CN102800601A - 用于涂敷模塑料的层叠封装工艺 - Google Patents

用于涂敷模塑料的层叠封装工艺 Download PDF

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Publication number
CN102800601A
CN102800601A CN2012100108182A CN201210010818A CN102800601A CN 102800601 A CN102800601 A CN 102800601A CN 2012100108182 A CN2012100108182 A CN 2012100108182A CN 201210010818 A CN201210010818 A CN 201210010818A CN 102800601 A CN102800601 A CN 102800601A
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Prior art keywords
package parts
soldered ball
release membrance
mould release
pipe core
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CN102800601B (zh
Inventor
陈孟泽
林威宏
吴胜郁
林俊成
黄贵伟
蔡钰芃
林志伟
吕文雄
林修任
张博平
郑明达
刘重希
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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  • Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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Abstract

一种封装方法包括在离型膜上方布置封装部件，其中，该封装部件的表面上的焊球与该离型膜物理接触。然后，对填充在离型膜和封装部件之间的模塑料进行固化，其中，在该固化步骤中焊球仍与离型膜保持物理接触。本发明还公开了一种用于涂敷模塑料的层叠封装工艺。

Description

用于涂敷模塑料的层叠封装工艺
技术领域
本发明涉及半导体领域，更具体地，涉及层叠封装工艺。
背景技术
在传统的层叠封装(POP)工艺中，接合有第一器件管芯的顶部封装件进一步与底部封装件接合。该底部封装件也可以与第二器件管芯接合。由于经常使用焊球接合顶部封装件和底部封装件，因此第二器件管芯可以处在底部封装件的同侧上。
在将顶部封装件与底部封装件接合之前，模塑料被涂敷在底部封装件上，其中，模塑料覆盖了在第二器件管芯和焊球。由于焊球被埋在模塑料中，所以要进行激光消融或者穿孔，从而在模塑料中形成孔以便将焊球暴露出来。然后可以通过底部封装件中的焊球接合顶部封装件和底部封装件。
发明内容
为了解决现有技术中所存在的缺陷，根据本发明的一个方面，提供了一种方法，包括：提供封装部件，包括：器件管芯，以及焊球，其中，所述器件管芯和所述焊球与所述封装部件的相同面接合；将所述封装部件压在离型膜上，其中，所述焊球的第一部分被压入所述离型膜中，而所述焊球的第二部分以及所述器件管芯未被压入所述离型膜中；在所述离型膜和所述封装部件之间的空间中填充模塑料，其中，所述器件管芯完全被埋在所述模塑料中；以及固化所述模塑料。
在该方法中，在所述固化步骤中，所述焊球与所述离型膜保持物理接触；或者在所述按压步骤之后，所述器件管芯与所述离型膜接触；或者在所述按压步骤之后，所述器件管芯不与所述离型膜接触，并且其中，通过所述模塑料使所述器件管芯与所述离型膜分开。
