CN102971882B - 光电设备及制造其的方法 - Google Patents

光电设备及制造其的方法 Download PDF

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Publication number
CN102971882B
CN102971882B CN201180022255.2A CN201180022255A CN102971882B CN 102971882 B CN102971882 B CN 102971882B CN 201180022255 A CN201180022255 A CN 201180022255A CN 102971882 B CN102971882 B CN 102971882B
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CN
China
Prior art keywords
layer
lid
conductive layer
tinsel
photoconductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180022255.2A
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English (en)
Chinese (zh)
Other versions
CN102971882A (zh
Inventor
J·范登布兰德
H·利弗卡
E·W·A·扬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Koninklijke Philips NV
Original Assignee
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Koninklijke Philips Electronics NV
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Application filed by Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO, Koninklijke Philips Electronics NV filed Critical Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Publication of CN102971882A publication Critical patent/CN102971882A/zh
Application granted granted Critical
Publication of CN102971882B publication Critical patent/CN102971882B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electroluminescent Light Sources (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Laminated Bodies (AREA)
  • Light Receiving Elements (AREA)
CN201180022255.2A 2010-03-05 2011-03-01 光电设备及制造其的方法 Expired - Fee Related CN102971882B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10155599.3 2010-03-05
EP20100155599 EP2363905A1 (en) 2010-03-05 2010-03-05 Opto-electrical device and method for manufacturing thereof
PCT/NL2011/050141 WO2011108921A1 (en) 2010-03-05 2011-03-01 Opto-electrical device and method for manufacturing thereof

Publications (2)

Publication Number Publication Date
CN102971882A CN102971882A (zh) 2013-03-13
CN102971882B true CN102971882B (zh) 2016-08-31

Family

ID=42320036

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180022255.2A Expired - Fee Related CN102971882B (zh) 2010-03-05 2011-03-01 光电设备及制造其的方法

Country Status (5)

Country Link
US (1) US9437510B2 (enExample)
EP (2) EP2363905A1 (enExample)
JP (1) JP6159929B2 (enExample)
CN (1) CN102971882B (enExample)
WO (1) WO2011108921A1 (enExample)

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KR101903744B1 (ko) * 2012-01-10 2018-10-04 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
US9219245B2 (en) * 2011-11-18 2015-12-22 Samsung Display Co., Ltd. Organic light emitting diode display and manufacturing method thereof
EP2810314B1 (en) 2012-02-03 2020-08-12 Koninklijke Philips N.V. Oled device and manufacture thereof
EP2629347A1 (en) * 2012-02-17 2013-08-21 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Opto-electric device and method for manufacturing the same
JP5907766B2 (ja) * 2012-03-14 2016-04-26 株式会社カネカ 発光デバイスおよび発光デバイスの製造方法
JP5907765B2 (ja) * 2012-03-14 2016-04-26 株式会社カネカ 発光デバイスおよび発光デバイスの製造方法
US20130248914A1 (en) * 2012-03-20 2013-09-26 General Electric Company Packaged optoelectronic device and process for manufacturing
EP2875402A4 (en) * 2012-07-23 2015-11-25 Ricoh Co Ltd ELECTROCHROMIC DEVICE AND METHOD FOR PRODUCING AN ELECTROCHROMIC DEVICE
JP6003332B2 (ja) * 2012-07-23 2016-10-05 株式会社リコー エレクトロクロミック装置及びその製造方法
JP6064761B2 (ja) * 2012-11-02 2017-01-25 株式会社リコー エレクトロクロミック装置及びその製造方法
JP6078295B2 (ja) * 2012-10-29 2017-02-08 株式会社カネカ 有機ｅｌ装置
DE102012220724B4 (de) 2012-11-14 2022-05-25 Pictiva Displays International Limited Optoelektronisches Bauelement
DE102012221191B4 (de) * 2012-11-20 2022-03-17 Pictiva Displays International Limited Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
US20160111675A1 (en) * 2013-05-23 2016-04-21 Koninklijke Philips N.V. Organic light-emitting device
DE102014102255B4 (de) * 2014-02-21 2021-10-28 Pictiva Displays International Limited Organisches lichtemittierendes Bauelement und Verfahren zum Herstellen eines organischen lichtemittierenden Bauelements
DE102014103747B4 (de) 2014-03-19 2024-06-13 Osram Oled Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
KR102296915B1 (ko) * 2014-07-30 2021-09-02 삼성디스플레이 주식회사 유기 발광 표시 장치
DE102014111345B4 (de) * 2014-08-08 2023-05-04 Osram Oled Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
DE102014119539B4 (de) * 2014-12-23 2025-04-10 Pictiva Displays International Limited Organisches optoelektronisches Bauelement und Verfahren zum Herstellen eines organischen optoelektronischen Bauelements
US10483410B2 (en) * 2015-10-20 2019-11-19 Alta Devices, Inc. Forming front metal contact on solar cell with enhanced resistance to stress
JP6685122B2 (ja) * 2015-12-16 2020-04-22 住友化学株式会社 有機ｅｌ素子の製造方法及び有機ｅｌ素子
JP6817819B2 (ja) * 2017-01-11 2021-01-20 株式会社東海理化電機製作所 有機ｅｌ素子、及び有機ｅｌ素子の製造方法
WO2020112340A1 (en) * 2018-11-26 2020-06-04 Corning Incorporated Methods for forming patterned insulating layers on conductive layers and devices manufactured using such methods
EP3671866A1 (en) * 2018-12-18 2020-06-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Photovoltaic product and method of manufacturing the same
DE102020123553B4 (de) * 2019-09-10 2024-08-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Organisches Leuchtdiodenmodul
CN113900308B (zh) * 2021-11-02 2025-04-08 浙江精一新材料科技有限公司 一种电极固定结构、调光膜及调光玻璃
CN116075080A (zh) * 2021-11-04 2023-05-05 光宝科技新加坡私人有限公司 功率模块

