CN1028937C - 一种在电路化表面覆盖着护涂层的芯片底座 - Google Patents

一种在电路化表面覆盖着护涂层的芯片底座 Download PDF

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Publication number
CN1028937C
CN1028937C CN93108062A CN93108062A CN1028937C CN 1028937 C CN1028937 C CN 1028937C CN 93108062 A CN93108062 A CN 93108062A CN 93108062 A CN93108062 A CN 93108062A CN 1028937 C CN1028937 C CN 1028937C
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CN
China
Prior art keywords
sealant
chip
coating
circuit
chip pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN93108062A
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English (en)
Chinese (zh)
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CN1081787A (zh
Inventor
布兰达·迪亚尼·弗雷
查尔斯·阿诺德·约瑟夫
弗兰西斯·约汉·奥尔谢夫斯基
詹姆斯·沃伦·威尔森
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International Business Machines Corp
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International Business Machines Corp
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Publication date
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Publication of CN1081787A publication Critical patent/CN1081787A/zh
Application granted granted Critical
Publication of CN1028937C publication Critical patent/CN1028937C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H10W74/121—
    • H10W72/071—
    • H10W74/012—
    • H10W74/15—
    • H10W74/47—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/856—
    • H10W72/877—
    • H10W90/724—
    • H10W90/734—
    • H10W90/736—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Dicing (AREA)
CN93108062A 1992-07-06 1993-06-28 一种在电路化表面覆盖着护涂层的芯片底座 Expired - Fee Related CN1028937C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/909,368 US5249101A (en) 1992-07-06 1992-07-06 Chip carrier with protective coating for circuitized surface
US07/909,368 1992-07-06

Publications (2)

Publication Number Publication Date
CN1081787A CN1081787A (zh) 1994-02-09
CN1028937C true CN1028937C (zh) 1995-06-14

Family

ID=25427125

Family Applications (1)

Application Number Title Priority Date Filing Date
CN93108062A Expired - Fee Related CN1028937C (zh) 1992-07-06 1993-06-28 一种在电路化表面覆盖着护涂层的芯片底座

Country Status (12)

Country Link
US (1) US5249101A (enExample)
EP (1) EP0578307B1 (enExample)
JP (1) JP2501287B2 (enExample)
KR (1) KR960015924B1 (enExample)
CN (1) CN1028937C (enExample)
AT (1) ATE143529T1 (enExample)
CA (1) CA2091910C (enExample)
DE (1) DE69305012T2 (enExample)
ES (1) ES2092216T3 (enExample)
MY (1) MY108750A (enExample)
SG (1) SG44362A1 (enExample)
TW (1) TW230272B (enExample)

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Also Published As

Publication number Publication date
ATE143529T1 (de) 1996-10-15
EP0578307A2 (en) 1994-01-12
KR940002031A (ko) 1994-02-16
DE69305012T2 (de) 1997-04-03
ES2092216T3 (es) 1996-11-16
EP0578307B1 (en) 1996-09-25
JPH0697309A (ja) 1994-04-08
CA2091910C (en) 1996-07-30
DE69305012D1 (de) 1996-10-31
US5249101A (en) 1993-09-28
KR960015924B1 (ko) 1996-11-23
CN1081787A (zh) 1994-02-09
JP2501287B2 (ja) 1996-05-29
MY108750A (en) 1996-11-30
TW230272B (enExample) 1994-09-11
SG44362A1 (en) 1997-12-19
EP0578307A3 (en) 1994-08-24
CA2091910A1 (en) 1994-01-07

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C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 19950614