CN102708946B - 双面图形化透明导电膜及其制备方法 - Google Patents

双面图形化透明导电膜及其制备方法 Download PDF

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CN102708946B
CN102708946B CN201210141850.4A CN201210141850A CN102708946B CN 102708946 B CN102708946 B CN 102708946B CN 201210141850 A CN201210141850 A CN 201210141850A CN 102708946 B CN102708946 B CN 102708946B
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CN102708946A (zh
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高育龙
崔铮
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Anhui Jingzhuo Optical Display Technology Co Ltd
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Nanchang OFilm Tech Co Ltd
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Abstract

本发明提出了一种双面图形化透明导电膜及其制备方法，该双面图形化透明导电膜包括上表面导电层和下表面导电层，所述双面图形化透明导电膜的上表面导电层是图形化的沟槽网络，所述的下表面导电层是全表面的沟槽网络；所述的上表面导电层的沟槽中均填充有导电材料；所述的下表面导电层沟槽中间断填充导电材料。本发明所提供的双面图形化透明导电膜具有高分辨率，透过率和方阻独立可调等诸多优点；这种透明导电膜可以省去一张PET的成本；制备方法对于单张柔性基材的双面压印不需要对准，方法简单，成本低，适合于工业化生产。

Description

双面图形化透明导电膜及其制备方法
技术领域
本发明涉及透明导电膜及其制备技术领域，特别是指一种双面图形化透明导电膜及其制备方法。
背景技术
透明导电膜是具有良好导电性，和在可见光波段具有高透光率的一种薄膜。目前透明导电膜已广泛应用于平板显示、光伏器件、触控面板和电磁屏蔽等领域，具有极其广阔的市场空间。
ITO一直主导着透明导电膜的市场。但是在诸如触摸屏等大多数实际应用中，往往需要曝光、显像、蚀刻及清洗等多道工序对透明导电膜进行图形化。相较而言，使用印刷法或者银盐法直接在基材的指定区域形成金属网格，可以省去图形化的工艺过程，具有低污染、低成本等诸多优点。日本公司大日本印刷、富士胶片和郡士，以及德国公司PolyIC都分别使用印刷方法获得了性能优异的图形化透明导电薄膜。其中PolyIC所获得的图形分辨率为15um，表面方阻0.4–1Ω/sq，透光率大于80%。
一种基于埋入式图形化金属网格类的透明导电膜，其中PET基底的透明导电膜透过率大于87%，玻璃基底的透明导电膜透过率大于90%；方阻均小于10Ω/sq；特别是金属线条的分辨率小于3μm。但是目前很多触摸屏厂商为了进一步降低成本和减薄触控模组，更加重视双面图形化透明导电膜的研发。
现有的埋入式图形化透明导电膜的沟槽是基于压印技术形成的。因此制备双面图形化透明导电膜就必须解决大幅面卷对卷双面对准压印的技术。然而这技术目前尚不成熟。
有鉴于此，一种用以回避双面压印所面临的对准问题的双面图形化透明导电膜的出现就很有必要了。
发明内容
本发明提出一种双面图形化透明导电膜及其制备方法，解决了现有技术中   卷对卷压印过程中需要双面对准的技术问题。
本发明的技术方案是这样实现的：
一种双面图形化透明导电膜，包括上表面导电层和下表面导电层，所述双面图形化透明导电膜的上表面导电层是图形化的沟槽网络，所述的下表面导电层是全表面的沟槽网络；所述的上表面导电层的沟槽中均填充有导电材料；所述的下表面导电层沟槽中间断填充导电材料。
进一步的，所述的沟槽网络是以多边形沟槽为基本单元的沟槽组合，其中所述基本单元的形状至少包括正方形、矩形、圆形、等六边形、等三边形中的一种或几种的复用。
作为优选的技术方案，所述的下表面导电层沟槽中间断填充导电材料是使用图形化技术将下表面沟槽网络中的导电材料间断出现。
作为优选的技术方案，所述双面图形化透明导电膜的上表面导电层的沟槽网络至少有两种网格密度。
