CN102971624B - 多晶硅棒以及多晶硅棒的制造方法 - Google Patents

多晶硅棒以及多晶硅棒的制造方法 Download PDF

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Publication number
CN102971624B
CN102971624B CN201180033481.0A CN201180033481A CN102971624B CN 102971624 B CN102971624 B CN 102971624B CN 201180033481 A CN201180033481 A CN 201180033481A CN 102971624 B CN102971624 B CN 102971624B
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polycrystalline silicon
silicon rod
frequency
sound
rod
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CN102971624A (zh
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祢津茂义
久米史高
冈田淳一
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon
    • C01B33/021—Preparation
    • C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
    • C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M7/00—Vibration-testing of structures; Shock-testing of structures
    • G01M7/08—Shock-testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/045—Analysing solids by imparting shocks to the workpiece and detecting the vibrations or the acoustic waves caused by the shocks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/12—Analysing solids by measuring frequency or resonance of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4409—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison
    • G01N29/4418—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison with a model, e.g. best-fit, regression analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4454—Signal recognition, e.g. specific values or portions, signal events, signatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/46—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by spectral analysis, e.g. Fourier analysis or wavelet analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G01N2291/0234—Metals, e.g. steel
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/262—Linear objects
    • G01N2291/2626—Wires, bars, rods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/269—Various geometry objects
    • G01N2291/2697—Wafer or (micro)electronic parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Signal Processing (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Organic Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
CN201180033481.0A 2010-07-06 2011-07-04 多晶硅棒以及多晶硅棒的制造方法 Active CN102971624B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010-153828 2010-07-06
JP2010153828A JP5238762B2 (ja) 2010-07-06 2010-07-06 多結晶シリコン棒および多結晶シリコン棒の製造方法
PCT/JP2011/003800 WO2012004968A1 (ja) 2010-07-06 2011-07-04 多結晶シリコン棒および多結晶シリコン棒の製造方法

Publications (2)

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CN102971624A CN102971624A (zh) 2013-03-13
CN102971624B true CN102971624B (zh) 2015-04-01

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US (1) US9006002B2 (https=)
EP (1) EP2594933A4 (https=)
JP (1) JP5238762B2 (https=)
CN (1) CN102971624B (https=)
AU (1) AU2011275287B2 (https=)
WO (1) WO2012004968A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108732307A (zh) * 2018-05-04 2018-11-02 扬州连城金晖金刚线切片研发有限公司 一种金刚线切片的单、多晶硅棒检验方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5828795B2 (ja) 2012-04-04 2015-12-09 信越化学工業株式会社 多結晶シリコンの結晶配向度評価方法、多結晶シリコン棒の選択方法、および単結晶シリコンの製造方法
JP2014001096A (ja) 2012-06-18 2014-01-09 Shin Etsu Chem Co Ltd 多結晶シリコンの結晶配向度評価方法、多結晶シリコン棒の選択方法、多結晶シリコン棒、多結晶シリコン塊、および、単結晶シリコンの製造方法
JP5868286B2 (ja) * 2012-08-10 2016-02-24 信越化学工業株式会社 多結晶シリコン棒の選択方法、多結晶シリコン塊の製造方法、及び、単結晶シリコンの製造方法
DE102013207251A1 (de) * 2013-04-22 2014-10-23 Wacker Chemie Ag Verfahren zur Herstellung von polykristallinem Silicium
JP6181620B2 (ja) 2014-09-04 2017-08-16 信越化学工業株式会社 多結晶シリコン製造用反応炉、多結晶シリコン製造装置、多結晶シリコンの製造方法、及び、多結晶シリコン棒または多結晶シリコン塊
CN108168868A (zh) * 2017-12-29 2018-06-15 绍兴文理学院 一种检测型钢构件自振频率的方法
CN108225955B (zh) * 2017-12-30 2024-01-12 洛阳阿特斯光伏科技有限公司 一种硅棒的硬度评估方法
US11655541B2 (en) 2018-12-17 2023-05-23 Wacker Chemie Ag Process for producing polycrystalline silicon

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JP2001294416A (ja) * 2000-04-07 2001-10-23 Mitsubishi Materials Polycrystalline Silicon Corp 多結晶シリコンの製造装置
JP2002340869A (ja) * 2001-05-11 2002-11-27 Nippon Steel Corp 打音検査物の非破壊検査方法、非破壊検査装置及び品質管理方法
JP2004149324A (ja) * 2002-10-28 2004-05-27 Sumitomo Mitsubishi Silicon Corp 多結晶シリコンロッド及びその製造方法、並びにそのロッドの製造に使用されるシリコン芯材
CN101135673A (zh) * 2006-08-30 2008-03-05 瓦克化学有限公司 高纯多晶硅的无损材料检测方法

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US4062229A (en) * 1977-02-22 1977-12-13 General Electric Company Method of testing the integrity of installed rock bolts
JP2001021543A (ja) 1999-07-06 2001-01-26 Sumitomo Sitix Of Amagasaki Inc シリコン塊の探傷方法
JP2001235451A (ja) * 2000-02-25 2001-08-31 Mitsubishi Electric Corp 試料の欠陥測定装置及び方法
US6941811B2 (en) * 2003-08-04 2005-09-13 Nan Ya Technology Corporation Method and apparatus for detecting wafer flaw
JP4575886B2 (ja) 2006-02-14 2010-11-04 シャープ株式会社 多結晶半導体ウエハの割れ検査装置および割れ検査方法

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JP2001294416A (ja) * 2000-04-07 2001-10-23 Mitsubishi Materials Polycrystalline Silicon Corp 多結晶シリコンの製造装置
JP2002340869A (ja) * 2001-05-11 2002-11-27 Nippon Steel Corp 打音検査物の非破壊検査方法、非破壊検査装置及び品質管理方法
JP2004149324A (ja) * 2002-10-28 2004-05-27 Sumitomo Mitsubishi Silicon Corp 多結晶シリコンロッド及びその製造方法、並びにそのロッドの製造に使用されるシリコン芯材
CN101135673A (zh) * 2006-08-30 2008-03-05 瓦克化学有限公司 高纯多晶硅的无损材料检测方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108732307A (zh) * 2018-05-04 2018-11-02 扬州连城金晖金刚线切片研发有限公司 一种金刚线切片的单、多晶硅棒检验方法

Also Published As

Publication number Publication date
AU2011275287B2 (en) 2013-10-03
US20130102092A1 (en) 2013-04-25
US9006002B2 (en) 2015-04-14
AU2011275287A1 (en) 2013-01-24
CN102971624A (zh) 2013-03-13
EP2594933A1 (en) 2013-05-22
JP2012017997A (ja) 2012-01-26
WO2012004968A1 (ja) 2012-01-12
JP5238762B2 (ja) 2013-07-17
EP2594933A4 (en) 2017-05-17

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