CN102844976B - 电力转换装置 - Google Patents
电力转换装置 Download PDFInfo
- Publication number
- CN102844976B CN102844976B CN201180016865.1A CN201180016865A CN102844976B CN 102844976 B CN102844976 B CN 102844976B CN 201180016865 A CN201180016865 A CN 201180016865A CN 102844976 B CN102844976 B CN 102844976B
- Authority
- CN
- China
- Prior art keywords
- module
- terminal
- capacitor
- flow path
- power semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L50/00—Electric propulsion with power supplied within the vehicle
- B60L50/10—Electric propulsion with power supplied within the vehicle using propulsion power supplied by engine-driven generators, e.g. generators driven by combustion engines
- B60L50/16—Electric propulsion with power supplied within the vehicle using propulsion power supplied by engine-driven generators, e.g. generators driven by combustion engines with provision for separate direct mechanical propulsion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L50/00—Electric propulsion with power supplied within the vehicle
- B60L50/50—Electric propulsion with power supplied within the vehicle using propulsion power supplied by batteries or fuel cells
- B60L50/60—Electric propulsion with power supplied within the vehicle using propulsion power supplied by batteries or fuel cells using power supplied by batteries
- B60L50/61—Electric propulsion with power supplied within the vehicle using propulsion power supplied by batteries or fuel cells using power supplied by batteries by batteries charged by engine-driven generators, e.g. series hybrid electric vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L2210/00—Converter types
- B60L2210/40—DC to AC converters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73221—Strap and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8384—Sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/848—Bonding techniques
- H01L2224/84801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/848—Bonding techniques
- H01L2224/8484—Sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
- H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/62—Hybrid vehicles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/7072—Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/72—Electric energy management in electromobility
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Inverter Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010084785A JP5422468B2 (ja) | 2010-04-01 | 2010-04-01 | 電力変換装置 |
| JP2010-084785 | 2010-04-01 | ||
| PCT/JP2011/058097 WO2011125781A1 (ja) | 2010-04-01 | 2011-03-30 | 電力変換装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102844976A CN102844976A (zh) | 2012-12-26 |
| CN102844976B true CN102844976B (zh) | 2015-03-18 |
Family
ID=44762721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180016865.1A Active CN102844976B (zh) | 2010-04-01 | 2011-03-30 | 电力转换装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20130094269A1 (enExample) |
| EP (1) | EP2555408A4 (enExample) |
| JP (1) | JP5422468B2 (enExample) |
| CN (1) | CN102844976B (enExample) |
| WO (1) | WO2011125781A1 (enExample) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4580997B2 (ja) | 2008-03-11 | 2010-11-17 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP5273488B2 (ja) * | 2010-11-05 | 2013-08-28 | 本田技研工業株式会社 | 電力変換装置 |
