CN102904542B - 压电振动片以及压电元件 - Google Patents

压电振动片以及压电元件 Download PDF

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Publication number
CN102904542B
CN102904542B CN201210228562.2A CN201210228562A CN102904542B CN 102904542 B CN102904542 B CN 102904542B CN 201210228562 A CN201210228562 A CN 201210228562A CN 102904542 B CN102904542 B CN 102904542B
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CN
China
Prior art keywords
thickness
piezoelectric vibrating
region
area
vibrating piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210228562.2A
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English (en)
Chinese (zh)
Other versions
CN102904542A (zh
Inventor
原田雅和
山田博章
有路巧
高桥岳宽
水泽周一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Publication of CN102904542A publication Critical patent/CN102904542A/zh
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Publication of CN102904542B publication Critical patent/CN102904542B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/131—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials consisting of a multilayered structure
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02133—Means for compensation or elimination of undesirable effects of stress
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02157—Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/177—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of the energy-trap type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H2003/021—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the air-gap type

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CN201210228562.2A 2011-07-21 2012-07-02 压电振动片以及压电元件 Expired - Fee Related CN102904542B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-159493 2011-07-21
JP2011159493A JP5797961B2 (ja) 2011-07-21 2011-07-21 圧電振動片及び圧電デバイス

Publications (2)

Publication Number Publication Date
CN102904542A CN102904542A (zh) 2013-01-30
CN102904542B true CN102904542B (zh) 2015-07-29

Family

ID=47555308

Family Applications (1)

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CN201210228562.2A Expired - Fee Related CN102904542B (zh) 2011-07-21 2012-07-02 压电振动片以及压电元件

Country Status (4)

Country Link
US (1) US9106200B2 (enExample)
JP (1) JP5797961B2 (enExample)
CN (1) CN102904542B (enExample)
TW (1) TWI506950B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014110369A (ja) * 2012-12-04 2014-06-12 Seiko Epson Corp ベース基板、振動子、発振器、センサー、電子デバイス、電子機器、および移動体
KR101499722B1 (ko) * 2013-05-21 2015-03-09 삼성전기주식회사 압전소자 및 이를 포함하는 전자부품
US9579691B2 (en) 2013-05-21 2017-02-28 Mplus Co., Ltd. Piezoelectric element and electronic component including the same
JP2015019240A (ja) * 2013-07-11 2015-01-29 日本電波工業株式会社 圧電振動片、圧電振動片の製造方法、圧電デバイス、及び圧電デバイスの製造方法
JP2015033035A (ja) * 2013-08-05 2015-02-16 日本電波工業株式会社 圧電振動片、圧電振動片の製造方法、圧電デバイス、及び圧電デバイスの製造方法
JP6338367B2 (ja) * 2013-12-24 2018-06-06 日本電波工業株式会社 水晶振動子
WO2016121182A1 (ja) * 2015-01-29 2016-08-04 株式会社大真空 水晶振動板、及び水晶振動デバイス
CN104993797A (zh) * 2015-07-22 2015-10-21 成都泰美克晶体技术有限公司 一种新型具有双凸结构的压电石英晶片及其加工工艺
CN105007056A (zh) * 2015-07-22 2015-10-28 成都泰美克晶体技术有限公司 一种具有单凸结构的压电石英晶片
JP6855227B2 (ja) * 2016-12-12 2021-04-07 日本電波工業株式会社 圧電振動片及び圧電デバイス
JP2020141358A (ja) * 2019-03-01 2020-09-03 株式会社大真空 圧電振動板及び圧電振動デバイス
JP7725962B2 (ja) * 2021-09-14 2025-08-20 株式会社大真空 水晶振動板および水晶振動デバイス

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100481548C (zh) * 2005-02-28 2009-04-22 精工爱普生株式会社 压电振动片和压电振动器
CN101807895A (zh) * 2009-02-13 2010-08-18 精工电子有限公司 压电振子、压电振子的制造方法以及振荡器

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US4267479A (en) * 1977-09-16 1981-05-12 Citizen Watch Co., Ltd. Mounting clips for thickness shear piezoelectric oscillator
JPH05226963A (ja) * 1992-02-14 1993-09-03 Meidensha Corp 圧電振動子片，圧電振動子，圧電発振器
JPH0878997A (ja) * 1994-09-02 1996-03-22 Murata Mfg Co Ltd 圧電共振子及びその製造方法
JP3475680B2 (ja) * 1996-11-13 2003-12-08 株式会社明電舎 枠型水晶振動子及びそれを用いたデバイス素子
JP3589211B2 (ja) * 2001-09-19 2004-11-17 株式会社大真空 圧電振動デバイス
JP2004286585A (ja) * 2003-03-20 2004-10-14 Seiko Epson Corp 質量測定チップおよびその製造方法ならびに質量測定装置
JP2006238266A (ja) 2005-02-28 2006-09-07 Seiko Epson Corp 圧電振動片、及び圧電振動子
JP2006254210A (ja) * 2005-03-11 2006-09-21 Seiko Epson Corp 圧電デバイス
JP2008022378A (ja) * 2006-07-13 2008-01-31 Epson Toyocom Corp 水晶振動片及びその製造方法
US7608986B2 (en) * 2006-10-02 2009-10-27 Seiko Epson Corporation Quartz crystal resonator
JP5447379B2 (ja) * 2008-08-05 2014-03-19 株式会社大真空 圧電振動デバイスの封止部材、及びその製造方法
JP2011142374A (ja) * 2010-01-05 2011-07-21 Seiko Epson Corp 圧電デバイス、圧電デバイスの製造方法
JP5492697B2 (ja) * 2010-08-04 2014-05-14 日本電波工業株式会社 Ａｔカット水晶デバイス及びａｔカット水晶デバイスの製造方法
JP5731880B2 (ja) * 2010-10-15 2015-06-10 日本電波工業株式会社 圧電デバイス及び圧電デバイスの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100481548C (zh) * 2005-02-28 2009-04-22 精工爱普生株式会社 压电振动片和压电振动器
CN101807895A (zh) * 2009-02-13 2010-08-18 精工电子有限公司 压电振子、压电振子的制造方法以及振荡器

Also Published As

Publication number Publication date
US9106200B2 (en) 2015-08-11
TW201306477A (zh) 2013-02-01
CN102904542A (zh) 2013-01-30
TWI506950B (zh) 2015-11-01
JP5797961B2 (ja) 2015-10-21
JP2013026809A (ja) 2013-02-04
US20130020911A1 (en) 2013-01-24

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