CN102687215B - 磁性叠层设计 - Google Patents
磁性叠层设计 Download PDFInfo
- Publication number
- CN102687215B CN102687215B CN201080032381.1A CN201080032381A CN102687215B CN 102687215 B CN102687215 B CN 102687215B CN 201080032381 A CN201080032381 A CN 201080032381A CN 102687215 B CN102687215 B CN 102687215B
- Authority
- CN
- China
- Prior art keywords
- layer
- pinned
- magnetic stack
- free
- free layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/098—Magnetoresistive devices comprising tunnel junctions, e.g. tunnel magnetoresistance sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
- H01F10/3272—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3286—Spin-exchange coupled multilayers having at least one layer with perpendicular magnetic anisotropy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/11—Magnetic recording head
- Y10T428/1107—Magnetoresistive
- Y10T428/1114—Magnetoresistive having tunnel junction effect
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/11—Magnetic recording head
- Y10T428/1107—Magnetoresistive
- Y10T428/1143—Magnetoresistive with defined structural feature
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Computer Hardware Design (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
- Magnetic Heads (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/501,632 US7939188B2 (en) | 2008-10-27 | 2009-07-13 | Magnetic stack design |
| US12/501,632 | 2009-07-13 | ||
| PCT/US2010/041296 WO2011008614A1 (en) | 2009-07-13 | 2010-07-08 | Magnetic stack design |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102687215A CN102687215A (zh) | 2012-09-19 |
| CN102687215B true CN102687215B (zh) | 2015-02-11 |
Family
ID=42729020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080032381.1A Expired - Fee Related CN102687215B (zh) | 2009-07-13 | 2010-07-08 | 磁性叠层设计 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7939188B2 (https=) |
| JP (5) | JP5669839B2 (https=) |
| KR (1) | KR101459511B1 (https=) |
| CN (1) | CN102687215B (https=) |
| WO (1) | WO2011008614A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106374036A (zh) * | 2015-07-24 | 2017-02-01 | 爱思开海力士有限公司 | 电子设备及其制造方法 |
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| JPH0652395B2 (ja) | 1986-08-25 | 1994-07-06 | 富士写真フイルム株式会社 | 写真フイルム用スプ−ル |
| US7935435B2 (en) * | 2008-08-08 | 2011-05-03 | Seagate Technology Llc | Magnetic memory cell construction |
| US8169810B2 (en) * | 2008-10-08 | 2012-05-01 | Seagate Technology Llc | Magnetic memory with asymmetric energy barrier |
| US7939188B2 (en) * | 2008-10-27 | 2011-05-10 | Seagate Technology Llc | Magnetic stack design |
| US7998758B2 (en) * | 2008-11-05 | 2011-08-16 | Seagate Technology Llc | Method of fabricating a magnetic stack design with decreased substrate stress |
| US8043732B2 (en) * | 2008-11-11 | 2011-10-25 | Seagate Technology Llc | Memory cell with radial barrier |
| US8455117B2 (en) * | 2009-03-04 | 2013-06-04 | Seagate Technology Llc | Bit-patterned stack with antiferromagnetic shell |
| JP5794892B2 (ja) * | 2010-11-26 | 2015-10-14 | ルネサスエレクトロニクス株式会社 | 磁気メモリ |
| US8541247B2 (en) * | 2010-12-20 | 2013-09-24 | Seagate Technology Llc | Non-volatile memory cell with lateral pinning |
| JP5492144B2 (ja) * | 2011-05-27 | 2014-05-14 | 株式会社日立製作所 | 垂直磁化磁気抵抗効果素子及び磁気メモリ |
| US9082695B2 (en) * | 2011-06-06 | 2015-07-14 | Avalanche Technology, Inc. | Vialess memory structure and method of manufacturing same |
| US8313959B1 (en) | 2011-08-17 | 2012-11-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Hole first hardmask definition |
| US8981503B2 (en) | 2012-03-16 | 2015-03-17 | Headway Technologies, Inc. | STT-MRAM reference layer having substantially reduced stray field and consisting of a single magnetic domain |
| US9007818B2 (en) | 2012-03-22 | 2015-04-14 | Micron Technology, Inc. | Memory cells, semiconductor device structures, systems including such cells, and methods of fabrication |
