CN102714265A - 作为水分子的扩散屏障的浇铸组合物 - Google Patents

作为水分子的扩散屏障的浇铸组合物 Download PDF

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Publication number
CN102714265A
CN102714265A CN2010800595375A CN201080059537A CN102714265A CN 102714265 A CN102714265 A CN 102714265A CN 2010800595375 A CN2010800595375 A CN 2010800595375A CN 201080059537 A CN201080059537 A CN 201080059537A CN 102714265 A CN102714265 A CN 102714265A
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CN
China
Prior art keywords
glass
casting composition
dioxide granule
silica dioxide
phosphor particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800595375A
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English (en)
Chinese (zh)
Inventor
R·派特里
H·温克勒
T·沃斯格罗内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Merck Patent GmbH
Original Assignee
Merck Patent GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent GmbH filed Critical Merck Patent GmbH
Publication of CN102714265A publication Critical patent/CN102714265A/zh
Pending legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0361Manufacture or treatment of packages of wavelength conversion means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/882Scattering means

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  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
CN2010800595375A 2009-12-30 2010-12-01 作为水分子的扩散屏障的浇铸组合物 Pending CN102714265A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP09016115.9 2009-12-30
EP09016115 2009-12-30
PCT/EP2010/007271 WO2011079900A1 (de) 2009-12-30 2010-12-01 Vergussmasse als diffusionsbarriere für wassermoleküle

Publications (1)

Publication Number Publication Date
CN102714265A true CN102714265A (zh) 2012-10-03

Family

ID=43467010

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800595375A Pending CN102714265A (zh) 2009-12-30 2010-12-01 作为水分子的扩散屏障的浇铸组合物

Country Status (8)

Country Link
US (1) US9093623B2 (enExample)
EP (1) EP2519986B1 (enExample)
JP (1) JP5767245B2 (enExample)
KR (1) KR101795091B1 (enExample)
CN (1) CN102714265A (enExample)
SG (1) SG181935A1 (enExample)
TW (1) TWI527847B (enExample)
WO (1) WO2011079900A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103811634A (zh) * 2014-01-26 2014-05-21 佛山市国星光电股份有限公司 封装胶体表面哑光的led器件及其封装方法及led显示屏

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011116230B4 (de) 2011-10-17 2018-10-25 Osram Opto Semiconductors Gmbh Keramisches Konversionselement, optoelektronisches Halbleiterbauelement mit einem keramischen Konversionselement und Verfahren zur Herstellung eines keramischen Konversionselements
DE102011116229A1 (de) * 2011-10-17 2013-04-18 Osram Opto Semiconductors Gmbh Keramisches Konversionselement, optoelektronisches Bauelement mit einem keramischen Konversionselement und Verfahren zur Herstellung eines keramischen Konversionselements
CN104272479A (zh) 2012-05-14 2015-01-07 皇家飞利浦有限公司 具有远程纳米结构磷光体的发光设备
JP2014022508A (ja) * 2012-07-17 2014-02-03 Konica Minolta Inc Led装置及びその製造方法
DE102012108939A1 (de) * 2012-09-21 2014-03-27 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement umfassend ein transparentes Auskoppelelement
DE102013210103A1 (de) * 2013-05-29 2014-12-18 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
KR102369932B1 (ko) 2014-11-10 2022-03-04 삼성전자주식회사 불화물계 형광체, 발광장치, 불화물계 형광체 제조방법 및 발광장치 제조방법
US9871176B2 (en) * 2015-02-02 2018-01-16 Ferro Corporation Glass compositions and glass frit composites for use in optical applications
WO2016134995A1 (en) * 2015-02-23 2016-09-01 Koninklijke Philips N.V. White phosphor converted led with stable flux output versus temperature
JP6470157B2 (ja) * 2015-09-30 2019-02-13 関西ペイント株式会社 発光素子封止用樹脂組成物
JP6615557B2 (ja) * 2015-09-30 2019-12-04 日亜化学工業株式会社 発光装置及びその製造方法
JP6387954B2 (ja) * 2015-12-24 2018-09-12 日亜化学工業株式会社 波長変換部材を用いた発光装置の製造方法
JP2018056512A (ja) * 2016-09-30 2018-04-05 デクセリアルズ株式会社 発光装置、及び発光装置の製造方法
JP7580206B2 (ja) * 2020-05-25 2024-11-11 スタンレー電気株式会社 半導体発光装置
CN114695629A (zh) * 2020-12-25 2022-07-01 惠州视维新技术有限公司 一种led封装用的封装材料及led

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6066861A (en) * 1996-09-20 2000-05-23 Siemens Aktiengesellschaft Wavelength-converting casting composition and its use
US20040207998A1 (en) * 2003-03-10 2004-10-21 Toyoda Gosei Co., Ltd. Light emitting device
CN1694926A (zh) * 2002-10-09 2005-11-09 三菱化学株式会社 热塑性树脂组合物及使用它的模制品
US20080210961A1 (en) * 2007-03-03 2008-09-04 Lite-On Technology Corp. Light emitting device

