CN103087528A - 有机硅树脂组合物、片及其制法、光半导体元件装置 - Google Patents

有机硅树脂组合物、片及其制法、光半导体元件装置 Download PDF

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Publication number
CN103087528A
CN103087528A CN2012104294471A CN201210429447A CN103087528A CN 103087528 A CN103087528 A CN 103087528A CN 2012104294471 A CN2012104294471 A CN 2012104294471A CN 201210429447 A CN201210429447 A CN 201210429447A CN 103087528 A CN103087528 A CN 103087528A
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Prior art keywords
silicone resin
resin composition
organopolysiloxane
ethylenically unsaturated
resin sheet
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CN2012104294471A
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Chinese (zh)
Inventor
松田广和
木村龙一
片山博之
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Nitto Denko Corp
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Nitto Denko Corp
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Publication of CN103087528A publication Critical patent/CN103087528A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/19—Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
CN2012104294471A 2011-10-31 2012-10-31 有机硅树脂组合物、片及其制法、光半导体元件装置 Pending CN103087528A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011238215A JP2013095809A (ja) 2011-10-31 2011-10-31 シリコーン樹脂組成物、シリコーン樹脂シート、光半導体素子装置、および、シリコーン樹脂シートの製造方法。
JP2011-238215 2011-10-31

Publications (1)

Publication Number Publication Date
CN103087528A true CN103087528A (zh) 2013-05-08

Family

ID=47046429

Family Applications (1)

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CN2012104294471A Pending CN103087528A (zh) 2011-10-31 2012-10-31 有机硅树脂组合物、片及其制法、光半导体元件装置

Country Status (6)

Country Link
US (1) US8779043B2 (enExample)
EP (1) EP2586830B1 (enExample)
JP (1) JP2013095809A (enExample)
KR (1) KR20130047665A (enExample)
CN (1) CN103087528A (enExample)
TW (1) TWI486403B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106574118A (zh) * 2014-07-24 2017-04-19 中央硝子株式会社 固化性有机硅树脂组合物和其固化物，以及使用它们的光半导体装置
CN107722634A (zh) * 2017-09-26 2018-02-23 杭州师范大学 一种低密度硅橡胶及其制备方法
TWI780530B (zh) * 2019-12-04 2022-10-11 明基材料股份有限公司 一種具阻水氣特性的矽膠薄膜

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011219597A (ja) * 2010-04-08 2011-11-04 Nitto Denko Corp シリコーン樹脂シート
JP2014005324A (ja) * 2012-06-21 2014-01-16 Nitto Denko Corp シリコーン樹脂組成物、半硬化体シート、シリコーン硬化体の製造方法、発光ダイオード装置およびその製造方法
TW201409768A (zh) 2012-07-17 2014-03-01 日東電工股份有限公司 被覆有密封層之半導體元件及半導體裝置之製造方法
US9536799B2 (en) * 2012-12-21 2017-01-03 Dow Corning Corporation Hot-melt type curable silicone composition for compression molding or laminating
JP2015024571A (ja) * 2013-07-26 2015-02-05 日東電工株式会社 シートの製造方法およびシート製造装置
TWI680152B (zh) * 2014-10-16 2019-12-21 日商住友大阪水泥股份有限公司 表面改質金屬氧化物粒子分散液及其製造方法、表面改質金屬氧化物粒子-矽酮樹脂複合組成物、表面改質金屬氧化物粒子-矽酮樹脂複合物、光學構件以及發光裝置
FR3029205B1 (fr) * 2014-11-27 2018-05-25 Institut Vedecom Encapsulation de composants electroniques dans des materiaux polymeres
CN107406677A (zh) * 2015-03-05 2017-11-28 道康宁东丽株式会社 可固化有机聚硅氧烷组合物、其用途以及由该组合物制备的层合体
KR102065987B1 (ko) * 2016-03-23 2020-01-15 주식회사 엘지화학 반도체 웨이퍼 표면 보호용 점착 필름 및 이의 제조방법
CN112341821B (zh) * 2019-08-06 2022-06-14 北京科化新材料科技有限公司 一种固体硅树脂复合物及其制备方法和应用
EP4021982A4 (en) * 2019-08-26 2023-06-14 Henkel AG & Co. KGaA EXPANDABLE SILICONE COMPOSITION, METHOD OF MAKING AND USE THEREOF
KR20230033466A (ko) * 2021-09-01 2023-03-08 주식회사 한솔케미칼 돔 형상이 가능한 경화성 실리콘 조성물 및 그 경화물
WO2025142577A1 (ja) * 2023-12-27 2025-07-03 東京エレクトロン株式会社 基板処理方法、及び基板処理システム

Citations (7)