该方法进一步包括：在所述按压步骤之前，将所述离型膜布置在模具上，其中，所述离型膜的一部分形成腔体；进行填充所述模塑料的步骤，其中，所述模塑料被填充到所述腔体中；以及在填充所述模塑料的步骤之后进行按压所述封装部件的步骤；或者进一步包括：在所述固化步骤之后，将所述封装部件和所述模塑料与所述离型膜分离。
在该方法中，在填充所述模塑料的步骤之前进行按压所述封装部件的步骤；或者通过尺寸小于所述焊球的额外焊球，将所述器件管芯接合在所述封装部件上。
根据本发明的另一方面，提供了一种方法，包括：提供第一封装件，包括：第一封装部件；第一器件管芯，与所述封装部件的表面接合；以及第一焊球，处在与所述第一器件管芯相邻的所述第一封装部件的表面上方，其中，所述第一焊球具有高于所述第一器件管芯的顶面的顶端；在模具上布置离型膜，其中，所述离型膜形成了腔体；将模塑料填充到所述腔体中；通过所述第一焊球以及所述第一器件管芯面向所述腔体，将第一封装件布置在所述模塑料上；以及将所述封装部件压在所述离型膜按上，使得所述第一焊球的顶部被压入所述离型膜中，而通过所述模塑料将所述第一器件管芯与所述离型膜分开。
该方法进一步包括：在所述按压步骤之后，固化所述模塑料，其中，所述第一焊球的所述顶部在固化过程中仍然处在所述离型膜内部；或者在所述固化步骤之后，将所述第一封装件和所述模塑料与所述离型膜分离；或者在所述分离步骤之后，通过所述焊球接合第二封装件和所述第一封装件。
在该方法中，提供所述第一封装件的步骤包括通过形成金属凸块，将所述第一器件管芯接合在所述第一封装部件的表面上。
在该方法中，所述第二封装件包括：第二封装部件，具有第一表面和与所述第一表面相对的第二表面；第二器件管芯，与所述第二封装部件的所述第一表面接合；以及第二焊球，处在所述第二封装部件的所述第二表面上方，其中，所述第一焊球具有高于所述第一器件管芯的顶面的顶端；以及所述第二封装件的所述第二焊球与所述第一封装件的所述第一焊球接合。
根据本发明的又一方面，提供了一种封装件，包括：封装部件；器件管芯，与所述封装部件的表面接合；多个焊球，形成在与所述器件管芯相邻的所述封装部件的表面上；以及模塑料，处在所述封装部件的表面上方，覆盖所述器件管芯并且暴露出所述多个焊球的所述顶端。
在该封装件中，所述器件管芯通过多个金属凸块接合在所述封装部件的表面上；或者所述多个焊球的所述顶端具有基本上呈圆形的表面；或者在所述多个焊球之间的所述模塑料的所述顶面彼此齐平；或者在所述器件管芯上方的所述模塑料的所述顶面基本上是平坦的。
附图说明
为更完整的理解实施例及其优点，现将结合附图所进行的以下描述作为参考，其中，
图1至图4是根据实施例形成顶部封装件的中间阶段的截面图；
图5至图7是根据实施例形成底部封装件的中间阶段的截面图，其中，使用压塑成型法来涂敷模塑料；
图8和图9示出顶部封装件与底部封装件的接合；以及
图10和图11是根据可选实施例形成底部封装件的中间阶段的截面图，其中，使用传递模塑法涂敷模塑料。
具体实施方式
下面，详细讨论本发明各实施例的制造和使用。然而，应该理解，本发明提供了许多可以在各种具体环境中实现的可应用的概念。所讨论的具体实施例仅仅是说明性的，而不用于限制本发明的范围。
根据各个实施例，提供了层叠封装(POP)的接合方法以及所得到的封装结构。示出了根据实施例制造封装结构的中间阶段。然后描述了实施例的变化。在各个视图和示例性实施例中，类似的参考标号通常代表类似的元件。
参考图1，提供了封装部件10。封装部件10可以包括由半导体材料(诸如，硅、硅锗、碳化硅、砷化镓或其他常用)形成的衬底11。可选地，衬底11由介电材料形成。封装部件10被配置用于将第一表面10A上的金属凸块12与金属部件(诸如，处在与第一表面10A相对的第二表面10B上的接合焊盘16)电连接。因此，封装部件10在其中可以包括金属线/通孔14。在实施例中，封装部件10是中介层。在可选的实施例中，封装部件10是封装衬底。
