JP4602736B2 - 半導体発光装置 - Google Patents
半導体発光装置 Download PDFInfo
- Publication number
- JP4602736B2 JP4602736B2 JP2004306988A JP2004306988A JP4602736B2 JP 4602736 B2 JP4602736 B2 JP 4602736B2 JP 2004306988 A JP2004306988 A JP 2004306988A JP 2004306988 A JP2004306988 A JP 2004306988A JP 4602736 B2 JP4602736 B2 JP 4602736B2
- Authority
- JP
- Japan
- Prior art keywords
- emitting device
- light
- light emitting
- semiconductor light
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Description
2…保護層
3…保護膜
10…発光装置
11…封止樹脂
12…基材
13a…第1の電極
13b…第2の電極
14…発光素子
15…ワイヤー
16…基板
Claims (3)
- プリント配線板上にリフロー半田付けされて実装される半導体発光装置であって、
基板と、
前記基板に設けられる一対の電極と、
前記基板に設けられ、前記一対の電極とワイヤーで電気的に接続され、紫外光を発光する半導体発光素子と、
前記半導体発光素子と前記ワイヤーとの周囲に設けられ、矩形状に形成された基材と、
前記基材で形成される凹部に充填され、日本工業規格で規定されるJIS A 60以下の硬度を有する第1のシリコン樹脂で形成される封止樹脂と、
を備え、
前記封止樹脂の表面に設けられ、光の出射領域内に静電気防止処理が施された高光透過性を有する保護層を有し、
前記保護層は、日本工業規格で規定されるJIS A 70以上の硬度を有する第2のシリコン樹脂で形成されることを特徴とする半導体発光装置。 - 請求項1に記載の半導体発光装置であって、
前記保護層は、50μm以上300μm以下の厚みで形成されることを特徴とする半導体発光装置。 - 請求項1または2に記載の半導体発光装置であって、
前記静電気防止処理は、リン酸エステルまたは4級アンモニウム塩素で処理することを特徴とする半導体発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004306988A JP4602736B2 (ja) | 2004-10-21 | 2004-10-21 | 半導体発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004306988A JP4602736B2 (ja) | 2004-10-21 | 2004-10-21 | 半導体発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006120844A JP2006120844A (ja) | 2006-05-11 |
JP4602736B2 true JP4602736B2 (ja) | 2010-12-22 |
Family
ID=36538445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004306988A Expired - Fee Related JP4602736B2 (ja) | 2004-10-21 | 2004-10-21 | 半導体発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4602736B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008085172A (ja) * | 2006-09-28 | 2008-04-10 | Shinetsu Astec Kk | 発光装置 |
JP2010245477A (ja) * | 2009-04-10 | 2010-10-28 | Dow Corning Toray Co Ltd | 光デバイス及びその製造方法 |
JP6366467B2 (ja) * | 2014-10-31 | 2018-08-01 | シチズン時計株式会社 | 発光装置の製造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06151977A (ja) * | 1992-11-11 | 1994-05-31 | Sharp Corp | 光半導体装置 |
JPH0883869A (ja) * | 1994-09-09 | 1996-03-26 | Sony Corp | 半導体装置およびその製造方法 |
JPH08186189A (ja) * | 1994-12-29 | 1996-07-16 | Toray Dow Corning Silicone Co Ltd | 半導体装置およびその製造方法 |
JP2000174350A (ja) * | 1998-12-10 | 2000-06-23 | Toshiba Corp | 光半導体モジュール |
JP2000174347A (ja) * | 1998-12-07 | 2000-06-23 | Nichia Chem Ind Ltd | 光半導体装置 |
JP2001267637A (ja) * | 2000-03-15 | 2001-09-28 | Nippon Aleph Corp | 発光装置 |
JP2002033520A (ja) * | 2000-07-14 | 2002-01-31 | Toshiba Electronic Engineering Corp | 半導体発光装置 |
JP2003031848A (ja) * | 2001-07-13 | 2003-01-31 | Seiwa Electric Mfg Co Ltd | 固体発光ランプ及び固体発光ランプの製造方法 |
-
2004
- 2004-10-21 JP JP2004306988A patent/JP4602736B2/ja not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06151977A (ja) * | 1992-11-11 | 1994-05-31 | Sharp Corp | 光半導体装置 |
JPH0883869A (ja) * | 1994-09-09 | 1996-03-26 | Sony Corp | 半導体装置およびその製造方法 |
JPH08186189A (ja) * | 1994-12-29 | 1996-07-16 | Toray Dow Corning Silicone Co Ltd | 半導体装置およびその製造方法 |
JP2000174347A (ja) * | 1998-12-07 | 2000-06-23 | Nichia Chem Ind Ltd | 光半導体装置 |
JP2000174350A (ja) * | 1998-12-10 | 2000-06-23 | Toshiba Corp | 光半導体モジュール |
JP2001267637A (ja) * | 2000-03-15 | 2001-09-28 | Nippon Aleph Corp | 発光装置 |
JP2002033520A (ja) * | 2000-07-14 | 2002-01-31 | Toshiba Electronic Engineering Corp | 半導体発光装置 |
JP2003031848A (ja) * | 2001-07-13 | 2003-01-31 | Seiwa Electric Mfg Co Ltd | 固体発光ランプ及び固体発光ランプの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2006120844A (ja) | 2006-05-11 |
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