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CN1957485A (zh) * 2004-04-02 2007-05-02 通用电气公司 具有密封边沿的有机电子封装及其制造方法
CN101218692A (zh) * 2005-06-10 2008-07-09 通用电气公司 气密性密封封装体及其制造方法
CN101228649A (zh) * 2005-07-27 2008-07-23 皇家飞利浦电子股份有限公司 具有密封的集成驱动电路的发光器件
EP2144290A1 (en) * 2008-07-08 2010-01-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Electronic device and method of manufacturing the same

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JPH09129369A (ja) * 1995-10-31 1997-05-16 Nippon Seiki Co Ltd 電界発光素子及びその製造方法
US6506616B1 (en) 1999-11-18 2003-01-14 Texas Instruments Incorporated Photolithographic method for fabricating organic light-emitting diodes
US7052355B2 (en) * 2003-10-30 2006-05-30 General Electric Company Organic electro-optic device and method for making the same
JP2008103254A (ja) * 2006-10-20 2008-05-01 Tokai Rubber Ind Ltd 有機ｅｌデバイス
JP5112707B2 (ja) * 2007-01-26 2013-01-09 パナソニック株式会社 有機エレクトロルミネッセンス発光装置
US7977877B2 (en) 2007-03-02 2011-07-12 Global Oled Technology Llc Flat panel OLED device having deformable substrate
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Patent Citations (4)

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CN1957485A (zh) * 2004-04-02 2007-05-02 通用电气公司 具有密封边沿的有机电子封装及其制造方法
CN101218692A (zh) * 2005-06-10 2008-07-09 通用电气公司 气密性密封封装体及其制造方法
CN101228649A (zh) * 2005-07-27 2008-07-23 皇家飞利浦电子股份有限公司 具有密封的集成驱动电路的发光器件
EP2144290A1 (en) * 2008-07-08 2010-01-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Electronic device and method of manufacturing the same

Also Published As

Publication number Publication date
US9437510B2 (en) 2016-09-06
WO2011108921A1 (en) 2011-09-09
CN102971882A (zh) 2013-03-13
EP2363905A1 (en) 2011-09-07
EP2543089A1 (en) 2013-01-09
JP6159929B2 (ja) 2017-07-12
JP2013527965A (ja) 2013-07-04
EP2543089B1 (en) 2017-01-11
US20130087824A1 (en) 2013-04-11

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: Delft

Applicant after: TNO(Netherlands Organisation for Applied Scientific Research)

Applicant after: Koninkl Philips Electronics NV

Address before: Delft

Applicant before: The Netherlands Organization for Applied Scientific Research (TNO)

Applicant before: Koninkl Philips Electronics NV

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160831

Termination date: 20190301