CN102907183A - 用于led的镀层系统 - Google Patents
用于led的镀层系统 Download PDFInfo
- Publication number
- CN102907183A CN102907183A CN2011800238620A CN201180023862A CN102907183A CN 102907183 A CN102907183 A CN 102907183A CN 2011800238620 A CN2011800238620 A CN 2011800238620A CN 201180023862 A CN201180023862 A CN 201180023862A CN 102907183 A CN102907183 A CN 102907183A
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- Prior art keywords
- metal level
- heat abstractor
- light source
- led
- hot link
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
本发明涉及一塑料镀膜(1,3)以及金属镀膜(2.1,2.2)的组合,该组合可用于与发光二级管以及发光二级管(LEDs)(5)之间的相互连接。为此,本发明设计了一个由一个镀膜系统组成的具有至少一个光源的柔性电路板。所述柔性电路板具有一个与一散热装置(4)的热连接(6),所述镀膜系统至少由一绝缘携带层以及一金属层构成。所绝缘携带层带有开口,这些开口处建立有与散热装置的热连接。所述金属层被分成多个不同的部分。
Description
技术领域
本发明涉及一塑料镀膜以及金属镀膜的组合,该组合可用于与发光二级管以及发光二级管 (LEDs)之间的相互连接。
背景技术
为此,本发明设计了一个由一个镀膜系统组成的具有至少一个光源的柔性电路板。 所述柔性电路板具有一个与一散热装置的热连接,所述镀膜系统至少由一绝缘携带层以及一金属层构成。所绝缘携带层带有开口,这些开口处建立有与散热装置的热连接。所述金属层被分成多个不同的部分。
LEDs在光谱和光效率方面越来越多地能满足对高效照明元件的需求。相对于传统的照明元件,例如灯泡,卤素灯泡和镇流灯管,LEDs具有一系列的优势。相同光量下的能量消耗减少了,热量的产生也减少了。LEDs 对震动的敏感性相对较少,电流巡回时间明显减少,并且有较长的使用期限。
由于体积比较小,LED在照明模块的设计中上也有设计优势,不仅用于空间照明,也用于工业上,汽车技术,医药仪器技术以及其他方面。
为了能将这些优势发挥到所述的运用中,将单个的LED与较大的照明模块想连接需要特殊的元件,该元件在理想状态下符合如下需求:在电流为100mA到几A,电压在500V以内时候,具有较低的电阻。此外,照明元件被灵活安装在任意的三维结构上,从而能达到多种照明效果。
在LEDs只有几个平方毫米的表面积上的高性能决定了其热管理的重要性。结合点温度必须降低,因为升高了的结合点温度将导致LED使用寿命以及光能的降低。效率随着温度的升高而降低,从而导致光产量在根据冷却的方法在容量边缘降低。因此,与一散热装置产生尽可能好的热连接从而使在LED中产生的热量尽可能有效地被导出十分关键。因此LED通常具备一冷却接口,该冷却接口安装在半导体接口下,并用来产生光以及尽可能有效地与一散热装置相连,该连接可以通过例如一导热胶或一焊料。其中通常所需达到的热阻为0.5-2K/W。
目前对LED之间的连接使用所谓高效电路板,在这类高效电路板上一般采用各类不同的技术。金属核心电路板具有一由铜或铝制成的金属核心,用于导出热量。DE 10 2008 016 458 A1中公开了一种硬性电路板,该硬性电路板上具有至少一个穿通孔,该穿通孔内安装有一导热元件,在该导热元件上安装有至少一个光源。性能优良的导热元件由一金属块,优选为由铜块制成。这类电路板的劣势在于每个面积,大小以及体积内的高成本。相对而言,直接键合铜(DCB)基片由铜电路构成,并安装在陶瓷基片上。这些主要应用于机车的能量电子学,也一部分应用于与激光模块相连接的光电学。专利文献US 4,563,383中公开了一个三层的铜片,所述铜片嵌在两陶瓷层中,从而能生产薄型模块。所有硬性电路板的劣势在于其设计的自由度不高,因为在硬性电路板中不能包容不同的三维结构,并且不能超过一定的尺寸。