作为优选的技术方案，所述的网格密度中至少有一种网格的相对透过率大于90%；至少有一种相对透过率小于80%。
作为优选的技术方案，所述双面图形化透明导电膜的下表面导电层沟槽网络的相对透过率大于90%。
一种双面图形化透明导电膜的制备方法，包括以下步骤：
1）基于压印技术在中间层上表面制作图形化的沟槽网络；
2）基于压印技术在中间层下表面制作全表面的沟槽网络；
3）分别在中间层的上表面和下表面沟槽中填充导电材料；
4）根据上表面的对准标记，将下表面填充导电材料的无图案沟槽网络图形化。
作为优选的技术方案，所述压印技术为热压印或紫外压印。
作为优选的技术方案，所述上表面的对准标记是上表面网格密度较大的区域作为下表面导电膜图形化的对准标记；所述的网格密度至少有一种网格的相对透过率大于90%，至少有一种相对透过率小于80%。
作为优选的技术方案，所述的下表面填充导电材料的无图案沟槽网络图形化是在下表面贴附负性干膜，将上表面的对准标记和菲林膜的对准标记对准，用紫外光对负性干膜曝光；然后在显影液中显影，被曝光的区域会在显影过程中保留下来，没有被曝光的区域会被清除，被覆盖的导电材料将裸露出来，将所述双面透明导电膜浸泡在导电材料腐蚀液中，裸露的导电材料将被清除；最后将上述结果再浸泡在去胶液中去胶，负性干膜被去除，导电材料裸露出来。
作为优选的技术方案，所述填充导电材料的方法为刮涂或喷墨打印。
有益效果
(1) 本发明所提供的双面图形化透明导电膜具有高分辨率，透过率和方阻独立可调等诸多优点；这种透明导电膜可以省去一张PET的成本；
(2)本发明的制备方法对于单张柔性基材的双面压印不需要对准，方法简单，成本低，适合于工业化生产。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本发明的双面图形化透明导电膜示意图；
图2为本发明的双面图形化透明导电膜下表面图形化示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
实施例1
如图2中（F）所示，一种双面图形化透明导电膜，包括上表面导电层和下表面导电层，双面图形化透明导电膜的上表面导电层是图形化的沟槽网络，下表面导电层是全表面的沟槽网络；上表面导电层的沟槽中均填充导电材料；下表面导电层沟槽中间断填充导电材料。
双面图形化透明导电膜的上表面导电层的沟槽网络有两种网格密度；其中一种网格的相对透过率90%；另一种相对透过率80%。双面图形化透明导电膜的下表面导电层沟槽网络的相对透过率90%。
如图1中(A)所示，首先在基材PET 11的两个表面涂布UV压印胶12，PET 11的厚度为125um，两个表面均有增粘层处理，UV压印胶厚度4um，型号为德渊H450。然后如图1中(B)所示使用压印技术在上表面的12形成图形化的沟槽网络，在下表面的12形成全表面无图形的沟槽网络，沟槽深度2um，宽度2um。接着如图1中(C)所示，使用刮涂技术分别将上下表面的沟槽均填充纳米银墨水并烧结。银墨水固含量35%，烧结温度150℃。如图1中(D)所示，根据上表面的对准标记，使用图形化技术将下表面沟槽网络中的银图形化。
其中下表面的图形化工艺是业界已经非常成熟的工艺，在此不必累述。如需展开，则以下示例作为介绍。
如图2中（A）所示，下表面是填充好导电材料图形化的沟槽网络，上表面是填充好导电材料全表面沟槽网络。
如图2中(B)所示，在前述的下表面贴附一层负性干膜21，型号为杜邦1505。如图2中(C)所示，然后将上表面的对准标记和菲林膜23的对准标记对准，用紫外光22对负性干膜21曝光。如图2中(D)所示被曝光的区域会在显影过程中保留下来，而没有被曝光的区域会被清除，于是原本被21覆盖的银就会裸露出来。显影液是质量百分比1%的NaCO3溶液。如图2中(E)所示，将所述双面透明导电膜浸泡在银腐蚀液中，裸露的银将被清除。如图2中(F)所示，最后将上述结果再浸泡在去胶液中，所有的负性干膜都被去除，被保护的银也裸露出来。去胶液是质量百分比2%的NaCO3溶液。
以上实施例中双面图形化透明导电膜的中间层材料并不局限于实施例中所说的材料，它还可以是玻璃、石英、聚甲基丙烯酸甲酯（PMMA）、聚碳酸酯（PC）等；实施例中所说的下表面图形化的技术并不局限于所举的操作方法，只要能达到下表面图形化的技术都将落入本发明的保护范围；实施例中所说的压印技术包括热压印或紫外压印；实施例中所说的填充导电材料的方法包括刮涂和喷墨打印；本发明中所说的导电材料并不局限于银，也可以是石墨、高分子导电材料等。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (10)