管芯20通过金属凸块12与封装部件10接合。金属凸块12可以是焊料凸块或其他类型的含金属的金属凸块。在整个说明书中，金属凸块12可选地称为焊球12。管芯20可以是器件管芯，在其上包括有集成电路器件诸如，晶体管、电容器、电感器、电阻器(未示出)等。另外，管芯20可以是包括核心电路的逻辑管芯，并且可以是例如，中央计算单元(CPU)管芯或存储器管芯。管芯20和金属凸块12之间的接合可以是焊料接合或直接的金属对金属(诸如，铜对铜)的接合。可以将底部填充物(未示出)散布到管芯20和封装部件10之间的间隙中。
参考图2，例如，使用压塑成型或传递模塑将模塑料24模制在管芯20和封装部件10上。由此，通过模塑料24保护管芯20。在图3中，焊球26被装配在处在封装部件10的表面10B上的接合焊盘16上。焊球26和管芯20可以处在封装部件10的相对侧上。在焊球26上进行回流。由此形成了顶部封装件30。然后，如图4所示，进行助焊剂浸渍，从而将助焊剂/焊料膏28涂敷在焊球26上。
参考图5，形成底部封装件。底部封装件40包括封装部件42，该封装部件可以是中介层、封装衬底等。封装部件42被配置用于将顶面上的焊球44和/或金属凸块45与处在封装部件42的底面上的接合焊盘43电连接。并未示出从金属凸块45到焊球44和/或接合焊盘43的金属连接件，尽管他们也可以存在。另外，封装部件42可以包括金属线和通孔，这两者在此都被表示为46。
管芯50通过金属凸块45与封装部件42接合。金属凸块45可以是焊料凸块或其他类型的含金属的金属凸块。管芯50可以是器件管芯，诸如，逻辑管芯或存储器管芯。管芯50和凸块45之间的接合可以是焊料接合或直接的金属对金属(诸如，铜对铜)的接合。可以将底部填充物(未示出)散布到管芯50和封装部件42之间的间隙中。焊球44可以被装配在封装部件42的管芯50同侧上。焊球44的尺寸很大，使得焊球44的顶端44A可以高于管芯50的顶面50A。
图6和图7示出用于将模塑料66涂敷在封装40上的压塑成型的中间阶段的截面图。模塑料66可以是树脂或其它类型的介电封装材料。参考图6，示出了压塑成型设备的部分的模具62的一部分。模具62被配置为加热至理想的温度。在模具62中形成腔体64。可移动的压缩块63处在腔体64下方，并且被配置用于如箭头所表示地向上和向下移动，从而改变腔体64的深度。
离型膜60被布置在模具62上并且延伸到腔体64中。离型膜60相对较柔软，从而当焊球被压入到其中时，不会对焊球造成损坏，并且焊球可以基本上保持其形状。离型膜60可以是基于氟的膜、硅涂布的聚对苯二甲酸乙酯膜、聚甲基戊烯、聚丙烯膜等。模具62可以包括小孔(未示出)，从而当被抽真空时，离型膜60可以良好地接触到可移动的压缩块63、模具62(在腔体64中)的侧壁以及模具62的顶面。因此，在离型膜60和模具62之间以及在离型膜60和可移动的压缩块63之间基本上不形成气泡。离型膜60也形成了腔体，该腔体同样被表示为64。流体状的模塑料66被布置在腔体64中以及离型膜64上方。然后，底部封装件40被布置在腔体64上方，其中，管芯50和焊球44面对腔体64。
参考图7，器件管芯50和焊球44被布置到腔体64中。也可以向上推动可移动的压缩块63，使得模塑料66被推到上方从而填充到焊球44之间的空间中，并且填充到管芯50和焊球44之间的空间中。模塑料66也可以与封装部件42的表面42A物理接触。对模塑料的量和相应的厚度T1(图6)进行控制，以使得焊球44穿过模塑料66，其中，焊球44至少与离型膜60物理接触。在实施例中，焊球44被压在离型膜60上，其中，每个焊球44的第一部分被压入到离型膜60中。每个焊球44的第二部分不被压入到离型膜60中，使得其处在内部并且与模塑料66接触。如图6所示，被预布置在腔体64中的模塑料66的深度T1可以小于焊球44的高度H3。另一方面，管芯50可以与离型膜60物理接触或可以不与离型膜60物理接触。在实施例中，管芯50不穿入离型膜60。