出于这些原因,主要由聚酰亚胺片,或PET(聚对苯二甲酸乙二酯)和PEN(聚萘二甲酸丁二(醇)酯)构成的的柔性电板得到发展,所述由聚酰亚胺片制成的柔性电板有很高的抗温性。现有技术中的柔性电板运用由聚酰亚胺片作为基础材料,并在其上覆有一薄铜层。丙稀酸胶可用来制造动力弹性连接。环氧化合物胶也同样能达到一定程度的灵活性。一柔性保护层可以通过使用一丙稀酸胶或环氧化合物胶压嵌其上。其中的灵活线路在需要节省空间的情况下可以在诸如照相设备和录像设备中折叠地被运用。柔性连接也能被运用于诸如打印机或手提电脑中的主机板和显示器等使用时间较长的器械。这种构建的柔性电板的劣势在于其不能有效导热。此外,此类柔性电板仍比较硬,不能完全无问题安装在自由形状的基片上。
各种不同的技术被发展用来克服上述的不足。在专利文献EP 1874101 A1中公布了一种由金属层和塑料层交替组成的柔性电路板,并在其上有一LED光源。这类柔性电路板通常用于液晶显示屏背景照明的LED光源。这类电路板具有复杂的多层结构,并由于每层的厚度比较低,其具有的导热性能也不高。此外,在没有其他安装条件下此类电路板不能与三维基片相连。
发明内容
本发明的任务在于,克服现有技术的不足,制造一种可用于与发光二级管以及发光二级管 (LEDs)之间的相互连接柔性电路板,该电路板具有有效的导热性,并不需要同时限制设计的自由度。此外,本发明的电路板容易制造并具有较低的生产成本。另外,本发明的电路板需要与一个三维基片有简单的连接。
上述的任务通过一塑料镀膜以及金属镀膜的组合解决,该组合可用于与发光二级管以及发光二级管 (LEDs)之间的相互连接。为此,本发明设计了一个由一个镀膜系统组成的具有至少一个光源的柔性电路板。所述柔性电路板具有一个与一散热装置的热连接,所述镀膜系统至少由一绝缘携带层以及一金属层构成。所绝缘携带层带有开口,这些开口处建立有与散热装置的热连接。所述金属层被分成多个不同的部分。
所述绝缘携带层能层压在任一三维结构上,并在压层以后与所述三维结构粘附相连。所述的三维结构同时被用作为散热装置。所述绝缘携带层必须具有开口,这些开口处建立有与散热装置的热连接。所述绝缘塑料层不能有余下的干扰部分停留在金属层上。所述携带层优选由聚酰亚胺、聚乙烯醇缩丁醛(PVB)、聚氟乙烯、乙烯-醋酸乙烯共聚物(EVA)或一类似的塑料材料。
所述金属层用来作为连接的导电物质。所述金属层根据连接结构被分成多个不同的部分,优选通过激光,从而构成所需的电路结构。在所述的金属层上安装有所述光源,优选为一个或多个LEDs,在必须的情况下周边还安装有电路,并与之相连。由于金属层被分成多个部分,其中的一个部分可以用作导电层,另一在空间上间隔的部分用来光源和散热装置间的导热。
本发明相对于现有技术有一明显的优势,因为具有镀膜系统的基片可以同时被用做于散热装置。所述散热装置优选由一具有较小电阻 (≤2 K/W)和较高热容(>350 J/(kg.K)))的材料制成,尤为优选为铝、铜、钢或黄铜。
本发明的柔性电路板与现有技术相比具有一系列的优势。由于使用了薄型镀层,材料成本费大大降低。此外,膜块安装所需的步骤较少,其中在层压时只需要一简单的安装步骤。 另一优势为,本发明可以达到不同三维结构,从而具有设计自由度。传统硬性电路板由于具有导热金属核不具有该优势。
附图说明
图1是实施例的用于LED的镀层系统的照明模块示意图;
图2是另一实施例的用于LED的镀层系统的照明模块示意图。
符号说明
1 绝缘层;2 金属层;2.1 金属层部分;2.2 另一金属层部分;3 绝缘携带层;4 散热装置;5 光源;6 导热胶或焊料;7 导电胶或焊料。
具体实施方式
在本发明的一优选实施范例中,本发明的柔性电板的热连接产生于金属层中空间上相隔离的部分与散热装置之间,以及金属层中空间上相隔离的部分与光源之间,并建立光源。或者,所述的热连接直接产生于光源和散热装置之间。该热连接优选通过一导热胶或焊料建立。当所述热连接需要电绝缘的时候,使用导热胶便具有了优势。所述的导热胶优选由含有氮化硼的环氧树脂胶制成。
在另一优选实施范例中,所述金属层被分成空间上相隔离的部分,其中,至少一个部分产生与光源的一电连接,该电连接优选通过一导电胶或焊料建立,以及其中,至少还有一个部分产生与光源和散热装置的一电绝缘以及/或者热连接,所述连接优选通过一导热胶或焊料建立。