1.一种双面图形化透明导电膜，包括基材以及分别设置于基材两表面的上表面导电层和下表面导电层，其特征在于，所述双面图形化透明导电膜的上表面导电层是图形化的沟槽网络，所述的下表面导电层是全表面的沟槽网络；所述的上表面导电层的沟槽中均填充有导电材料；所述的下表面导电层沟槽中间断填充导电材料。
2.如权利要求1所述的双面图形化透明导电膜，其特征在于，所述的下表面导电层沟槽中间断填充导电材料是使用图形化技术将下表面沟槽网络中的导电材料间断出现。
3.如权利要求1所述的双面图形化透明导电膜，其特征在于，所述双面图形化透明导电膜的上表面导电层的沟槽网络至少有两种网格密度。
4.如权利要求3所述的双面图形化透明导电膜，其特征在于，所述的网格密度中至少有一种网格的相对透过率大于90％；至少有一种相对透过率小于80％。
5.如权利要求1或4所述的双面图形化透明导电膜，其特征在于：所述双面图形化透明导电膜的下表面导电层沟槽网络的相对透过率大于90％。
6.一种双面图形化透明导电膜的制备方法，其特征在于包括以下步骤：
1)基于压印技术在中间层上表面制作图形化的沟槽网络；
2)基于压印技术在中间层下表面制作全表面的沟槽网络；
3)分别在中间层的上表面和下表面沟槽中填充导电材料；
4)根据上表面的对准标记，将下表面填充导电材料的无图案沟槽网络图形化。
7.如权利要求6所述的双面图形化透明导电膜的制备方法，其特征在于：所述压印技术为热压印或紫外压印。
8.如权利要求6所述的双面图形化透明导电膜的制备方法，其特征在于：所述上表面的对准标记是上表面网格密度较大的区域作为下表面导电膜图形化的对准标记；所述的网格密度至少有一种网格的相对透过率大于90％，至少有一种相对透过率小于80％。
9.如权利要求6所述的双面图形化透明导电膜的制备方法，其特征在于：所述的下表面填充导电材料的无图案沟槽网络图形化是在下表面贴附负性干膜，将上表面的对准标记和菲林膜的对准标记对准，用紫外光对负性干膜曝光；然后在显影液中显影，被曝光的区域会在显影过程中保留下来，没有被曝光的区域会被清除，被覆盖的导电材料将裸露出来，将所述双面透明导电膜浸泡在导电材料腐蚀液中，裸露的导电材料将被清除；最后再浸泡在去胶液中去胶，负性干膜被去除，导电材料裸露出来。
10.如权利要求6或7所述的双面图形化透明导电膜的制备方法，其特征在于：所述填充导电材料的方法为刮涂或喷墨打印。
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Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102708946B (zh) * 2012-05-09 2015-01-07 南昌欧菲光科技有限公司 双面图形化透明导电膜及其制备方法
CN102930922B (zh) * 2012-10-25 2015-07-08 南昌欧菲光科技有限公司 一种具有各向异性导电的透明导电膜
CN103426500B (zh) * 2013-02-04 2016-03-09 南昌欧菲光科技有限公司 双层透明导电膜及其制备方法
US9313896B2 (en) 2013-02-04 2016-04-12 Nanchang O-Film Tech. Co., Ltd. Double-layered transparent conductive film and manufacturing method thereof
CN103426502B (zh) * 2013-02-05 2016-08-03 南昌欧菲光科技有限公司 图形化透明导电膜
CN103106953B (zh) * 2013-02-06 2014-11-26 南昌欧菲光科技有限公司 导电膜及其制备方法以及包含该导电膜的触摸屏
CN103187119B (zh) * 2013-02-06 2014-08-06 南昌欧菲光科技有限公司 导电膜及其制备方法以及包含该导电膜的触摸屏
CN103176650B (zh) * 2013-03-01 2016-09-28 南昌欧菲光科技有限公司 导电玻璃基板及其制作方法
CN103165226B (zh) * 2013-03-28 2015-04-08 南昌欧菲光科技有限公司 透明导电膜及其制备方法
CN104375710B (zh) 2014-12-04 2018-01-09 合肥鑫晟光电科技有限公司 一种金属网格、触摸屏和显示装置
WO2017005206A1 (zh) 2015-07-08 2017-01-12 昇印光电（昆山）股份有限公司 光学薄膜
US11143794B2 (en) 2015-07-08 2021-10-12 Shine Optoelectronics (Kunshan) Co., Ltd Optical film
CN113204062A (zh) * 2015-07-08 2021-08-03 昇印光电（昆山）股份有限公司 双面结构光学薄膜及其制作方法
CN105430928A (zh) * 2015-12-29 2016-03-23 广东欧珀移动通信有限公司 柔性电路板的电镀方法、柔性电路板和移动终端
CN106648237A (zh) * 2016-12-22 2017-05-10 信利光电股份有限公司 一种石墨烯触摸屏及其制备方法
CN107396543A (zh) * 2017-07-13 2017-11-24 苏州维业达触控科技有限公司 双面压印导电膜的制作方法及双面压印导电膜、电路板和触控模组