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2065092A1 (en) * 1991-04-05 1992-10-06 Masayoshi Kurisu Curable coating resin composition and information recording medium using the same
JP3723571B2 (ja) 1991-10-18 2005-12-07 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフトング 着色およびコーティングされた薄片状顔料
JP3242561B2 (ja) 1995-09-14 2001-12-25 メルク・ジヤパン株式会社 薄片状酸化アルミニウム、真珠光沢顔料及びその製造方法
DE19618564A1 (de) 1996-05-09 1997-11-13 Merck Patent Gmbh Plättchenförmiges Titandioxidpigment
JP3417415B1 (ja) 2001-01-24 2003-06-16 日亜化学工業株式会社 エポキシ樹脂組成物、その製造方法、それを用いた光半導体素子
US6833191B2 (en) * 2001-11-20 2004-12-21 Encap Technologies, Llc Microencapsulated particles and process for manufacturing same
CN100556687C (zh) * 2002-09-12 2009-11-04 日本板硝子株式会社 覆发光膜产品
JP4288940B2 (ja) * 2002-12-06 2009-07-01 日亜化学工業株式会社 エポキシ樹脂組成物
US20070013057A1 (en) * 2003-05-05 2007-01-18 Joseph Mazzochette Multicolor LED assembly with improved color mixing
US6841888B2 (en) * 2003-06-04 2005-01-11 Yazaki Corporation Encapsulant for opto-electronic devices and method for making it
DE102004034166B4 (de) * 2003-07-17 2015-08-20 Toyoda Gosei Co., Ltd. Lichtemittierende Vorrichtung
EP1770126B1 (en) * 2004-07-20 2018-01-10 Teijin Chemicals, Ltd. Aromatic polycarbonate resin composition and process for producing the same
US8324641B2 (en) * 2007-06-29 2012-12-04 Ledengin, Inc. Matrix material including an embedded dispersion of beads for a light-emitting device
DE102006004397A1 (de) * 2005-09-30 2007-04-05 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
US20070125984A1 (en) * 2005-12-01 2007-06-07 Sarnoff Corporation Phosphors protected against moisture and LED lighting devices
US20070241661A1 (en) * 2006-04-12 2007-10-18 Yin Chua B High light output lamps having a phosphor embedded glass/ceramic layer
US7820074B2 (en) * 2006-06-28 2010-10-26 Seoul Semiconductor Co., Ltd. Phosphor, method for manufacturing same, and light emitting diode
GB2442535B (en) * 2006-10-05 2011-07-13 Ngf Europ Ltd Method and articles
US7999283B2 (en) * 2007-06-14 2011-08-16 Cree, Inc. Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes
TW200921929A (en) * 2007-11-02 2009-05-16 Innolux Display Corp Light emitting diode
JP2009120437A (ja) * 2007-11-14 2009-06-04 Niigata Univ シロキサンをグラフト化したシリカ及び高透明シリコーン組成物並びに該組成物で封止した発光半導体装置
US20090130471A1 (en) * 2007-11-16 2009-05-21 E.I. Du Pont De Nemours And Company Thermally conductive plastic resin composition
US20090261708A1 (en) * 2008-04-21 2009-10-22 Motorola, Inc. Glass-phosphor capping structure for leds
CN102376860A (zh) * 2010-08-05 2012-03-14 夏普株式会社 发光装置及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6066861A (en) * 1996-09-20 2000-05-23 Siemens Aktiengesellschaft Wavelength-converting casting composition and its use
CN1694926A (zh) * 2002-10-09 2005-11-09 三菱化学株式会社 热塑性树脂组合物及使用它的模制品
US20040207998A1 (en) * 2003-03-10 2004-10-21 Toyoda Gosei Co., Ltd. Light emitting device
US20080210961A1 (en) * 2007-03-03 2008-09-04 Lite-On Technology Corp. Light emitting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103811634A (zh) * 2014-01-26 2014-05-21 佛山市国星光电股份有限公司 封装胶体表面哑光的led器件及其封装方法及led显示屏

Also Published As

Publication number Publication date
TWI527847B (zh) 2016-04-01
WO2011079900A1 (de) 2011-07-07
EP2519986A1 (de) 2012-11-07
KR20120107127A (ko) 2012-09-28
US9093623B2 (en) 2015-07-28
SG181935A1 (en) 2012-08-30
KR101795091B1 (ko) 2017-11-07
JP2013516747A (ja) 2013-05-13
JP5767245B2 (ja) 2015-08-19
EP2519986B1 (de) 2018-09-12
TW201136998A (en) 2011-11-01
US20120329184A1 (en) 2012-12-27

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Application publication date: 20121003