CN102939610B - 用于小批量制造射频识别标记和标签的方法、系统和装置 - Google Patents

用于小批量制造射频识别标记和标签的方法、系统和装置 Download PDF

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CN102939610B
CN102939610B CN201180029487.0A CN201180029487A CN102939610B CN 102939610 B CN102939610 B CN 102939610B CN 201180029487 A CN201180029487 A CN 201180029487A CN 102939610 B CN102939610 B CN 102939610B
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chip
pattern
information
adhesive
antenna pattern
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CN102939610A (zh
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I·J·福斯特
C·K·厄斯纳
R·里维尔斯
B·金斯顿
P·科克雷尔
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Avery Dennison Retail Information Services LLC
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Avery Dennison Corp
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    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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Abstract

本发明是用于以便利和经济的方式生产随时可用的RFID器件的方法和装置。本发明的装置可以与消费品的制造商共置。

Description

用于小批量制造射频识别标记和标签的方法、系统和装置
相关申请的交叉引用
本申请要求2010年6月14日提交的美国临时申请61/354,380、2010年6月14日提交的美国临时申请61/354,388和2010年6月14日提交的美国临时申请61/354,393的权益，通过引用将其全部以其整体并入本文。
技术领域
本发明出现在制造射频识别(“RFID”)器件的领域。更具体地，本发明涉及用于在小批量生产中生产RFID标记、标签、票据、小册子和其他印刷材料的方法、系统和装置。
发明背景
可以以许多不同的方法生产RFID器件并且通常包括某种连接至天线的芯片，其随后用于制造RFID器件。可通过使用条带连接芯片，或可直接将芯片应用至天线。天线是导电材料，其可通过在基底上蚀刻、模切或印刷导电油墨生产。
导电层压片如箔层压片被用在许多应用中，范围从微波包装的容器到智能卡。这种层压片通常通过模切、冲压和其他机械方法形成，其一般很好地适于可形成简单形状或图案的高速情况。
对于电路需求的增加已经引起对于可快速并且有效地生产这种电路的制造方法的需要。一种这样的方法公开在美国专利申请2007/0171129A1中。该方法包括步骤：提供加强的金属箔层压片，其具有结合至加强层的金属箔层，和结合至金属箔层压片的载体层。方法包括使用旋转模切机通过金属箔层压片至载体层切割天线图案的步骤。该方法结束为：通过去除加强的金属箔层压片的不期望余料(matrix)部分，以便提供布置在载体层上的金属箔层压片天线。
旋转模切机已经用于生产各种结构，因为其又快又便宜。但是，旋转模切机的分辨率差并且目前受限于切割线之间具有约1mm的最小距离。使用旋转模切机切割需要高精确度和公差的构造的另外问题是旋转模切机使用的圆柱形模具不能快速或轻易地改变。因此，设计不容易改变，并且由于需要经常更换模头，因此特定设计的小批量生产通常经济上是不可行的。而且，设计的任何改变会需要大量订货至交货的时间(lead-time)，因为每次改变设计必须制作新的圆柱形模具。这可能产生模头的大量库存，大量模头的存储可能占用有用的工厂房屋空间。
