CN1561155A - 软性电路板 - Google Patents
软性电路板 Download PDFInfo
- Publication number
- CN1561155A CN1561155A CNA2004100069111A CN200410006911A CN1561155A CN 1561155 A CN1561155 A CN 1561155A CN A2004100069111 A CNA2004100069111 A CN A2004100069111A CN 200410006911 A CN200410006911 A CN 200410006911A CN 1561155 A CN1561155 A CN 1561155A
- Authority
- CN
- China
- Prior art keywords
- insulating barrier
- circuit board
- flexible circuit
- metal layer
- patterned metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 113
- 239000002184 metal Substances 0.000 claims abstract description 113
- 230000004888 barrier function Effects 0.000 claims description 141
- 238000001816 cooling Methods 0.000 claims description 111
- 238000000059 patterning Methods 0.000 claims description 56
- 239000011469 building brick Substances 0.000 claims description 55
- 238000009413 insulation Methods 0.000 abstract 4
- 239000010410 layer Substances 0.000 description 60
- 239000000463 material Substances 0.000 description 11
- 238000013461 design Methods 0.000 description 10
- 230000008901 benefit Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 230000009183 running Effects 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (15)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100069111A CN1299543C (zh) | 2004-02-26 | 2004-02-26 | 软性电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100069111A CN1299543C (zh) | 2004-02-26 | 2004-02-26 | 软性电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1561155A true CN1561155A (zh) | 2005-01-05 |
CN1299543C CN1299543C (zh) | 2007-02-07 |
Family
ID=34439826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100069111A Expired - Lifetime CN1299543C (zh) | 2004-02-26 | 2004-02-26 | 软性电路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1299543C (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101841975A (zh) * | 2010-05-12 | 2010-09-22 | 珠海市荣盈电子科技有限公司 | 热压法制作高导热性电路板的方法及高导热性电路板 |
CN102907183A (zh) * | 2010-03-16 | 2013-01-30 | 爱普施泰因箔片股份有限公司 | 用于led的镀层系统 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2762639B2 (ja) * | 1989-12-15 | 1998-06-04 | 富士通株式会社 | ヘッド支持アーム |
FR2671260B1 (fr) * | 1990-12-27 | 1996-08-30 | Telecommunications Sa | Support de circuit imprime electrique a moyens de drainage thermique. |
JPH05343821A (ja) * | 1992-06-04 | 1993-12-24 | Ibiden Co Ltd | 放熱機能を備えたプリント配線基板 |
JP2002094196A (ja) * | 2000-09-14 | 2002-03-29 | Aiphone Co Ltd | プリント配線板の電子部品放熱構造 |
JP3653460B2 (ja) * | 2000-10-26 | 2005-05-25 | 三洋電機株式会社 | 半導体モジュールおよびその製造方法 |
JP2003078220A (ja) * | 2001-06-18 | 2003-03-14 | Canon Inc | 樹脂成形基板 |
JP2003152288A (ja) * | 2001-11-14 | 2003-05-23 | Nissan Motor Co Ltd | フレキシブル基板、回路基板および電子部品実装方法 |
JP2003264387A (ja) * | 2002-03-11 | 2003-09-19 | Nok Corp | 回路基板 |
-
2004
- 2004-02-26 CN CNB2004100069111A patent/CN1299543C/zh not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102907183A (zh) * | 2010-03-16 | 2013-01-30 | 爱普施泰因箔片股份有限公司 | 用于led的镀层系统 |
CN102907183B (zh) * | 2010-03-16 | 2016-03-02 | 爱普施泰因箔片股份有限公司 | 用于led的镀层系统 |
CN101841975A (zh) * | 2010-05-12 | 2010-09-22 | 珠海市荣盈电子科技有限公司 | 热压法制作高导热性电路板的方法及高导热性电路板 |
CN101841975B (zh) * | 2010-05-12 | 2012-07-04 | 珠海市荣盈电子科技有限公司 | 热压法制作高导热性电路板的方法及高导热性电路板 |
Also Published As
Publication number | Publication date |
---|---|
CN1299543C (zh) | 2007-02-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180427 Address after: Hongkong Chinese Tsuen Tai Chung Road No. 8 TCL industrial center 13 floor Patentee after: Huaxing Optoelectronic International (Hong Kong) Co.,Ltd. Address before: Taiwan, China Patentee before: AU OPTRONICS Corp. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20231228 Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee after: TCL China Star Optoelectronics Technology Co.,Ltd. Address before: Hongkong Chinese Tsuen Tai Chung Road No. 8 TCL industrial center 13 floor Patentee before: Huaxing Optoelectronic International (Hong Kong) Co.,Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20070207 |