然后，例如，通过加热模具62对模塑料66进行固化。在固化步骤中，焊球44与离型膜60保持物理接触，并且焊球44也可以保持压入离型膜60中。在加热以固化模塑料66之后，将底部封装件40与离型膜60分开。图8中示出了所得到的底部封装件40。
如图8所示，当执行固化时，在焊球44中与离型膜60接触并且可能压入到离型膜60中的部分上不具有模塑料66。固化的模塑料66具有基本上平坦的顶面。焊球44的顶端44A可以至少与顶面66A齐平，并且可以高于顶面66A。因此，所有焊球44都从模塑料66中暴露出来。管芯50可以被埋在模塑料66的薄层下面。可选地，管芯50可以暴露出来并且具有与模塑料66的顶面66A齐平的顶面。由于离型膜60是柔软的，所以按压焊球44不会导致焊球44的形状发生重大改变，并且焊球44的暴露部分的形状可以保持基本上是圆形的。
又如图8所示，如图4中的步骤所形成的顶部封装件30被布置在底部封装件40上方。由于根据实施例的压塑成型已经使焊球44暴露出来，所以没有必要再进行激光消融或穿孔来使焊球44从模塑料66中暴露出来。然后，如图9所示，顶部封装件30(请参考图8)中的焊球26被布置在相应的焊球44对面并且与其接触。进行回流，使得焊球44和26熔化从而形成结合的焊料凸块(标记为26/44)。
图10和图11示出根据可选实施例的对封装部件42进行模塑料模制，其中，通过传递模塑将模塑料66模制到封装部件42上。除非另行说明，在这些实施例中的参考符号都表示的是图1至图9中所示的实施例中的相似的元件。该实施例的初始步骤基本上与图1至图5中所示的相同。然后，如图10所示，底部封装件42被布置在传递模塑设备的下部基座70上。焊球44面朝上方。离型膜60被布置在焊球44上方并与其接触。上部基座72被用于吸起并且抓住形成腔体64的离型膜60。除了图10中的腔体64面朝下方以外，腔体64基本上可以与图6中的腔体64相同。焊球44被压在离型膜60上，并且每个焊球44的一个部分都可以压入到离型膜60中。该焊球44中被压入到离型膜60中的部分具有高度H1。另一方面，管芯50可以与离型膜60物理接触或可以不与离型膜60物理接触。
然后，如图11所示，腔体64中的空气被抽真空。随后使用活塞将模塑料66注入到腔体64中，并且模塑料66填充了封装部件42、焊球44、管芯50以及离型膜60之间的空间。然后进行加热，以便固化模塑料66。然后，将现在其上包括模塑料66的底部封装件40与离型膜60分开。所得到的封装件40基本上与图8所示的相同。然后，可以进行图8和图9中所示的步骤从而结束封装件30和40的封装。
通过使用实施例，在模塑料66被模制在封装部件42上之后，焊球44已经从模塑料66中暴露出来。由此，省去了激光消融或穿孔的步骤。制造成本降低并且提高了制造产量。
根据实施例，一种封装方法包括：在离型膜上方设置封装部件，其中，封装部件表面上的焊球与离型膜物理接触。随后，对填充在离型膜和封装部件之间的模塑料进行固化，其中，在固化步骤中，焊球与离型膜保持物理接触。
根据其他实施例，一种方法包括：提供包括封装部件的底部封装件、装配在封装部件的顶面上方的焊球以及处在封装部件的顶面上方并与其接合的器件管芯。焊球具有高于器件管芯的顶面的顶端。封装部件被压在离型膜上，以使得焊球的第一部分被压入离型膜中，而焊球的第二部分处在离型膜外。该离型膜形成了腔体，其中，焊球在腔体中。模塑料被填充到腔体中。对腔体中的模塑料进行固化，其中，在固化步骤中，焊球的第一部分保留在离型膜内部。
根据其他实施例，一种封装件包括：封装部件、多个处在封装部件表面上方的并且被装配在封装部件表面上的焊球以及在封装部件表面上方的模塑料。模塑料在多个焊球之间的部分具有低于多个焊球的顶端的顶面。