因此，所需要的是可以以容易使用并且相对便宜的完成形式小批量生产RFID器件的方法和装置，使得RFID器件制造可以与消费品比如服装物品的制造共置。
发明简述
下述的本发明实施方式不意欲是穷举性的或将本发明限于下面详细描述中所公开的精确形式。而是，所述实施方式被选择和描述以便本领域的其他技术人员可以明白和理解本发明的原理和实践。
本发明提供用于以小批量或少量形式并且在与消费品生产设施共置的环境中生产RFID器件的方法、系统和装置。
在本发明的一个示例性实施方式中，描述了生产用于消费品的随时可用的RFID器件的方法，并且该方法包括提供基底的步骤，所述基底具有第一和第二面。接着将粘合剂图案施加至基底的第一面并且将导电箔层压至粘合剂的图案。接下来，切割导电箔以形成多个天线图案。将芯片施加至每个天线图案。接着，印刷被施加在基底的第二面上，以形成不同的印刷区域。每个芯片被编码并且被放置在每个天线图案上。读取每个不同的印刷区域并且用每个不同印刷区域的信息与每个芯片中编码的信息匹配。最后，将每个不同的印刷区域从基底分开。
在本发明仍进一步的示例性实施方式中，描述了生产用于消费品的随时可用的RFID器件的装置，并且该装置包括材料供应和导电材料供应。粘合剂涂布台用于将粘合剂图案施加至材料供应。层压台用于将导电材料供应层压至粘合剂图案。第一切割器件用于切割导电材料中的天线图案。第一印刷器件用于将人和或机器可读的标记印刷在材料供应上。芯片放置器件用于将芯片放置在天线图案上以形成RFID器件，以及编码台用于将信息编码在芯片上。装置也包括计算机，其用于比较编码的信息与人和/或机器可读的标记。
在本发明仍进一步的实施方式中，描述了用于消费品的多个随时可用的RFID器件的半成品组件，并且该半成品组件包括具有多个不同天线图案的基底，每个天线图案包括通过激光切割或冷箔工艺中的一种形成的导电箔。粘合剂图案与天线图案以及在其上放置粘合剂图案和天线图案的基底有同样范围。多个芯片，每个芯片用信息编码并且每个芯片被连接至多个天线图案中的一个。提供在基底上的多个印刷区域，每个印刷区域与形成RFID器件的多个天线图案中的一个关联。印刷标记匹配在多个芯片中的每一个上编码的信息。每个RFID器件从基底上可移除，以形成多个随时可用的RFID器件。
在本发明仍进一步的示例性实施方式中，描述了用于生产随时可用的RFID器件的系统，并且该系统包括用于生产消费品的制造地点。计算机用于确定正在生产的消费品的类型并且用于提供形成和编码连同消费品使用的RFID器件的指令。
继续目前描述的实施方式的说明，提供用于该系统的RFID生产单元，RFID生产单元包括材料供应和导电材料供应。粘合剂涂布台用于提供粘合剂图案。层压台用于将导电材料层压至粘合剂图案。切割台用于切割天线图案以基本上匹配粘合剂图案。芯片连接台用于将芯片连接至天线图案。印刷台用于将人和/或机器可读的标记印刷在供应的材料上。阅读器用于读取编码在芯片上的信息并且用于将信息与人和或机器可读的标记匹配。RFID生产单元和制造地点彼此共置。
从下列详细描述，本发明的其他特征和优势对于本领域的技术人员来说是清楚的。不过，应当理解，虽然指出了本发明优选的和其他实施方式，但是通过说明而非限制的方式给出各种实施方式和具体实例的详细描述。可以在不偏离本发明精神的情况下，做出在本发明范围内的许多变化和修改，并且本发明包括所有这样的修改。
附图简述
结合附图，通过参考本发明当前优选示例性实施方式的下面更详细描述，可以更加全面理解和了解本发明的这些目标和优势以及其他目标和优势，其中：
图1描绘了根据本发明的方法和系统生产的示例性半成品组件的正视图；
图2提供了结合实践本发明使用的示例性装置的示意图；
图3显示了结合实践本发明使用的示例性系统的示意图；和
图4图解了阐释实施本发明的示例性方法的框图。
发明详述
在本文中公开的装置和方法通过实例并参考附图详细描述。除非另外指出，图中的相似数字指示参考图中相同、类似或相应的元件。应当明白，可以对公开和描述的实例、布置、构造、组件、元件、装置、方法、材料等做出修改，并且对于具体应用是期望的。在本公开中，具体形状、材料、技术、布置等的任何指定与陈述的具体实例相关，或仅仅是这样的形状、材料、技术、布置等的一般性描述。具体细节或实例的指定不意欲解释为并且不应该解释为强制性的或限制性的，除非特别如此指出。下面参考附图详细公开和描述装置和方法的选择实例。
