CN103154145B - 固化性树脂组合物及固化物 - Google Patents

固化性树脂组合物及固化物 Download PDF

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Publication number
CN103154145B
CN103154145B CN201180050103.3A CN201180050103A CN103154145B CN 103154145 B CN103154145 B CN 103154145B CN 201180050103 A CN201180050103 A CN 201180050103A CN 103154145 B CN103154145 B CN 103154145B
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CN
China
Prior art keywords
curable resin
group
resin composition
silsesquioxane
carbon
Prior art date
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Expired - Fee Related
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CN201180050103.3A
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English (en)
Chinese (zh)
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CN103154145A (zh
Inventor
秃惠明
井上庆三
不别博文
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Daicel Corp
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Daicel Chemical Industries Ltd
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Publication of CN103154145A publication Critical patent/CN103154145A/zh
Application granted granted Critical
Publication of CN103154145B publication Critical patent/CN103154145B/zh
Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN201180050103.3A 2010-11-25 2011-11-21 固化性树脂组合物及固化物 Expired - Fee Related CN103154145B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010-262919 2010-11-25
JP2010262919A JP2012111875A (ja) 2010-11-25 2010-11-25 硬化性樹脂組成物及び硬化物
PCT/JP2011/076792 WO2012070525A1 (ja) 2010-11-25 2011-11-21 硬化性樹脂組成物及び硬化物

Publications (2)

Publication Number Publication Date
CN103154145A CN103154145A (zh) 2013-06-12
CN103154145B true CN103154145B (zh) 2015-09-16

Family

ID=46145867

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180050103.3A Expired - Fee Related CN103154145B (zh) 2010-11-25 2011-11-21 固化性树脂组合物及固化物

Country Status (4)

Country Link
JP (1) JP2012111875A (enExample)
KR (1) KR20140006811A (enExample)
CN (1) CN103154145B (enExample)
WO (1) WO2012070525A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5933932B2 (ja) * 2011-05-06 2016-06-15 株式会社カネカ 硬化性組成物
WO2013008842A1 (ja) * 2011-07-14 2013-01-17 積水化学工業株式会社 光半導体装置用封止剤及び光半導体装置
JP5937798B2 (ja) * 2011-09-07 2016-06-22 株式会社ダイセル ラダー型シルセスキオキサン及びその製造方法、並びに、硬化性樹脂組成物及びその硬化物
JP6059010B2 (ja) * 2012-12-28 2017-01-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
TWI523914B (zh) * 2013-01-09 2016-03-01 大賽璐股份有限公司 Hardened resin composition and hardened product thereof
EP2957599A4 (en) 2013-02-14 2015-12-23 Daicel Corp HARDENABLE RESIN COMPOSITION, HARDENED PRODUCT, SEALING ELEMENT AND SEMICONDUCTOR ELEMENT
KR101545471B1 (ko) * 2013-08-01 2015-08-18 주식회사 다이셀 경화성 수지 조성물 및 이를 사용한 반도체 장치
WO2015016001A1 (ja) * 2013-08-02 2015-02-05 株式会社ダイセル 硬化性樹脂組成物及びそれを用いた半導体装置
MY157548A (en) * 2013-08-06 2016-06-16 Daicel Corp Curing resin composition and semiconductor device employing same
JP2015110694A (ja) * 2013-12-06 2015-06-18 サンユレック株式会社 シリコーン樹脂組成物
KR20170016432A (ko) * 2014-06-06 2017-02-13 주식회사 다이셀 경화성 수지 조성물, 경화물, 밀봉재 및 반도체 장치
JP6496185B2 (ja) * 2015-05-20 2019-04-03 株式会社ダイセル 硬化性シリコーン樹脂組成物及びその硬化物
JP6344333B2 (ja) * 2015-08-05 2018-06-20 信越化学工業株式会社 付加硬化性シリコーンゴム組成物
CN111819254B (zh) * 2018-08-31 2022-06-10 瓦克化学股份公司 可固化的有机聚硅氧烷组合物、密封剂和半导体器件
CN111909527B (zh) * 2019-05-10 2021-09-28 中国科学院化学研究所 可交联的有机硅组合物及反应产物及制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005068268A (ja) * 2003-08-22 2005-03-17 Ge Toshiba Silicones Co Ltd 光学材料用硬化性組成物
WO2009154260A1 (en) * 2008-06-18 2009-12-23 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition and semiconductor device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1058730C (zh) * 1994-01-21 2000-11-22 中国科学院化学研究所 高规整性梯形聚氢倍半硅氧烷及其共聚物和它们的制法
JP2002348473A (ja) * 2001-05-23 2002-12-04 Asahi Denka Kogyo Kk 硬化性組成物
JP5225528B2 (ja) * 2001-05-30 2013-07-03 株式会社Ａｄｅｋａ ケイ素含有重合体の製造方法
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4494077B2 (ja) * 2004-04-22 2010-06-30 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 光学材料封止用硬化性組成物
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
JP5705416B2 (ja) * 2008-04-11 2015-04-22 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 半導体用硬化性シリコーン組成物及びそれを用いた半導体装置
JP5667740B2 (ja) * 2008-06-18 2015-02-12 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP5426482B2 (ja) * 2010-05-31 2014-02-26 信越化学工業株式会社 発光ダイオード用付加硬化型シリコーン樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005068268A (ja) * 2003-08-22 2005-03-17 Ge Toshiba Silicones Co Ltd 光学材料用硬化性組成物
WO2009154260A1 (en) * 2008-06-18 2009-12-23 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition and semiconductor device

Also Published As

Publication number Publication date
JP2012111875A (ja) 2012-06-14
WO2012070525A1 (ja) 2012-05-31
KR20140006811A (ko) 2014-01-16
CN103154145A (zh) 2013-06-12

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