2013-08-21 |
CN103258934B true CN103258934B (zh) | 2017-03-22 |
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CN109698430A (zh) * | 2017-10-23 | 2019-04-30 | 广东皓英电子科技有限公司 | 插头连接器 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101207095A (zh) * | 2006-12-21 | 2008-06-25 | 力成科技股份有限公司 | 防止溢胶的球格阵列封装构造 |
CN101359636A (zh) * | 2007-07-31 | 2009-02-04 | 昆山达鑫电子有限公司 | 电子元件的封装结构与其封装方法 |
CN102097340A (zh) * | 2010-12-14 | 2011-06-15 | 沈阳中光电子有限公司 | 用cob灌胶封装制作smd的方法 |
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CN101207095A (zh) * | 2006-12-21 | 2008-06-25 | 力成科技股份有限公司 | 防止溢胶的球格阵列封装构造 |
CN101359636A (zh) * | 2007-07-31 | 2009-02-04 | 昆山达鑫电子有限公司 | 电子元件的封装结构与其封装方法 |
CN102097340A (zh) * | 2010-12-14 | 2011-06-15 | 沈阳中光电子有限公司 | 用cob灌胶封装制作smd的方法 |
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Effective date of registration: 20180731 Address after: Building A3-A4, Xinqiao Electronic Information Industry Park, No.9 Changxing Avenue, Dongbao District, Jingmen City, Hubei Province Patentee after: HUBEI JIUXIANG ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 523000 Dongguan Songshan Lake High-tech Industrial Development Zone, Guangdong Province Patentee before: DONGGUAN JIUXIANG ELECTRONICS Co.,Ltd. |
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Address after: Building A3-A4, Xinqiao Electronic Information Industry Park, No.9 Changxing Avenue, Dongbao District, Jingmen City, Hubei Province Patentee after: Hubei Jiuxiang Electronic Technology Co.,Ltd. Address before: Building A3-A4, Xinqiao Electronic Information Industry Park, No.9 Changxing Avenue, Dongbao District, Jingmen City, Hubei Province Patentee before: HUBEI JIUXIANG ELECTRONIC TECHNOLOGY Co.,Ltd. |
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Denomination of invention: The Method of Using Ink Brushing to Prevent Adhesive Overflow during Packaging for Chip LED Circuit Boards Effective date of registration: 20230706 Granted publication date: 20170322 Pledgee: Bank of China Limited by Share Ltd. Jingmen branch Pledgor: Hubei Jiuxiang Electronic Technology Co.,Ltd. Registration number: Y2023980047349 |
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