本发明提供小批量RFID器件的生产，其可以是从一个RFID器件至可能一千个独立单元的小批量生产、批量生产。本发明的方法、装置和系统可用于制造多个单独RFID器件，其可改变从一个器件至另一个器件的器件构造或可产生特定数量的具体单元，接着改变构造以完成终端用户要求的具体订单。例如，消费者可能需要50个单元的第一类型RFID器件和然后100个单元的第二类型的RFID器件。
现参考本发明的图1，其显示半成品10。如本文所使用，术语半成品指经历一个或多个加工步骤以提供完成产品的产品。例如，参考当前的图1，包括RFID器件的多个分开的或不同的印刷区域12、20和30提供在片材11上，其随后可被切断或以其他方式从片材上去除。某些RFID器件，比如是标签的20可具有在被使用前施加的粘合剂涂层(未显示)。RFID器件12可沿着折线18经历折叠步骤并且然后经历将器件12连接至消费品的连接步骤。
分开的或不同的印刷区域12、20和30选自标记、标签、吊牌(hangtag)、证章、货架卡、传单、小册子、宣传资料(marketingcollateral)、票据、卡和其组合。
片材11具有显示在图1中的正面和未显示的后面。片材11具有标记并且在该实施例中包括机器可读的信息40和RFID器件42。标记40和RFID器件42可用于帮助跟踪具体的工作或生产订单或向装置提供指令以产生考虑的具体订单。编码和RFID器件可通过机器比如条形码扫描仪或RFID阅读器读取。
仍参考图1，如先前指出的半成品10包括片材11和几个待用于具体应用的不同印刷区域12、20和30。第一区域或在该实施例中的吊牌半成品12在第一侧面(side)上显示人可读的标记14和机器可读的标记15(条形码)，并且在第二侧面上显示RFID天线16和芯片17。如所示的人和机器可读的标记可涉及零售商信息、品牌信息、定价或具体消费者所需的任何信息。两个侧面由折线18分开。通过围绕标签的周边穿孔片材11时形成的一系列带子19将标记12支撑在片材11上。穿孔19被显示围绕周边延伸并且可容易地被破坏以便将标签12与片材11分开，并且接着进行进一步加工，例如折叠和附着至消费品。
在图1中显示的下一个不同的印刷区域20描述为标签半成品。标签半成品20还具有人可读的标记21和机器可读的标记22，其还可能涉及正在形成的订单的消费者所要求的任何信息。标签半成品20也具有RFID器件23。应当指出标签半成品20的RFID器件23与进一步图解本发明柔韧性的吊牌半成品12的RFID器件16/17不同。即，一个半成品组件可具有第一RFID器件设计，并且另一个半成品组件可具有不同的RFID器件设计。
标签半成品20也通过一系列带子24被支撑在片材11的适当位置，所述带子24再次使得当需要使用或进一步加工时，标签半成品20快速且容易地与片材11分开。
图1的片材11上显示的最终半成品组件30提供了高频(HF)RFID标签。这进一步不同于连同不同印刷区域12和20显示的RFID器件，其例如可以为超高频(UHF)标签。HF器件包括连接线圈的每端以完成电路的多个线圈绕组31和芯片/桥32。
现参考本文所述发明的图2。以材料供应50为示意性开始。材料供应50可选自纸张、织物、非织物或塑料中的一种。尽管材料供应50已经描述为材料的连续辊压，但是应当理解，供应可由一个或多个预切割片材组成，并且本发明可在片材进料构造中实践。
将材料或幅材（web）供应50进料至粘合剂施加器52。粘合剂——其可以是压敏粘合剂或其他合适粘合剂——可在以用于RFID器件的天线的形状或形式的图案中施加，所述RFID器件将如连同半成品片材的图1所见地被形成，或可被满涂或溢流涂布(floodcoating)在供应50上，然后供应50将随后经历固化过程以形成粘性和非粘性区域，粘性区域对应待被形成的天线图案。可通过UV能量或其他合适方法完成固化。
本发明考虑粘合剂可包括光学增亮剂。在优选的实施方式中，光学增亮剂是荧光粉，其是按重量计是粘合剂的大约1%，并且更优选地按重量计是粘合剂的大约.5%。其他触发器或信号可用于启动激光和对齐在辐材中形成的图案，比如辐材中的切口或缝隙、标记油墨(taggantink)、印刷油墨和类似物。
光学增亮剂可提供在这样的区域内，其中箔或导电层压片的至少一个图案的切割发生在箔层压片层中。光学增亮剂可印刷在粘合层的上面，而不是混合在粘合层中。另外，本发明考虑光学增亮剂可印刷在基底上面，而不是混合的粘合层或在粘合层上面。在这个实施方式中，优选粘合层是清澈或透明的，以便可以通过粘合层看见光学增亮剂。