在另一优选实施范例中,在所述金属层和散热装置之间建立有电连接,优选通过一导电胶或焊料建立。当对元件(光源和/或周边电路)的电流供应是通过基片进行的时候,该实施范例具有重要意义。所述的连接开口通常设置在元件外。
在另一优选实施范例中,本发明的镀膜系统的金属层具有另外一层作为绝缘保护层的镀层,以及所述绝缘保护层具有多个完全或部分的开口,这些开口处建立有光源和金属层之间的电和/或热连接。所述绝缘保护层的开口优选通过一激光过程完成。所述绝缘塑料层不能有余下的干扰部分停留在金属层上。另一种可能是,所述的光源,优选为LEDs和/或周边电路部分或完全嵌入所述绝缘保护层。从而能保护光源和/或周边电路更好的不受外界如撞击,潮湿或污染的影响。
在本发明的另一优选实施范例中,所述的粘附安装在金属层上的绝缘层由一电绝缘材料制成,其中所述电绝缘材料为一种塑料,优选为PVB或EVA,或者为一合成树脂。所述合成树脂优选为一环氧树脂。该层可以通过一隔气过程(PVD)完成或者一溶胶凝胶技术安装到金属层上。该绝缘层能使所述金属层与周围环境绝缘,并使其具有一定的绝缘强度。在其所处的运用中,当光需要往回反射时,所述绝缘层优选在400nm至1000nm之间为光学透明 (吸收系数α<3*10-3 /cm)。
在本发明的另一优选法实施范例中,所述绝缘携带层和/或绝缘保护层的开口通过激光生产。
在本发明的另一优选实施范例中,所述金属层由铜、铝或银,优选锡,一锡合金或一镀锡的铜片制成,和/或厚度大于5μm,优选为10μm至100μm,尤为优选为10μm至20 μm。
所述金属层优选覆盖有一反射层,该反射层优选由银、二氧化硅和/或二氧化钛制成。 该反射层保证了对由光源产生的光有效的反射。该反射层在波长范围300nm至1000nm内有大于80%的反射率。
在本发明的另一优选实施范例中,所述金属层有一表面层结构,用来保证光能漫射反回。该表面层结构优选由三维规则或不规则结构构成,尤其优选为锥形或半球形,其标准大小最大为1000nm。所述锥形或半球形的高度分布在10-1000nm之间,优选为100-1000nm。
所述光源具有至少一个发光二级管或具有至少一组发光二级管。所述光源可以用作比方LED模块与一个或多个发光二级管相连,或者用作LED芯片。每个LED可以为单色或多色,也可以使用发IR光的LED。
本发明的另一内容是一照明模块,该模块具有一柔性电路板,该柔性电路板被安装在一具有任意三维结构的电路基片上,该电路基片同时具有所述散热装置。
用于生产上述的照明模块的生产方法也属于本发明的内容之一,该生产方法包括以下的几个步骤:
将一金属层与一绝缘携带层通过粘合剂相互连接;
在携带层上开口,开口处建立有散热装置和所述金属层或者散热装置和LED之间的热连接;
在开口处涂抹导热胶或焊料,所述开口处建立有散热装置和所述金属层或者散热装置和LED之间的热连接;
在所述金属层上安装一个或多个LEDs,优选通过焊料;
将所述镀层系统安装在一电路基片上,所述电路基片同时具有散热装置。
尤为优选的是当一个或多个LED被安装在一个被结构化的,根据格式切割的镀膜系统上。LED优选通过一再流焊接技术与导体相连。这也适用于热连接的接口,其中热连接胶被运用。
本发明的另一生产方法的特征如下:
所述金属层被分成多个不同的部分,其中至少一个部分与LED具有电连接,至少还有一个部分产生与光源和散热装置的一电绝缘以及/或者热连接,以及/或者
所述携带层在与镀层结构复合后与一结构粘合相连,所述结构用作于散热装置,并具有一任意的三维结构,以及/或者,
在所述金属层上安装有一绝缘保护层,所述绝缘保护层具有多个完全或部分的开口, 这些开口处建立有光源和金属层之间的电和/或热连接,在这些开口处安装有LED;
所述金属层和/或塑料层通过激光消融的方法被结构化,以及/或者
所述金属层在与绝缘携带层连接之前与之后通过一粘合剂,优选通过激光消融的方法,被结构化。
本发明的生产方法具有如下优势,在迭层过程中,机械热与点连接在一个生产步骤中完成。本发明的镀膜系统可以根据需要随时用户化。由于其在机械方面十分灵活,可将其运用在多种LED运用中,并对三维结构没有限制。所述镀膜系统适合于长期使用的需求。