| US9368176B2 (en) * | 2012-04-20 | 2016-06-14 | Alexander Mikhailovich Shukh | Scalable magnetoresistive element |
| US9054030B2 (en) | 2012-06-19 | 2015-06-09 | Micron Technology, Inc. | Memory cells, semiconductor device structures, memory systems, and methods of fabrication |
| US8923038B2 (en) | 2012-06-19 | 2014-12-30 | Micron Technology, Inc. | Memory cells, semiconductor device structures, memory systems, and methods of fabrication |
| US9373775B2 (en) | 2012-09-13 | 2016-06-21 | Micron Technology, Inc. | Methods of forming magnetic memory cells |
| US9379315B2 (en) | 2013-03-12 | 2016-06-28 | Micron Technology, Inc. | Memory cells, methods of fabrication, semiconductor device structures, and memory systems |
| US8970991B2 (en) * | 2013-03-12 | 2015-03-03 | Seagate Technology Llc | Coupling feature in a magnetoresistive trilayer lamination |
| US9368714B2 (en) | 2013-07-01 | 2016-06-14 | Micron Technology, Inc. | Memory cells, methods of operation and fabrication, semiconductor device structures, and memory systems |
| US9466787B2 (en) | 2013-07-23 | 2016-10-11 | Micron Technology, Inc. | Memory cells, methods of fabrication, semiconductor device structures, memory systems, and electronic systems |
| US8872149B1 (en) * | 2013-07-30 | 2014-10-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | RRAM structure and process using composite spacer |
| US9203017B2 (en) | 2013-08-02 | 2015-12-01 | Samsung Electronics Co., Ltd. | Method and system for providing magnetic junctions including a package structure usable in spin transfer torque memories |
| US9196825B2 (en) | 2013-09-03 | 2015-11-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Reversed stack MTJ |
| US9257636B2 (en) | 2013-09-11 | 2016-02-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method |
| US9461242B2 (en) | 2013-09-13 | 2016-10-04 | Micron Technology, Inc. | Magnetic memory cells, methods of fabrication, semiconductor devices, memory systems, and electronic systems |
| US9608197B2 (en) | 2013-09-18 | 2017-03-28 | Micron Technology, Inc. | Memory cells, methods of fabrication, and semiconductor devices |
| US9177576B2 (en) | 2013-10-03 | 2015-11-03 | HGST Netherlands B.V. | Giant magneto resistive sensor and method for making same |
| US10454024B2 (en) | 2014-02-28 | 2019-10-22 | Micron Technology, Inc. | Memory cells, methods of fabrication, and memory devices |
| EP3123476B1 (en) * | 2014-03-28 | 2019-10-16 | Intel Corporation | Techniques for forming spin-transfer-torque memory having a dot-contacted free magnetic layer |
| US9281466B2 (en) | 2014-04-09 | 2016-03-08 | Micron Technology, Inc. | Memory cells, semiconductor structures, semiconductor devices, and methods of fabrication |
| US9269888B2 (en) | 2014-04-18 | 2016-02-23 | Micron Technology, Inc. | Memory cells, methods of fabrication, and semiconductor devices |
| US10003014B2 (en) * | 2014-06-20 | 2018-06-19 | International Business Machines Corporation | Method of forming an on-pitch self-aligned hard mask for contact to a tunnel junction using ion beam etching |
| US9349945B2 (en) | 2014-10-16 | 2016-05-24 | Micron Technology, Inc. | Memory cells, semiconductor devices, and methods of fabrication |
| US9768377B2 (en) | 2014-12-02 | 2017-09-19 | Micron Technology, Inc. | Magnetic cell structures, and methods of fabrication |
| US10439131B2 (en) | 2015-01-15 | 2019-10-08 | Micron Technology, Inc. | Methods of forming semiconductor devices including tunnel barrier materials |
| US9559294B2 (en) | 2015-01-29 | 2017-01-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Self-aligned magnetoresistive random-access memory (MRAM) structure for process damage minimization |
| US10008662B2 (en) | 2015-03-12 | 2018-06-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Perpendicular magnetic tunneling junction (MTJ) for improved magnetoresistive random-access memory (MRAM) process |