另外，在本发明的一个实施方式中，光学增亮剂可以以箔或导电层压片的形状被印刷，所述层压片将由箔或导电层或材料构建。
接下来，转移片材上的导电材料供应54比如箔、合金或导电油墨被传递以与第一供应50共置。接着将导电材料54通过层压台56部分层压至供应50。部分层压仅仅出现在粘合剂图案或粘合剂图案的粘性部分的区域内。由于箔未完全层压至辐材，所以当去除时，因为箔未被粘合剂污染或具有连接至箔的部分基底，箔形成100%完全可回收的材料。
继续图2的讨论，接着将组合的辐材57进料至切割台或天线形成台58。切割或形成可通过模切、激光切割或冷箔工艺中的一种完成。切割台或形成台也可具有多个单元，比如第一模切或冷箔工艺以及然后激光切割。如本文所使用，示例性冷箔工艺指将粘合剂或其他可固化图案印刷在基底上，接着将箔层施加在图案上，将箔层压至图案上，从而箔粘附至图案并且接着剥离箔，在用箔层覆盖的基底上留下图案。
在天线图案通过切割形成台58形成后，材料的剩余余料在台60处被重绕。现在部分层压辐材57，部分层压是因为其具有粘附至供应50的材料的导电图案，但是剩余量的材料已经被去除。接着辐材57移动芯片或条带放置台62，其中芯片或条带放置在天线上，以完成RFID器件的组装。接下来，RFID器件(芯片或条带)在台64用涉及与分开的印刷区域(参见图1)相关(附着、粘附等)的产品的信息编码。
继续图2的讨论，接着辐材57行进至印刷台66，其中人和或机器可读的标记提供在辐材上(见图1)。标记在每个分开的区域中印刷并且也可在辐材的空白处印刷。完成印刷后，分别在台68读取和/或扫描编码的RFID器件和标记。倘若读取/扫描显示RFID器件上编码的信息与印刷标记不匹配，分开的印刷区域被丢入废弃区域70。这可通过冲压分开的印刷区域实现，比如通过滚冲（rotarypunch）、模冲或其他合适的装置。接着具有编码和印刷标记匹配的一个或多个分开的区域的剩余辐材57被传送至分离台72。接着每个分开的区域在台74被收集并且然后可被运输或以其他方式输送至要求具体订单的终端使用者。
现在转向图3，结合本发明的用于采购产品的示例性系统被呈现并且一般通过数字100指示。系统100包括第一地点110，比如消费者地点，其可以是公司总部、分配或采购地点或进行定制或加工产品的其他位置。第一地点110经全球通信网络120连接至第二地点130，其可包括例如生产消费品150的资产和RFID生产单元140。理想地，RFID生产单元140和消费品制造资产150二者被共置，但是应当理解，两个单元140和150可以在不同的物理地点，但通过通讯系统连接以使得单元容易并且快速地彼此通信。
本发明的系统100开始于从第一地点或消费者地点110发出的消费品或其他产品的订单。订单将通过全球通信网络120被发送至第二地点130，其在该实施例中放置用于制造产品的RFID生产单元140和资产150，所述产品是由第一地点110产生的订单的对象。
第二地点130将接收订单，第二地点130将开始图1中提供的半成品的一系列生产，以及产生消费品或其他产品。随着消费品或产品通过制造资产150产生并且收集，图1的分开的印刷区域被分离并且连接至消费品或其他产品。连接包括去除在半成品的片材中通过如上所讨论的带子支撑的每个分开的印刷区域，并且接着比如通过粘附、粘着或其他连接方式连接至消费品。在标记与消费品关联后，可接着将商品运输至第一地点110或在开始该次序的订单中已指定的另一区域。
现参考图4，其中提供了显示生产完成的RFID器件或半成品的示例性方法(如图1中所示)的框图。方法开始于例如步骤210，其中提供材料供应。应当理解，可以以连续形式比如材料卷或以切割片材形式提供材料供应，其中将片材堆提供至装置以提供供应。材料供应可具有用于形成RFID器件的多个天线。提供的天线可具有普通的图案，其将需要进一步切割或改进以便产生所寻求的最终天线图案。可选地，可提供种板材料（blankmaterial）的供应，并且接着导电材料随后粘附并且连接至基底，以使天线供应。
在材料供应以具体形式的第一天线结构配备的情况中，天线结构可进一步改进，如通过用激光切割机或机械模切机切割。以此方式，可形成大量预制原料，其可被修整以满足许多应用，从而符合大量消费应用的需要。例如，使用图2的装置制造的组件可供应至图4的方法中并且通过激光切割如上所述进一步改进。