尽管已经详细地描述了本发明及其优势，但应该理解，可以在不背离所附权利要求限定的实施例的主旨和范围的情况下，做各种不同的改变，替换和更改。而且，本申请的范围并不仅限于本说明书中描述的工艺、机器、制造、材料组分、装置、方法和步骤的特定实施例。作为本领域普通技术人员容易理解，通过本发明，现有的或今后开发的用于执行与根据本发明所采用的所述相应实施例基本相同的功能或获得基本相同结果的工艺、机器、制造，材料组分、装置、方法或步骤根据本发明可以被使用。因此，所附权利要求应该包括在这样的工艺、机器、制造、材料组分、装置、方法或步骤的范围内。此外，每条权利要求构成单独的实施例，并且多个权利要求和实施例的组合在本发明的范围内。

Claims (10)

1.一种方法，包括
提供封装部件，包括：
器件管芯，以及
焊球，其中，所述器件管芯和所述焊球与所述封装部件的相同面接合；
将所述封装部件压在离型膜上，其中，所述焊球的第一部分被压入所述离型膜中，而所述焊球的第二部分以及所述器件管芯未被压入所述离型膜中；
在所述离型膜和所述封装部件之间的空间中填充模塑料，其中，所述器件管芯完全被埋在所述模塑料中；以及
固化所述模塑料。
2.根据权利要求1所述的方法，其中，在所述固化步骤中，所述焊球与所述离型膜保持物理接触；或者
在所述按压步骤之后，所述器件管芯与所述离型膜接触；或者
在所述按压步骤之后，所述器件管芯不与所述离型膜接触，并且其中，通过所述模塑料使所述器件管芯与所述离型膜分开。
3.根据权利要求1所述的方法，进一步包括：
在所述按压步骤之前，将所述离型膜布置在模具上，其中，所述离型膜的一部分形成腔体；
进行填充所述模塑料的步骤，其中，所述模塑料被填充到所述腔体中；以及
在填充所述模塑料的步骤之后进行按压所述封装部件的步骤；或者
所述方法进一步包括：
在所述固化步骤之后，将所述封装部件和所述模塑料与所述离型膜分离。
4.根据权利要求1所述的方法，其中，在填充所述模塑料的步骤之前进行按压所述封装部件的步骤；或者
通过尺寸小于所述焊球的额外焊球，将所述器件管芯接合在所述封装部件上。
5.一种方法，包括：
提供第一封装件，包括：
第一封装部件；
第一器件管芯，与所述封装部件的表面接合；以及
第一焊球，处在与所述第一器件管芯相邻的所述第一封装部件的表面上方，其中，所述第一焊球具有高于所述第一器件管芯的顶面的顶端；
在模具上布置离型膜，其中，所述离型膜形成了腔体；
将模塑料填充到所述腔体中；
通过所述第一焊球以及所述第一器件管芯面向所述腔体，将第一封装件布置在所述模塑料上；以及
将所述封装部件压在所述离型膜按上，使得所述第一焊球的顶部被压入所述离型膜中，而通过所述模塑料将所述第一器件管芯与所述离型膜分开。
6.根据权利要求5所述的方法，进一步包括：在所述按压步骤之后，固化所述模塑料，其中，所述第一焊球的所述顶部在固化过程中仍然处在所述离型膜内部；或者
在所述固化步骤之后，将所述第一封装件和所述模塑料与所述离型膜分离；或者
在所述分离步骤之后，通过所述焊球接合第二封装件和所述第一封装件。
7.根据权利要求5的方法，其中，提供所述第一封装件的步骤包括通过形成金属凸块，将所述第一器件管芯接合在所述第一封装部件的表面上。
8.根据权利要求6所述的方法，其中，所述第二封装件包括：
第二封装部件，具有第一表面和与所述第一表面相对的第二表面；
第二器件管芯，与所述第二封装部件的所述第一表面接合；以及
第二焊球，处在所述第二封装部件的所述第二表面上方，其中，所述第一焊球具有高于所述第一器件管芯的顶面的顶端；以及
所述第二封装件的所述第二焊球与所述第一封装件的所述第一焊球接合。
9.一种封装件，包括：
封装部件；
器件管芯，与所述封装部件的表面接合；
多个焊球，形成在与所述器件管芯相邻的所述封装部件的表面上；以及
模塑料，处在所述封装部件的表面上方，覆盖所述器件管芯并且暴露出所述多个焊球的所述顶端。
10.根据权利要求9所述的封装件，其中，所述器件管芯通过多个金属凸块接合在所述封装部件的表面上；或者
所述多个焊球的所述顶端具有基本上呈圆形的表面；或者
在所述多个焊球之间的所述模塑料的所述顶面彼此齐平；或者
在所述器件管芯上方的所述模塑料的所述顶面基本上是平坦的。
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