CN108319400A (zh) * 2018-03-20 2018-07-24 江西蓝沛泰和新材料有限公司 一种单层双面导电膜结构、制作工艺及触控屏
CN109743872A (zh) * 2018-11-06 2019-05-10 睿惢思工业科技（苏州）有限公司 一种电磁屏蔽膜的制备方法
USD938985S1 (en) 2018-12-20 2021-12-21 Samsung Electronics Co., Ltd. Display screen or portion thereof with transitional graphical user interface
CN109614008B (zh) * 2018-12-28 2022-04-12 业成科技（成都）有限公司 双面图案化的方法及触控面板的制造方法
CN113314266B (zh) * 2020-02-26 2022-08-12 中国科学院长春光学精密机械与物理研究所 一种高电导效率的自然仿生学脉网状电极制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101561729A (zh) * 2008-04-15 2009-10-21 宸鸿光电科技股份有限公司 触控电路的透明基板双面导电膜的制法
CN102063951A (zh) * 2010-11-05 2011-05-18 苏州苏大维格光电科技股份有限公司 一种透明导电膜及其制作方法
CN102222538A (zh) * 2011-03-11 2011-10-19 苏州纳格光电科技有限公司 图形化的柔性透明导电薄膜及其制法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4948706A (en) * 1987-12-30 1990-08-14 Hoya Corporation Process for producing transparent substrate having thereon transparent conductive pattern elements separated by light-shielding insulating film, and process for producing surface-colored material
JP2001284879A (ja) * 2000-03-28 2001-10-12 Hitachi Chem Co Ltd 電磁波シールド材料、その製法およびその利用
JP5213433B2 (ja) * 2006-12-21 2013-06-19 富士フイルム株式会社 導電膜およびその製造方法
TWI459436B (zh) * 2008-10-27 2014-11-01 Tpk Touch Solutions Inc The Method of Making Double - sided Graphic Structure of Touch Circuit
KR100909265B1 (ko) * 2009-02-23 2009-07-27 (주)이엔에이치테크 정전용량 방식의 터치스크린 패널의 제조방법
JP5548428B2 (ja) * 2009-11-02 2014-07-16 藤森工業株式会社 透明導電性フィルムの製造方法及び透明導電性フィルム
JP5361671B2 (ja) * 2009-11-06 2013-12-04 日本写真印刷株式会社 タッチ入力シートとその製造方法
KR20120117762A (ko) * 2009-11-27 2012-10-24 도판 인사츠 가부시키가이샤 투명 도전성 적층체 및 그의 제조 방법 및 정전 용량식 터치 패널
JP2011129272A (ja) * 2009-12-15 2011-06-30 Nissha Printing Co Ltd 両面透明導電膜シートとその製造方法
CN201780569U (zh) * 2010-06-08 2011-03-30 柯建信 电容式双面透明导电膜及其所应用的触控面板
JP5691334B2 (ja) * 2010-09-16 2015-04-01 凸版印刷株式会社 透明導電性積層体の製造方法
CN102708946B (zh) * 2012-05-09 2015-01-07 南昌欧菲光科技有限公司 双面图形化透明导电膜及其制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101561729A (zh) * 2008-04-15 2009-10-21 宸鸿光电科技股份有限公司 触控电路的透明基板双面导电膜的制法
CN102063951A (zh) * 2010-11-05 2011-05-18 苏州苏大维格光电科技股份有限公司 一种透明导电膜及其制作方法
CN102222538A (zh) * 2011-03-11 2011-10-19 苏州纳格光电科技有限公司 图形化的柔性透明导电薄膜及其制法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2011-96975A 2011.05.12 *

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