应当理解，图4提供具体材料供应的加工并且结合半成品的形成使用的装置，包括施加粘合剂、形成图案、层压箔层至粘合剂图案、切割图案的步骤，并且其他相关步骤意欲包括在本方法中，并且为了简洁，没有必要在本文中重复步骤。
接下来，在步骤220，可进行固定标记的第一印刷。例如，该印刷可包括这些事项，如零售商的名称，或从一个标签至另一个标签未改变的其他信息。在步骤225，将可变信息提供至材料。可变信息可以是例如尺寸、颜色、价格或可从一个标签至另一个标签改变的这种其他信息。接下来，通过扫描或信息的其他读取确认包含在可变信息230中的信息。信息可以是人和机器可读的标记。
可通过许多合适的印刷方法完成提供的印刷，比如非击打式，例如喷墨印刷、离子沉积、激光印刷、击打式印刷、热传递或如可由消费者所要求或可适于生产本文要求的半成品和标记/标签的此类其他方法。
在步骤240，将在条带构造中也可提供的RFID芯片供应至材料供应。接着，在步骤245，用相应于可变印刷信息以及当需要时在过程早期提供的固定信息的信息编码每个芯片或具有条带的芯片。即，当如图1显示的供应的每个分开部分被提供独特标记时，还用涉及与RFID芯片关联的产品的独特标记编码芯片。
在芯片已经在步骤240编码后，将芯片或以条带形式的芯片提供至材料供应并且在步骤250附着。芯片/条带用天线的芯片附着点以对齐的方式附着。
接下来，例如，当产生吊牌时，在步骤255开沟折叠(plowfolded)或密封材料供应。即，就开沟折叠而言，一个面折叠在另一个顶面的上面，以便制造密封组件。可选地，如果提供标签排列，粘合剂可施加至辐材并且密封至辐材。粘合剂可作为传送带构造、粘合剂和衬里的一部分施加。在传送带构造中，粘合剂将相对于衬里对材料供应具有更大的亲和力，这样当需要使用粘合剂时，粘合剂将留在在材料供应上而不是衬里上。
将被制造的最终形式的分开的区域在步骤260完成，并且形成围绕RFID器件和印刷的区域以有助于稍后的分离，如图1中所示。在步骤265，确认RFID芯片的编码和印刷，以确保RFID芯片和印刷彼此对应。如果在芯片上编码的信息和在标记上印刷的信息不匹配，则标记或分开的印刷区域可从材料供应上去除或可选地可被做记号，以显示标签是有缺陷的，从而其在稍后时间不被使用。
接下来，在步骤270收集分开的印刷区域或现在的标记或标签，从而它们可在步骤275被运输或输送至消费品和RFID生产器件所处的制造位置。
因此，可见根据本发明已经提供了一种非常有优势的方法、系统和装置。虽然本发明已结合目前被认为是最实用和优选的实施方式进行描述，但本领域的普通技术人员应当明白本发明不限于已经公开的实施方式，并且可以在本发明的范围内做出许多修改和等同布置，所述范围符合所附权利要求的最宽解释，以包括所有等同结构和产品。
本发明人藉此声明意欲依赖于等同原则以确定和评估发明的合理公正的范围，因为其属于虽然超出但实质上不脱离权利要求中阐释的本发明文字范围的任何装置、系统、方法或制品。

Claims (22)

1.生产用于消费品的随时可用的RFID器件的方法，所述方法包含：
提供基底，所述基底具有第一面和第二面；
施加粘合剂图案至所述基底的所述第一面；
将导电箔层压至所述粘合剂图案；
切割所述导电箔以形成多个天线图案；
施加芯片至所述天线图案中的每一个；
在所述基底的所述第二面印刷机器和/或人可读的标记，以产生不同印刷区域；
编码所述芯片中的每一个并且将所述芯片中的每一个布置在所述天线图案中的每一个上；
读取所述不同印刷区域中的每一个的所述机器和/或人可读的标记；
将所述不同印刷区域中的每一个的信息与所述芯片中的每一个编码的信息匹配；和
将所述不同印刷区域中的每一个与所述基底分开。
2.权利要求1所述的方法，包括在所述匹配步骤之后冲压不同印刷区域的进一步步骤，在所述不同印刷区域处所述印刷区域中的每一个的信息与所述编码信息不匹配。
3.权利要求1所述的方法，其中所述切割步骤通过激光切割或冷箔工艺中的一种进行。
4.权利要求1所述的方法，包括在所述切割导电箔的步骤之后形成多个第二天线图案的进一步步骤。
5.权利要求1所述的方法，其中所述印刷步骤通过喷墨印刷、激光、非击打式印刷或其组合中的一种完成。
6.权利要求1所述的方法，包括在所述切割步骤之后将导电图案印刷在所述基底上的进一步步骤。
7.权利要求1所述的方法，包括在所述分开步骤之后收集用于订单的所述不同印刷区域中的每一个的进一步步骤。
8.权利要求1所述的方法，其中所述不同印刷区域选自标记、标签、吊牌、证章、货架卡、传单、小册子、宣传资料；票据、卡和其组合。