| JP5417314B2 (ja) * | 2010-12-27 | 2014-02-12 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP5506740B2 (ja) * | 2011-05-31 | 2014-05-28 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP5508357B2 (ja) * | 2011-07-29 | 2014-05-28 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP5855899B2 (ja) | 2011-10-27 | 2016-02-09 | 日立オートモティブシステムズ株式会社 | Dc−dcコンバータ及び電力変換装置 |
| JP5846854B2 (ja) * | 2011-10-31 | 2016-01-20 | 日立オートモティブシステムズ株式会社 | 一体型電力変換装置及びそれに用いられるdcdcコンバータ装置 |
| JP2013099213A (ja) * | 2011-11-04 | 2013-05-20 | Aisin Aw Co Ltd | インバータ装置 |
| JP5738794B2 (ja) * | 2012-03-30 | 2015-06-24 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP5634429B2 (ja) * | 2012-03-30 | 2014-12-03 | 日立オートモティブシステムズ株式会社 | パワー半導体モジュール |
| JP6012330B2 (ja) | 2012-08-03 | 2016-10-25 | 日立オートモティブシステムズ株式会社 | Dcdcコンバータ |
| JP5941787B2 (ja) * | 2012-08-09 | 2016-06-29 | 日立オートモティブシステムズ株式会社 | パワーモジュールおよびパワーモジュールの製造方法 |
| CN104582986B (zh) * | 2012-08-24 | 2016-02-03 | 日产自动车株式会社 | 搭载于电动车辆上的一体型强电单元 |
| JP5753829B2 (ja) * | 2012-09-28 | 2015-07-22 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP5914290B2 (ja) | 2012-10-15 | 2016-05-11 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP6097557B2 (ja) * | 2012-12-26 | 2017-03-15 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP6098402B2 (ja) * | 2013-07-03 | 2017-03-22 | 株式会社デンソー | 電力変換装置 |
| JP6117361B2 (ja) * | 2013-08-23 | 2017-04-19 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| US9814154B2 (en) * | 2013-10-07 | 2017-11-07 | Hitachi Automotive Systems, Ltd. | Power converter |
| US20150138734A1 (en) * | 2013-11-18 | 2015-05-21 | Magna Electronics Inc. | 360 degree direct cooled power module |
| JP5858058B2 (ja) * | 2014-01-10 | 2016-02-10 | ダイキン工業株式会社 | モータ制御装置 |
| KR102220897B1 (ko) * | 2014-09-03 | 2021-02-26 | 삼성에스디아이 주식회사 | 전기 이동수단 |
| US10461656B2 (en) | 2014-11-18 | 2019-10-29 | Hitachi Automotive Systems, Ltd. | Power conversion device having a cover that covers DC positive and negative terminals |
| JP6168082B2 (ja) * | 2015-02-27 | 2017-07-26 | トヨタ自動車株式会社 | 電力変換装置 |
| JP6399602B2 (ja) * | 2015-03-23 | 2018-10-03 | 三菱重工サーマルシステムズ株式会社 | 電力変換用回路基板及び電動圧縮機 |
| JP6571358B2 (ja) * | 2015-03-24 | 2019-09-04 | 三菱重工サーマルシステムズ株式会社 | 電力変換用回路基板及び電動圧縮機 |
| WO2016204257A1 (ja) * | 2015-06-17 | 2016-12-22 | 富士電機株式会社 | パワー半導体モジュール、流路部材及びパワー半導体モジュール構造体 |
| FR3049120B1 (fr) * | 2016-03-15 | 2023-12-08 | Inst Vedecom | Barre omnibus comportant une pluralite de manchons coaxiaux pourvus de bras dotes de pistes electriques |
| JP6631463B2 (ja) * | 2016-10-17 | 2020-01-15 | 株式会社デンソー | 電力変換装置 |
| JP6723142B2 (ja) * | 2016-11-11 | 2020-07-15 | 三菱重工サーマルシステムズ株式会社 | コンデンサユニット、電動圧縮機 |
| EP3609066B1 (en) * | 2018-08-07 | 2021-02-24 | Mahle International GmbH | Electric power inverter |
| JP6642753B1 (ja) * | 2018-09-28 | 2020-02-12 | 株式会社明電舎 | コンデンサ |
| CN111415909B (zh) | 2019-01-07 | 2022-08-05 | 台达电子企业管理(上海)有限公司 | 多芯片封装功率模块 |
| US11901113B2 (en) | 2019-01-07 | 2024-02-13 | Delta Electronics (Shanghai) Co., Ltd. | Inversely coupled inductor and power supply module |
| CN111415813B (zh) | 2019-01-07 | 2022-06-17 | 台达电子企业管理(上海)有限公司 | 具有竖直绕组的电感的制备方法及其压注模具 |
| CN111415908B (zh) | 2019-01-07 | 2022-02-22 | 台达电子企业管理(上海)有限公司 | 电源模块、芯片嵌入式封装模块及制备方法 |
