Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/852—Encapsulations
  • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/01—Manufacture or treatment
  • H10H20/036—Manufacture or treatment of packages
  • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/851—Wavelength conversion means
  • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/851—Wavelength conversion means
  • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
  • H10H20/8512—Wavelength conversion materials
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/882—Scattering means

Definitions

• the invention relates to a potting compound based on a
• the potting compound serves as a diffusion barrier for water molecules through the use of glass or silica platelets.
• Commercial white pc LEDs consist of a chip emitting in the blue spectral region and a coating of silicone or epoxy resin containing one or more phosphors.
• the phosphors are often based on silicatic, sulfidic,
• Nitridic or oxynitride materials These materials have the property of being in the presence of slightest traces of
• the phosphor pigments can be provided with a silicone coating.
• the object of the present invention is therefore to provide potting compounds which have one or more of the abovementioned
• Diffusion barrier layer can be applied directly to the phosphor coating of the LED.
• the present invention thus relates to a potting compound based on at least one transparent silicone or epoxy resin containing inorganic phosphor particles and glass and / or
• Silica particles preferably platelet-shaped, and a UV or blue light emitting diode.
• the glass or silica particles and the phosphor particles are homogeneously distributed in the potting compound (see FIG. 1 A).
• the platelet-shaped glass or silica particles are dispersed in the potting compound and aligned plane-parallel and as a separate diffusion barrier layer directly on a additional potting compound, which contains only the phosphor particles, arranged (see Fig. 1 B)
• the glass and silica particles have a diameter of 5 to 20 pm and a thickness of 0.1 to 5 pm.
• the average grain diameter dso is the average grain diameter dso
• the effect of the platelet-shaped glass and silica particles is based on blocking the diffusion path of the water molecules in the silicone or epoxy resin potting compound. This is done by plane-parallel alignment of the particles in certain domains and by the staggered arrangement of the plates in the vertical direction, (see Fig. 2)
• the particles can be surface-coated.
• the platelet-shaped particles are then wet-chemically coated with silicones / silanes or by vapor deposition. These organosilicon compounds react with the surface OH groups of the platelet particles.
• the phosphor particles consist of at least one of the following phosphor materials:
• Particularly preferred inorganic phosphor particles for the production of white-luminescent optoelectronic components are ortho-silicates.
• the starting materials for the preparation of the phosphor particle consist of the base material (e.g., salt solutions of yttrium, aluminum, gadolinium, etc.) and at least one dopant (e.g., cerium).
• Suitable starting materials are inorganic and / or organic substances such as nitrates, halides,
• mixed nitrate solutions, chloride or hydroxide solutions are used which contain the corresponding elements in the required stoichiometric
• Epoxy resin containing the phosphor and the glass and / or silica particles Epoxy resin containing the phosphor and the glass and / or silica particles.
• the curing of the coating takes place at temperatures between 120 and 180 ° C, preferably at 150 ° C.
• alkali metal salts for example for silica from a potassium or sodium silicate solution.
• the preparation process is described in detail in EP 763573, EP 608388 and DE 19618564.
• the present invention furthermore relates to a method for producing a potting compound based on at least one transparent silicone or epoxy resin containing inorganic
• Phosphor particles and glass and / or silica particles and a UV or blue light-emitting diode characterized by the method steps:
• Phosphor particles and silicone or epoxy resin are Phosphor particles and silicone or epoxy resin.
• Silica particles are surface-coated with organosilicon compounds (such as silicones or silanes) wet-chemically or by vapor deposition. As already mentioned, this coating is the
• the potting compound may additionally be added light-scattering particles, so-called diffusers (such as CaF 2 ). This is possible