9.生产用于消费品的随时可用的RFID器件的装置，所述装置包括；
材料供应；
导电材料供应；
将粘合剂图案施加至所述材料供应的粘合剂涂布台；
将所述导电材料供应层压至所述粘合剂图案的层压台；
在所述导电材料中切割天线图案的第一切割器件；
将人和/或机器可读的标记印刷在所述材料供应上的第一印刷器件；
将芯片放置在所述天线图案上以形成RFID器件的芯片放置器件；
将信息编码至所述芯片上的编码台；和
将所述编码信息与人和/或机器可读的标记进行比较的计算机。
10.权利要求9所述的装置，包括废弃不合格RFID器件的废弃台。
11.权利要求9所述的装置，包括形成改进的天线图案的第二切割台。
12.权利要求9所述的装置，其中所述芯片放置器件通过条带或直接芯片连接器件中的一种提供。
13.权利要求9所述的装置，其中所述第一切割器件是激光切割机或冷箔工艺中的一种。
14.权利要求9所述的装置，包括第二印刷台，其提供导电油墨至所述导电材料或其它人和/或机器可读的标记中的一种。
15.权利要求9所述的装置，其中所述芯片放置器件配备有在辐材上的条带或芯片供应。
16.权利要求9所述的装置，其中所述材料供应是多个片材或材料的连续供应中的一种。
17.权利要求9所述的装置，其中所述材料供应是纸张、织物、非织物或塑料中的一种。
18.用于消费品的多个随时可用的RFID器件的半成品组件，其包含；
基底，其具有多个不同天线图案，每个天线图案包括通过激光切割或冷箔工艺中的一种形成的导电箔；
粘合剂图案，其与所述天线图案和基底有同样范围，在所述基底上放置所述粘合剂图案和所述天线图案；
多个芯片，所述芯片中的每一个用信息编码并且所述芯片中的每一个被连接至所述多个天线图案中的一个；
提供在所述基底上的多个印刷区域，所述印刷区域中的每一个与所述多个天线图案中的一个关联形成RFID器件；所述印刷区域匹配所述多个芯片中的每一个上编码的信息；和
所述RFID器件中的每一个从所述基底上是可去除的，以形成多个随时可用的RFID器件。
19.如权利要求18所述的半成品组件，其中所述随时可用的RFID器件选自标记、标签、吊牌、证章、货架卡、传单、小册子、宣传资料；票据、卡和其组合。
20.生产随时可用的RFID器件的系统，所述系统包含；
生产消费品的制造地点；
计算机，其用于确定被生产的消费品的类型并且用于提供形成和编码与所述消费品关联使用的RFID器件的指令；
RFID生产单元，RFID生产单元包括；
材料供应和导电材料供应；
提供粘合剂图案的粘合剂涂布台；
将所述导电材料层压至所述粘合剂图案的层压台；
切割天线图案以基本上匹配所述粘合剂图案的切割台；
将芯片连接至所述天线图案的芯片连接台；
将人和/或机器可读的标记印刷在所述材料供应上的印刷台；
用于读取编码在所述芯片上的信息并且用于将信息与所述人和/或机器可读的标记匹配的阅读器；并且
其中所述RFID生产单元和制造地点彼此共置。
21.权利要求20所述的系统，其中所述编码的信息和所述人和/或机器可读的标记与所述消费品相关。
22.权利要求20所述的系统，其中所述计算机提供与待形成的天线图案相关的信息。
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US20130055555A1 (en) 2013-03-07
CN102947083A (zh) 2013-02-27
US20120064307A1 (en) 2012-03-15
CN102939610A (zh) 2013-02-20
EP2580052B1 (en) 2019-05-22
BR122020013168B8 (pt) 2023-01-24
US20120090877A1 (en) 2012-04-19
ES2735236T3 (es) 2019-12-17
US20140047703A1 (en) 2014-02-20
WO2011159716A1 (en) 2011-12-22
BR122020013168B1 (pt) 2021-11-03
CN102939802A (zh) 2013-02-20
BR122020013215B1 (pt) 2021-11-03
EP2711173A2 (en) 2014-03-26

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