| US11063525B2 (en) | 2019-01-07 | 2021-07-13 | Delta Electronics (Shanghai) Co., Ltd. | Power supply module and manufacture method for same |
| JP7135930B2 (ja) | 2019-02-20 | 2022-09-13 | 株式会社デンソー | 半導体モジュールとそれを用いた電力変換装置 |
| JP7003964B2 (ja) * | 2019-04-05 | 2022-01-21 | 株式会社デンソー | 電力変換装置 |
| JP7306279B2 (ja) * | 2020-01-24 | 2023-07-11 | 株式会社デンソー | コンデンサモジュールおよび電力変換装置 |
| US12003187B2 (en) * | 2020-04-23 | 2024-06-04 | Tmeic Corporation | Power conversion apparatus |
| JP7611794B2 (ja) * | 2021-09-29 | 2025-01-10 | 本田技研工業株式会社 | 電力変換装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308266A (ja) * | 2000-04-21 | 2001-11-02 | Denso Corp | 半導体モジュール装置 |
| CN101110555A (zh) * | 2006-07-21 | 2008-01-23 | 株式会社日立制作所 | 电力变换装置 |
| US20080251909A1 (en) * | 2007-04-02 | 2008-10-16 | Hitachi, Ltd. | Power Semiconductor Module for Inverter Circuit System |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6414867B2 (en) * | 2000-02-16 | 2002-07-02 | Hitachi, Ltd. | Power inverter |
| JP3642012B2 (ja) * | 2000-07-21 | 2005-04-27 | 株式会社日立製作所 | 半導体装置,電力変換装置及び自動車 |
| JP4859443B2 (ja) * | 2005-11-17 | 2012-01-25 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP4895968B2 (ja) * | 2007-10-05 | 2012-03-14 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP4580997B2 (ja) | 2008-03-11 | 2010-11-17 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP4708459B2 (ja) * | 2008-07-29 | 2011-06-22 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP4657329B2 (ja) * | 2008-07-29 | 2011-03-23 | 日立オートモティブシステムズ株式会社 | 電力変換装置および電動車両 |
-
2010
- 2010-04-01 JP JP2010084785A patent/JP5422468B2/ja active Active
-
2011
- 2011-03-30 EP EP11765681.9A patent/EP2555408A4/en not_active Withdrawn
- 2011-03-30 WO PCT/JP2011/058097 patent/WO2011125781A1/ja not_active Ceased
- 2011-03-30 CN CN201180016865.1A patent/CN102844976B/zh active Active
- 2011-03-30 US US13/638,497 patent/US20130094269A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308266A (ja) * | 2000-04-21 | 2001-11-02 | Denso Corp | 半導体モジュール装置 |
| CN101110555A (zh) * | 2006-07-21 | 2008-01-23 | 株式会社日立制作所 | 电力变换装置 |
| US20080251909A1 (en) * | 2007-04-02 | 2008-10-16 | Hitachi, Ltd. | Power Semiconductor Module for Inverter Circuit System |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011125781A1 (ja) | 2011-10-13 |
| CN102844976A (zh) | 2012-12-26 |
| EP2555408A1 (en) | 2013-02-06 |
| EP2555408A4 (en) | 2018-01-24 |
| JP2011217550A (ja) | 2011-10-27 |
| US20130094269A1 (en) | 2013-04-18 |
| JP5422468B2 (ja) | 2014-02-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102844976B (zh) | 电力转换装置 | |
| CN102835013B (zh) | 电力转换装置 | |
| JP5557585B2 (ja) | パワーモジュール | |
| JP5624875B2 (ja) | 電力変換装置 | |
| JP5455888B2 (ja) | 車両用電力変換装置 | |
| JP5417314B2 (ja) | 電力変換装置 | |
| JP5973026B2 (ja) | パワー半導体装置 | |
| JP5506749B2 (ja) | 電力変換装置 | |
| WO2012120594A1 (ja) | 半導体モジュール、および半導体モジュールの製造方法 | |
| WO2012090666A1 (ja) | 電力変換装置 | |
| WO2011162241A1 (ja) | 電力変換装置 | |
| JP2012015224A (ja) | パワーモジュール及びそれを用いた電力変換装置 | |
| JP5378293B2 (ja) | パワーモジュール及びそれを用いた電力変換装置 | |
| JP5978324B2 (ja) | 電力変換装置 | |
| JP5568511B2 (ja) | 電力用変換装置 | |
| JP5687786B2 (ja) | 電力変換装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Ibaraki Patentee after: Hitachi astemo Co.,Ltd. Address before: Ibaraki Patentee before: HITACHI AUTOMOTIVE SYSTEMS, Ltd. |
|
| CP01 | Change in the name or title of a patent holder |