所述用于对金属层结构化和塑料镀膜的激光消融过程十分精确,从而能达到很高的简洁紧凑性。本发明的镀膜系统可以大量生产,例如通过卷对卷(R2R)干压技术。选择性激光消融过程容许在一定区域开口,这些开口用于建立热和/或电连接。通过冲压过程可以将镀膜系统制成任意一种形状,也可以使用R2R技术。所有的生产步骤可以在一个生产线上完成,从而在最短的时间内生产出大量的产品。
本发明的另一内容是使用一镀层系统,该系统由一绝缘携带层,一金属层,和/或一绝缘保护层,用于与LED相连接,以及疏导在照明模块中产生的热量。
以下的实例图进一步描述了本发明,但其所展示的实例并不限制本发明:
图1是具有一LED的照明模块示意图,其中金属层的一部分用于导热。其中图a)展示的是所述镀膜系统每一层的俯视图,图b)展示的是照明模块的剖视图。
图2是具有一LED的照明模块示意图,其中一导电胶被用来导热。其中图a) 展示的是所述镀膜系统每一层的附图,图b)展示的是照明模块的剖视图。
图1展示了:具有一LED的本发明的照明模块,其中金属层的一部分用于导热。其中图a)展示的是所述镀膜系统每一层的俯视图。绝缘携带层3将光源与金属层之间的热连接或金属层与散热装置的热连接之间断开。在这种情况下LED作为光源被安装。所述金属层2被分成空间上相隔离的部分,其中金属层部分2.2被用作光源至散热装置间的导热,另一金属层部分2.1用来建立与光源的电连接。该模块具有一绝缘保护层1覆盖在金属层上,该绝缘保护层同样将与金属层之间的热或电连接断开。图b)展示的是照明模块的横截面,其中金属层部分2.2通过一导热胶或焊料6建立起光源5和散热装置4之间的热连接,从而使在光源5产生的热量有效被导出。一导电胶或焊料7被用于电连接,所述导电胶或焊料建立起光源5和金属层另一部分2.1的连接。
图2展示了本发明的另一实施范例,即具有一LED的本发明的照明模块,其中一导电胶或焊料6被用来建立光源(LED)5和散热装置4之间的热连接,从而使在光源5中产生的热量直接通过所述导热胶或焊料输出。本实例中的照明模块中的镀膜系统同样由一携带层3,一金属层2和一绝缘保护层1构成。所述的金属层同样被绝缘,不需要在生产过程中建立热连接。相反,金属层2被用作金属导体2.1,并通过一导电胶或焊料7建立光源5和导体2.1之间的电连接。
Claims (11)
1.由一个镀膜系统组成的具有至少一个光源(5)的柔性电路板,其特征在于,所述柔性电路板具有一个与一散热装置的热连接,所述镀膜系统至少由以下镀层组成:
一带有开口的绝缘携带层(3),这些开口处建立有与散热装置的热连接,以及一金属层(2),该金属层被分成多个不同的部分(2.1,2.2)。
2.根据权利要求1所述的柔性电路板,其特征在于,所述的热连接产生于金属层中空间上相隔离的部分(2.2)与散热装置(4)之间,以及金属层中空间上相隔离的部分(2.2)与光源(5)之间,或者直接产生于光源(5)和散热装置(4)之间;
其中,该热连接(6)优选通过一导热胶或焊料建立。
3.根据权利要求2的柔性电路板,其特征在于,所述金属层(2)被分成空间上相隔离的部分(2.1,2.2),
其中,至少一个部分(2.1)产生与光源的一电连接(7),该电连接优选通过一导电胶或焊料建立,以及
其中,至少还有一个部分(2.2)产生与光源和散热装置的一电绝缘以及/或者热连接(6),所述连接优选通过一导热胶或焊料建立。
4.根据权利要求1-3任一所述的柔性电路板,其特征在于,所述镀膜系统的金属层具有另外一层作为绝缘保护层(1)的镀层,以及
所述绝缘保护层具有多个完全或部分的开口,这些开口处建立有光源和金属层之间的电和/或热连接,以及/或者
所述的光源(5)和/或周边电路部分或完全嵌入所述绝缘保护层(1)。
5.根据权利要求1-4任一所述的柔性电路板,其特征在于,所述绝缘携带层(3)和/或绝缘保护层(1)的开口通过激光生产。
6.根据权利要求1-5任一所述的柔性电路板,其特征在于,所述金属层(2)由铜、铝或银, 优选锡、锡合金或镀锡的铜片制成,和/或
厚度大于5 μm,优选为10 μm至100μm,尤为优选为10μm至20 μm,和/或
覆盖有一反射层,该反射层优选由银、二氧化硅和/或二氧化钛制成,和/或
有一表面层结构,该表面层结构优选由三维规则或不规则结构构成,尤其优选为锥形或半球形,以及/或者
建有一电路通道结构,该电路通道结构优选通过激光建成。
7.根据权利要求1-6任一所述的柔性电路板,其特征在于,所述光源(5)具有至少一个发光二级管或具有至少一组发光二级管(LEDs)。
