CN103097957B - 移动体装置、物体处理装置、曝光装置、平板显示器的制造方法、及元件制造方法 - Google Patents

移动体装置、物体处理装置、曝光装置、平板显示器的制造方法、及元件制造方法 Download PDF

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Publication number
CN103097957B
CN103097957B CN201180043098.3A CN201180043098A CN103097957B CN 103097957 B CN103097957 B CN 103097957B CN 201180043098 A CN201180043098 A CN 201180043098A CN 103097957 B CN103097957 B CN 103097957B
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moving body
exposure
devices
substrate
mobile
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CN103097957A (zh
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青木保夫
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Nikon Corp
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Nikon Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Epidemiology (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Public Health (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201180043098.3A 2010-09-07 2011-09-05 移动体装置、物体处理装置、曝光装置、平板显示器的制造方法、及元件制造方法 Active CN103097957B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510651366.XA CN105404097B (zh) 2010-09-07 2011-09-05 移动体装置、物体处理装置、曝光装置、平板显示器的制造方法、及元件制造方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US38043310P 2010-09-07 2010-09-07
US61/380,433 2010-09-07
US13/223,970 US20120064460A1 (en) 2010-09-07 2011-09-01 Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US13/223,970 2011-09-01
PCT/JP2011/070667 WO2012033212A1 (en) 2010-09-07 2011-09-05 Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method

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CN103097957B true CN103097957B (zh) 2015-11-25

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CN201510651366.XA Active CN105404097B (zh) 2010-09-07 2011-09-05 移动体装置、物体处理装置、曝光装置、平板显示器的制造方法、及元件制造方法

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US (1) US20120064460A1 (cg-RX-API-DMAC7.html)
JP (4) JP5909934B2 (cg-RX-API-DMAC7.html)
KR (3) KR102072074B1 (cg-RX-API-DMAC7.html)
CN (2) CN103097957B (cg-RX-API-DMAC7.html)
HK (1) HK1222921A1 (cg-RX-API-DMAC7.html)
TW (4) TWI720466B (cg-RX-API-DMAC7.html)
WO (1) WO2012033212A1 (cg-RX-API-DMAC7.html)

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CN102483580B (zh) * 2009-08-20 2015-04-01 株式会社尼康 物体处理装置、曝光装置及曝光方法、以及元件制造方法
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US20110042874A1 (en) * 2009-08-20 2011-02-24 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
US20120064460A1 (en) * 2010-09-07 2012-03-15 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US8598538B2 (en) * 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
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JP5958692B2 (ja) * 2012-04-04 2016-08-02 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び移動体の駆動方法並びに露光方法
JP6035670B2 (ja) * 2012-08-07 2016-11-30 株式会社ニコン 露光方法、フラットパネルディスプレイの製造方法、及びデバイス製造方法、並びに露光装置
CN107436540B (zh) * 2012-08-08 2020-05-26 株式会社尼康 物体交换方法、物体交换系统、曝光装置、平面显示器的制造方法、及组件制造方法
JP6172913B2 (ja) * 2012-10-23 2017-08-02 キヤノン株式会社 ステージ装置、露光装置および物品の製造方法
JP6086299B2 (ja) * 2012-11-13 2017-03-01 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
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US10534277B2 (en) * 2014-03-26 2020-01-14 Nikon Corporation Movable body apparatus, exposure apparatus, manufacturing method of flat panel display, and device manufacturing method
TWI701514B (zh) * 2014-03-28 2020-08-11 日商尼康股份有限公司 移動體裝置、曝光裝置、平板顯示器之製造方法、元件製造方法、及移動體驅動方法
WO2016075801A1 (ja) 2014-11-14 2016-05-19 株式会社ニコン 造形装置及び造形方法
WO2016159062A1 (ja) * 2015-03-30 2016-10-06 株式会社ニコン 物体搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体搬送方法、及び露光方法
CN107407893B (zh) * 2015-03-31 2021-06-01 株式会社尼康 曝光装置、平板显示器的制造方法、器件制造方法及曝光方法
HK1248834A1 (zh) * 2015-09-30 2018-10-19 株式会社尼康 移动体装置、曝光装置、平面显示器的制造方法、及元件制造方法、以及物体的移动方法
JP6885336B2 (ja) * 2015-09-30 2021-06-16 株式会社ニコン 露光装置、露光方法、フラットパネルディスプレイの製造方法、及びデバイス製造方法
KR102766023B1 (ko) * 2015-09-30 2025-02-10 가부시키가이샤 니콘 노광 장치, 플랫 패널 디스플레이의 제조 방법, 및 디바이스 제조 방법, 그리고 노광 방법
CN106814551B (zh) * 2015-11-30 2019-04-12 上海微电子装备（集团）股份有限公司 一种基板交接装置及交接方法
JP6874314B2 (ja) * 2016-09-30 2021-05-19 株式会社ニコン 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
CN109952537B (zh) 2016-10-20 2021-12-24 分子印记公司 在压印光刻过程中定位基板
CN107193142A (zh) * 2017-07-19 2017-09-22 武汉华星光电技术有限公司 配向膜固化系统
CN107228127B (zh) * 2017-07-21 2023-06-06 天津航天机电设备研究所 一种气浮轴承
KR102481264B1 (ko) * 2018-01-04 2022-12-26 삼성전자주식회사 디스플레이 장치 및 디스플레이 모듈의 힌지 조립체
JP7473195B2 (ja) * 2020-09-14 2024-04-23 株式会社ブイ・テクノロジー 集束荷電粒子ビーム装置
JP7877141B2 (ja) * 2022-09-20 2026-06-22 キオクシア株式会社 パターン形成方法、半導体装置の製造方法、及びインプリント装置
KR20240154275A (ko) 2023-04-18 2024-10-25 삼성전자주식회사 반도체 소자용 계측 장비 및 이를 이용한 계측 방법
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CN103097957A (zh) 2013-05-08
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JP5909934B2 (ja) 2016-04-27
TW201932994A (zh) 2019-08-16
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TW201631687A (zh) 2016-09-01
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