CN102890168B - 高频讯号路径调整方式及其测试装置 - Google Patents
高频讯号路径调整方式及其测试装置 Download PDFInfo
- Publication number
- CN102890168B CN102890168B CN201210247223.9A CN201210247223A CN102890168B CN 102890168 B CN102890168 B CN 102890168B CN 201210247223 A CN201210247223 A CN 201210247223A CN 102890168 B CN102890168 B CN 102890168B
- Authority
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- China
- Prior art keywords
- wire
- probe
- frequency signals
- transmission line
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000012360 testing method Methods 0.000 title abstract description 23
- 239000000523 sample Substances 0.000 claims abstract description 175
- 230000005540 biological transmission Effects 0.000 claims abstract description 173
- 238000009434 installation Methods 0.000 claims description 64
- 239000004606 Fillers/Extenders Substances 0.000 claims description 51
- 238000012546 transfer Methods 0.000 claims description 17
- 238000004891 communication Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 230000009977 dual effect Effects 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 7
- 230000001360 synchronised effect Effects 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
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- 230000008054 signal transmission Effects 0.000 description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
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- 238000012544 monitoring process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100125996 | 2011-07-22 | ||
| TW100125996A TW201305574A (zh) | 2011-07-22 | 2011-07-22 | 高頻訊號路徑調整方式及其測試裝置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102890168A CN102890168A (zh) | 2013-01-23 |
| CN102890168B true CN102890168B (zh) | 2015-02-11 |
Family
ID=47533733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210247223.9A Expired - Fee Related CN102890168B (zh) | 2011-07-22 | 2012-07-17 | 高频讯号路径调整方式及其测试装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8816713B2 (enExample) |
| CN (1) | CN102890168B (enExample) |
| TW (1) | TW201305574A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI647457B (zh) | 2017-10-23 | 2019-01-11 | 旺矽科技股份有限公司 | 探針卡及訊號路徑切換模組總成 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108362995A (zh) * | 2013-10-12 | 2018-08-03 | 深圳市爱德特科技有限公司 | 一种创新的fpga的使用方法 |
| US10406420B2 (en) * | 2015-04-29 | 2019-09-10 | More Useless Tools, Inc. | Portable lighting apparatus and carrying rack |
| CN106935524B (zh) | 2015-12-24 | 2020-04-21 | 台湾积体电路制造股份有限公司 | 探针卡和晶圆测试系统及晶圆测试方法 |
| CN106053895A (zh) * | 2016-07-22 | 2016-10-26 | 苏州韬盛电子科技有限公司 | 一种用于50GHz高频的检测装置及其检测方法 |
| TWI620940B (zh) * | 2016-11-14 | 2018-04-11 | 旺矽科技股份有限公司 | 探針卡及其多重訊號傳輸板 |
| TWI612312B (zh) * | 2017-05-03 | 2018-01-21 | 創意電子股份有限公司 | 探針卡系統、探針載體裝置及探針載體裝置之製法 |
| CN108802443B (zh) * | 2017-05-03 | 2021-03-12 | 创意电子股份有限公司 | 探针卡系统、探针载体装置及探针载体装置的制法 |
| CN107765164A (zh) * | 2017-09-28 | 2018-03-06 | 国营芜湖机械厂 | 一种电路板高频信号调整方法 |
| US10914756B2 (en) * | 2018-08-14 | 2021-02-09 | Keysight Technologies, Inc. | Miniature test probe |
| TWI705255B (zh) * | 2019-09-20 | 2020-09-21 | 中華精測科技股份有限公司 | 用於檢測晶片的測試裝置 |
| CN112788865A (zh) * | 2019-11-08 | 2021-05-11 | 相互股份有限公司 | 用于组装测试复合基板的装置及方法 |
| TWI750683B (zh) * | 2020-06-02 | 2021-12-21 | 緯穎科技服務股份有限公司 | 訊號測試裝置以及訊號測試方法 |
| TWI788970B (zh) * | 2020-10-14 | 2023-01-01 | 旺矽科技股份有限公司 | 整合不同電性測試之探針卡 |
| CN114295931B (zh) * | 2021-11-19 | 2023-07-14 | 广东电力通信科技有限公司 | 一种新型电力物联网配电网数据实时测量装置 |
| US12467951B2 (en) * | 2022-04-22 | 2025-11-11 | Tecat Technologies (Suzhou) Limited | Probe device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050005220A1 (en) * | 2003-06-30 | 2005-01-06 | Lg.Philips Lcd Co., Ltd. | Apparatus for testing display device and method for testing the same |
| CN1784839A (zh) * | 2003-05-07 | 2006-06-07 | 皇家飞利浦电子股份有限公司 | 数据通信系统 |
| CN101266262A (zh) * | 2007-03-13 | 2008-09-17 | 旺矽科技股份有限公司 | 高速测试卡 |
| CN101526553A (zh) * | 2008-03-07 | 2009-09-09 | 旺矽科技股份有限公司 | 探针卡 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI244169B (en) | 2004-05-12 | 2005-11-21 | Siliconware Precision Industries Co Ltd | High electric performance semiconductor package |
| TW200804822A (en) | 2006-07-06 | 2008-01-16 | Microelectonics Technology Inc | High-frequency probe card and transmission line for high-frequency probe card |
| TW200829923A (en) * | 2007-01-15 | 2008-07-16 | Microelectonics Technology Inc | High frequency suspension arm probe |
| KR100965923B1 (ko) * | 2007-06-05 | 2010-06-25 | 엠피아이 코포레이션 | 프로브 테스트 장치 |
| TWM361631U (en) | 2009-03-26 | 2009-07-21 | Mpi Corp | Cantilever probe card |
-
2011
- 2011-07-22 TW TW100125996A patent/TW201305574A/zh not_active IP Right Cessation
-
2012
- 2012-07-17 CN CN201210247223.9A patent/CN102890168B/zh not_active Expired - Fee Related
- 2012-07-20 US US13/554,528 patent/US8816713B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1784839A (zh) * | 2003-05-07 | 2006-06-07 | 皇家飞利浦电子股份有限公司 | 数据通信系统 |
| US20050005220A1 (en) * | 2003-06-30 | 2005-01-06 | Lg.Philips Lcd Co., Ltd. | Apparatus for testing display device and method for testing the same |
| CN101266262A (zh) * | 2007-03-13 | 2008-09-17 | 旺矽科技股份有限公司 | 高速测试卡 |
| CN101526553A (zh) * | 2008-03-07 | 2009-09-09 | 旺矽科技股份有限公司 | 探针卡 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI647457B (zh) | 2017-10-23 | 2019-01-11 | 旺矽科技股份有限公司 | 探針卡及訊號路徑切換模組總成 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201305574A (zh) | 2013-02-01 |
| US8816713B2 (en) | 2014-08-26 |
| TWI467190B (enExample) | 2015-01-01 |
| US20130021053A1 (en) | 2013-01-24 |
| CN102890168A (zh) | 2013-01-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150211 Termination date: 20190717 |