| US9853205B1 (en) * | 2016-10-01 | 2017-12-26 | International Business Machines Corporation | Spin transfer torque magnetic tunnel junction with off-centered current flow |
| WO2019092817A1 (ja) | 2017-11-08 | 2019-05-16 | Tdk株式会社 | トンネル磁気抵抗効果素子、磁気メモリ、及び内蔵型メモリ |
| US10607898B2 (en) | 2017-11-08 | 2020-03-31 | Tdk Corporation | Tunnel magnetoresistive effect element, magnetic memory, and built-in memory |
| JP2023046270A (ja) * | 2021-09-21 | 2023-04-03 | Tdk株式会社 | 磁気センサ |
| CN115996579B (zh) * | 2021-10-15 | 2026-04-21 | 中国科学院微电子研究所 | 一种sot-mram及其制造方法 |
| US12598918B2 (en) | 2022-05-25 | 2026-04-07 | Tdk Corporation | Magneto-resistive element and method of manufacturing the magneto-resistive element |
| EP4362650B1 (en) * | 2022-10-31 | 2025-08-06 | Commissariat à l'Energie Atomique et aux Energies Alternatives | Magnetic tunnel junction, array of magnetic tunnel junctions, and associated fabrication method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20040041182A1 (en) * | 2002-08-29 | 2004-03-04 | Tuttle Mark E. | MRAM sense layer area control |
| US20040157427A1 (en) * | 2003-01-06 | 2004-08-12 | Sony Corporation | Nonvolatile magnetic memory device and manufucturing method thereof |
| CN101000821A (zh) * | 2006-01-11 | 2007-07-18 | 中国科学院物理研究所 | 一种闭合形状的磁性多层膜及其制备方法和用途 |
| EP1885006A1 (en) * | 2006-07-31 | 2008-02-06 | MagIC Technologies Inc. | A novel capping layer for a magnetic tunnel junction device to enhance dR/R and a method of making the same |
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-
2009
- 2009-07-13 US US12/501,632 patent/US7939188B2/en active Active
-
2010
- 2010-07-08 JP JP2012520671A patent/JP5669839B2/ja not_active Expired - Fee Related
- 2010-07-08 WO PCT/US2010/041296 patent/WO2011008614A1/en not_active Ceased
- 2010-07-08 CN CN201080032381.1A patent/CN102687215B/zh not_active Expired - Fee Related
- 2010-07-08 KR KR1020127003810A patent/KR101459511B1/ko not_active Expired - Fee Related
-
2011
- 2011-04-11 US US13/083,693 patent/US8197953B2/en not_active Expired - Fee Related
-
2013
- 2013-07-05 JP JP2013141583A patent/JP2013243378A/ja active Pending
- 2013-07-05 JP JP2013141582A patent/JP5752183B2/ja not_active Expired - Fee Related
-
2015
- 2015-04-02 JP JP2015075907A patent/JP6113216B2/ja not_active Expired - Fee Related
- 2015-07-03 JP JP2015134288A patent/JP6193312B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040041182A1 (en) * | 2002-08-29 | 2004-03-04 | Tuttle Mark E. | MRAM sense layer area control |
| US20040157427A1 (en) * | 2003-01-06 | 2004-08-12 | Sony Corporation | Nonvolatile magnetic memory device and manufucturing method thereof |
| CN101000821A (zh) * | 2006-01-11 | 2007-07-18 | 中国科学院物理研究所 | 一种闭合形状的磁性多层膜及其制备方法和用途 |
| EP1885006A1 (en) * | 2006-07-31 | 2008-02-06 | MagIC Technologies Inc. | A novel capping layer for a magnetic tunnel junction device to enhance dR/R and a method of making the same |
Non-Patent Citations (1)
| Title |
|---|
| Nanoring magnetic tunnel junction and its application in magnetic random access memory demo devices with spin-polarized current switching;X. F. Han等;《JOURNAL OF APPLIED PHYSICS》;20080326;第103卷(第7期);07E933 - 07E933-6 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106374036A (zh) * | 2015-07-24 | 2017-02-01 | 爱思开海力士有限公司 | 电子设备及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6193312B2 (ja) | 2017-09-06 |
| US7939188B2 (en) | 2011-05-10 |
| KR20120115205A (ko) | 2012-10-17 |
| JP2013243378A (ja) | 2013-12-05 |
| JP5669839B2 (ja) | 2015-02-18 |
| CN102687215A (zh) | 2012-09-19 |
| US8197953B2 (en) | 2012-06-12 |
| WO2011008614A1 (en) | 2011-01-20 |
| US20110180888A1 (en) | 2011-07-28 |
| JP2015216392A (ja) | 2015-12-03 |
| JP6113216B2 (ja) | 2017-04-12 |
| JP5752183B2 (ja) | 2015-07-22 |
| JP2013254960A (ja) | 2013-12-19 |
| KR101459511B1 (ko) | 2014-11-07 |
| JP2015156501A (ja) | 2015-08-27 |
| US20100102406A1 (en) | 2010-04-29 |
| JP2012533188A (ja) | 2012-12-20 |
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