• the potting compound may also contain adhesion promoters, water repellents, processing aids and / or thixotropic agents.
• Thixotropic agent may e.g. fumed silica are used.
• the thixotropic agent is used to thicken the epoxy resin to the
• Processing aid is suitable e.g. Glycol ethers.
• a primer e.g. functional alkoxysiloxane can be used, which improves the adhesion between phosphor particles and resin.
• hydrophobing agents e.g. liquid silicone wax are used, which also serves the modification of the phosphor particle surface.
• the UV or blue light-emitting diode according to the invention is a luminescent light source
• the person skilled in possible forms of such light sources are known. These may be light emitting LED chips
• Example 1 Charging of platelet-shaped glass or silica particles with functional groups
• the pH is corrected by means of 5 wt% H 2 SO 4 to 6.5.
• the suspension is then filtered off and washed free of salt with deionised water. Drying takes place at 130 ° C. for 20 hours.
• the powder thus obtained is then sieved by means of a sieve of 40 ⁇ m.
• the pH is corrected to 6.5 using 5 wt% H2SO4.
• the suspension is then filtered off and washed free of salt with deionised water. The drying takes place at 140 ° C. for 20 h. The resulting powder is then sieved by means of a 40 ⁇ m sieve.
• silica or glass particles 100 g of the silica or glass particles are suspended in 1350 ml of deionized water while stirring vigorously.
• 6.0 g of a 1: 2 mixture of Silquest A-174 [gamma-methacryloxypropyltrimethoxysilane] and Silquest A-151 [vinyltriethoxysilane] are metered into the suspension within 90 minutes with moderate stirring. After the addition is then stirred for 15 min to the coupling of the silanes to the surface
• the pH is corrected to 6.5 using 5 wt% H2SO4.
• the suspension is then filtered off and washed free of salt with deionised water. The drying takes place at 140 ° C. for 20 h.
• the powder thus obtained is then sieved by means of a 40 ⁇ m sieve.
• Each 50 ml of the two resin components JCR 6122 a and b are 4 wt.% Of one of the green ortho-Silikatleuchtschers and 2% uncoated glass or silica particles or according to Example 1 A, B, or C.
• platelet-shaped particles have a mean diameter of 5 ⁇ to 20 ⁇ and a thickness distribution of 0.1 ⁇ to 5 ⁇ on.
• the two resin mixtures are combined, stirred and degassed. Then 10 ml are filled into the storage container of a jet dispenser or screw dispensing valve dispenser. Bonded COB (Chip on Board) raw LED packages are placed under the dispensing valve. Now be with the
• Resin mixtures are combined, stirred and degassed. Thereafter, 10 ml in the storage vessel of a jet dispenser or
• Screw dispensing valve dispenser filled. Bonded COB (Chip on Board) raw LED packages are placed under the dispensing valve. Now, with the dispenser, glob tops are dripped from the resin mixture onto the chips of the raw LED packages. These coated LEDs are in
• Fig. 1 Homogeneous distribution of the glass or silica platelets in the silicone or epoxy resin matrix.
• 1 silicone / epoxy resin
• 2 glass or
• Diffusion barrier layer 5: Diffusion barrier layer consisting of silicone / epoxy matrix containing only the platelet particles; 6: diffusing water.
• Fig. 2 1: glass or silica particles.
• the platelet-shaped particles are aligned in parallel and overlap in a vertical direction, effectively preventing water diffusion.
• Fig.3 1: Average of luminous flux measurements of 50 LEDs, which have a separate water-diffusion barrier layer.
• Orthosilicate phosphor mixed with platelet-shaped particles Orthosilicate phosphor mixed with platelet-shaped particles.

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• Led Device Packages (AREA)
• Luminescent Compositions (AREA)
• Compositions Of Macromolecular Compounds (AREA)
• Electroluminescent Light Sources (AREA)

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Citations (7)

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• 2010
  • 2010-12-01 JP JP2012546375A patent/JP5767245B2/ja not_active Expired - Fee Related
  • 2010-12-01 KR KR1020127020097A patent/KR101795091B1/ko not_active Expired - Fee Related
  • 2010-12-01 SG SG2012047171A patent/SG181935A1/en unknown
  • 2010-12-01 EP EP10784718.8A patent/EP2519986B1/de not_active Not-in-force
  • 2010-12-01 US US13/519,945 patent/US9093623B2/en not_active Expired - Fee Related
  • 2010-12-01 WO PCT/EP2010/007271 patent/WO2011079900A1/de not_active Ceased
  • 2010-12-01 CN CN2010800595375A patent/CN102714265A/zh active Pending
  • 2010-12-29 TW TW099146698A patent/TWI527847B/zh not_active IP Right Cessation

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