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US4603168A (en) * 1984-02-21 1986-07-29 Toray Silicone Co., Ltd. Method for curing organopolysiloxane compositions and the compositions
US20040116640A1 (en) * 2002-11-29 2004-06-17 Kei Miyoshi Silicone resin composition for LED devices
CN1666326A (zh) * 2002-05-16 2005-09-07 陶氏康宁公司 半导体封装件及其制备方法
US20050212008A1 (en) * 2002-11-29 2005-09-29 Shin-Etsu Chemical Co., Ltd. LED devices and silicone resin composition therefor
CN1738867A (zh) * 2002-12-04 2006-02-22 罗狄亚化学公司 可通过聚加成交联的单组分粘合硅氧烷弹性体组合物
CN1969015A (zh) * 2004-06-18 2007-05-23 陶氏康宁东丽株式会社 可固化的有机聚硅氧烷组合物
US20080276983A1 (en) * 2005-11-04 2008-11-13 Robert Andrew Drake Encapsulation of Photovoltaic Cells

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US4558109A (en) * 1984-07-25 1985-12-10 Sws Silicones Corporation Curable organopolysiloxane compositions
JPS6183251A (ja) * 1984-10-01 1986-04-26 Shin Etsu Chem Co Ltd 硬化性オルガノポリシロキサン組成物
US4754013A (en) * 1986-12-29 1988-06-28 Dow Corning Corporation Self-adhering polyorganosiloxane compositions
US5270425A (en) * 1992-11-23 1993-12-14 Dow Corning Corporation One-part curable organosiloxane compositions
JP3523098B2 (ja) 1998-12-28 2004-04-26 信越化学工業株式会社 付加硬化型シリコーン組成物
JP5072263B2 (ja) 2006-05-16 2012-11-14 東レ・ダウコーニング株式会社 硬化性シリコーンレジン組成物およびその硬化物
JP5138924B2 (ja) 2006-12-14 2013-02-06 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 光半導体封止用シリコーンゴム組成物および光半導体装置
JP2009084511A (ja) 2007-10-02 2009-04-23 Sekisui Chem Co Ltd 光半導体用封止シート及び光半導体素子
JP5566088B2 (ja) * 2008-12-12 2014-08-06 日東電工株式会社 熱硬化性シリコーン樹脂用組成物
EP2196503B1 (en) 2008-12-12 2015-02-18 Nitto Denko Corporation Thermosetting silicone resin composition, silicone resin, silicone resin sheet and use thereof
JP5566036B2 (ja) * 2009-02-02 2014-08-06 日東電工株式会社 熱硬化性シリコーン樹脂用組成物
US8470952B2 (en) * 2009-12-24 2013-06-25 Nitto Denko Corporation Composition for thermosetting silicone resin
JP2011178888A (ja) * 2010-03-01 2011-09-15 Nitto Denko Corp 熱硬化性シリコーン樹脂用組成物
JP2012082320A (ja) * 2010-10-12 2012-04-26 Nitto Denko Corp 半硬化状シリコーン樹脂シート

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603168A (en) * 1984-02-21 1986-07-29 Toray Silicone Co., Ltd. Method for curing organopolysiloxane compositions and the compositions
CN1666326A (zh) * 2002-05-16 2005-09-07 陶氏康宁公司 半导体封装件及其制备方法
US20040116640A1 (en) * 2002-11-29 2004-06-17 Kei Miyoshi Silicone resin composition for LED devices
US20050212008A1 (en) * 2002-11-29 2005-09-29 Shin-Etsu Chemical Co., Ltd. LED devices and silicone resin composition therefor
CN1738867A (zh) * 2002-12-04 2006-02-22 罗狄亚化学公司 可通过聚加成交联的单组分粘合硅氧烷弹性体组合物
CN1969015A (zh) * 2004-06-18 2007-05-23 陶氏康宁东丽株式会社 可固化的有机聚硅氧烷组合物
US20080276983A1 (en) * 2005-11-04 2008-11-13 Robert Andrew Drake Encapsulation of Photovoltaic Cells
CN101548391A (zh) * 2005-11-04 2009-09-30 陶氏康宁公司 封装光伏电池

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106574118A (zh) * 2014-07-24 2017-04-19 中央硝子株式会社 固化性有机硅树脂组合物和其固化物，以及使用它们的光半导体装置
CN107722634A (zh) * 2017-09-26 2018-02-23 杭州师范大学 一种低密度硅橡胶及其制备方法
CN107722634B (zh) * 2017-09-26 2020-08-11 杭州师范大学 一种低密度硅橡胶及其制备方法
TWI780530B (zh) * 2019-12-04 2022-10-11 明基材料股份有限公司 一種具阻水氣特性的矽膠薄膜

Also Published As

Publication number Publication date
US20130105997A1 (en) 2013-05-02
TWI486403B (zh) 2015-06-01
EP2586830B1 (en) 2014-05-14
KR20130047665A (ko) 2013-05-08
EP2586830A1 (en) 2013-05-01
US8779043B2 (en) 2014-07-15
JP2013095809A (ja) 2013-05-20
TW201317306A (zh) 2013-05-01

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Application publication date: 20130508