8.照明模块,其特征在于,该模块具有一如权利要求7所述的柔性电路板,该柔性电路板被安装在一具有任意三维结构的电路基片上,该电路基片同时具有所述散热装置(4)。
9.用于生产如权利要求8所述的照明模块的生产方法,其特征在于,所述生产方法包括以下的几个步骤:
将一金属层(2)与一绝缘携带层(3)通过粘合剂相互连接;
在携带层(3)上开口,开口处建立有散热装置(4)和所述金属层(2)或者散热装置(4)和LED(5)之间的热连接;
在开口处涂抹导热胶或焊料,所述开口处建立有散热装置(4)和所述金属层(2)或者散热装置(4)和LED(5)之间的热连接;
在所述金属层(2)上安装一个或多个LEDs(5),优选通过焊料;
将所述镀层系统安装在一电路基片上,所述电路基片同时具有散热装置(4)。
10.根据权利要求9所述用于生产一LED模块的方法,其特征在于,所述金属层(2)被分成多个不同的部分(2.1, 2.2),其中至少一个部分(2.1)与LED具有电连接,至少还有一个部分(2.2) 产生与光源和散热装置的一电绝缘以及/或者热连接(6),以及/或者
所述携带层(3)在与镀层结构复合后与一结构粘合相连,所述结构用作于散热装置(4),并具有一任意的三维结构,以及/或者,
在所述金属层上安装有一绝缘保护层(1),所述绝缘保护层具有多个完全或部分的开口,这些开口处建立有光源和金属层之间的电和/或热连接,在这些开口处安装有LED;
所述金属层(2)和/或塑料层(1,3)通过激光消融的方法被结构化,以及/或者
所述金属层(2)在与绝缘携带层(3)连接之前与之后通过一粘合剂,优选通过激光消融的方法,被结构化。
11.使用一镀层系统,该系统由一绝缘携带层(3),一金属层(2),和/或一绝缘保护层(1),用于与LED相连接以及多个LED(5)之间的连接,以及疏导在照明模块中产生的热量。
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DE201010011604 DE102010011604A1 (de) | 2010-03-16 | 2010-03-16 | Foliensystem für LED-Anwendungen |
PCT/EP2011/053705 WO2011113762A1 (de) | 2010-03-16 | 2011-03-11 | Foliensystem für led-anwendungen |
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EP (1) | EP2548419B1 (zh) |
JP (1) | JP2013522893A (zh) |
KR (1) | KR101934075B1 (zh) |
CN (1) | CN102907183B (zh) |
DE (2) | DE202010017532U1 (zh) |
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WO2011113762A1 (de) | 2011-09-22 |
WO2011113762A4 (de) | 2011-11-24 |
DE102010011604A1 (de) | 2011-09-22 |
EP2548419B1 (de) | 2016-02-24 |
KR101934075B1 (ko) | 2019-01-02 |
CN102907183B (zh) | 2016-03-02 |
US9445490B2 (en) | 2016-09-13 |
KR20130053401A (ko) | 2013-05-23 |
JP2013522893A (ja) | 2013-06-13 |
US20130039013A1 (en) | 2013-02-14 |
DE102010011604A9 (de) | 2012-12-13 |
EP2548419A1 (de) | 2013-01-23 |
DE202010017532U1 (de) | 2012-01-19 |
TW201133963A (en) | 2011-10-01 |
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