CN102668277B - 半导体激光器 - Google Patents
半导体激光器 Download PDFInfo
- Publication number
- CN102668277B CN102668277B CN201080057349.9A CN201080057349A CN102668277B CN 102668277 B CN102668277 B CN 102668277B CN 201080057349 A CN201080057349 A CN 201080057349A CN 102668277 B CN102668277 B CN 102668277B
- Authority
- CN
- China
- Prior art keywords
- semiconductor
- semiconductor body
- region
- bridge
- bridge shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2201—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure in a specific crystallographic orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/12—Pendeo epitaxial lateral overgrowth [ELOG], e.g. for growing GaN based blue laser diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009058345.9A DE102009058345B4 (de) | 2009-12-15 | 2009-12-15 | Halbleiterlaser |
| DE102009058345.9 | 2009-12-15 | ||
| PCT/EP2010/067402 WO2011072964A1 (de) | 2009-12-15 | 2010-11-12 | Halbleiterlaser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102668277A CN102668277A (zh) | 2012-09-12 |
| CN102668277B true CN102668277B (zh) | 2014-06-18 |
Family
ID=43567921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080057349.9A Active CN102668277B (zh) | 2009-12-15 | 2010-11-12 | 半导体激光器 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8879596B2 (enExample) |
| EP (1) | EP2514049B1 (enExample) |
| JP (1) | JP5744054B2 (enExample) |
| KR (1) | KR101723143B1 (enExample) |
| CN (1) | CN102668277B (enExample) |
| DE (1) | DE102009058345B4 (enExample) |
| TW (1) | TWI438992B (enExample) |
| WO (1) | WO2011072964A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013107971A1 (de) * | 2013-07-25 | 2015-01-29 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip, Halbleiterbauelement und Verfahren zur Herstellung von optoelektronischen Halbleiterchips |
| DE102013216527A1 (de) * | 2013-08-21 | 2015-02-26 | Osram Opto Semiconductors Gmbh | Laserbauelement und Verfahren zum Herstellen eines Laserbauelements |
| DE102013220641A1 (de) | 2013-10-14 | 2015-04-16 | Osram Opto Semiconductors Gmbh | Halbleiterlaser mit einseitig verbreiterter Ridgestruktur |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1519998A (zh) * | 2003-02-07 | 2004-08-11 | ������������ʽ���� | 半导体元件及其制造方法 |
| CN101529674A (zh) * | 2006-10-17 | 2009-09-09 | 三洋电机株式会社 | 氮化物类半导体激光元件及其制造方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2044717A1 (en) | 1990-06-18 | 1991-12-19 | Candadai S. Ramadoss | Process for the separation of proteins, polypeptides or metals |
| JPH0679172U (ja) * | 1993-04-14 | 1994-11-04 | 松下電器産業株式会社 | 半導体レーザ |
| EP0874405A3 (en) * | 1997-03-25 | 2004-09-15 | Mitsubishi Cable Industries, Ltd. | GaN group crystal base member having low dislocation density, use thereof and manufacturing methods thereof |
| JPH11233877A (ja) * | 1998-02-16 | 1999-08-27 | Nec Corp | アレイ型レーザダイオード |
| WO2002065556A1 (en) | 2001-02-15 | 2002-08-22 | Sharp Kabushiki Kaisha | Nitride semiconductor light emitting element and production therefor |
| US7498608B2 (en) * | 2001-10-29 | 2009-03-03 | Sharp Kabushiki Kaisha | Nitride-composite semiconductor laser element, its manufacturing method, and semiconductor optical device |
| US6812496B2 (en) | 2002-01-10 | 2004-11-02 | Sharp Kabushiki Kaisha | Group III nitride semiconductor laser device |
| JP2003332676A (ja) * | 2002-05-08 | 2003-11-21 | Mitsubishi Electric Corp | 半導体光装置 |
| JP2004095859A (ja) | 2002-08-30 | 2004-03-25 | Sharp Corp | 半導体レーザ及びその製造方法 |
| US7704860B2 (en) * | 2004-11-22 | 2010-04-27 | Panasonic Corporation | Nitride-based semiconductor device and method for fabricating the same |
| JP4617907B2 (ja) * | 2005-02-03 | 2011-01-26 | ソニー株式会社 | 光集積型半導体発光素子 |
| JP2007173402A (ja) | 2005-12-20 | 2007-07-05 | Matsushita Electric Ind Co Ltd | 半導体レーザ装置 |
| US20080130698A1 (en) * | 2006-11-30 | 2008-06-05 | Sanyo Electric Co., Ltd. | Nitride-based semiconductor device and method of fabricating the same |
| JP2009088270A (ja) | 2007-09-28 | 2009-04-23 | Sanyo Electric Co Ltd | 半導体素子の製造方法 |
| JP2009200478A (ja) * | 2008-01-21 | 2009-09-03 | Sanyo Electric Co Ltd | 半導体レーザ素子およびその製造方法 |
| JP2009200341A (ja) * | 2008-02-22 | 2009-09-03 | Sharp Corp | 窒化物系半導体ウェハ、窒化物系半導体レーザ素子および窒化物系半導体レーザ素子の製造方法 |
-
2009
- 2009-12-15 DE DE102009058345.9A patent/DE102009058345B4/de active Active
-
2010
- 2010-11-12 JP JP2012543557A patent/JP5744054B2/ja active Active
- 2010-11-12 KR KR1020127018374A patent/KR101723143B1/ko active Active
- 2010-11-12 CN CN201080057349.9A patent/CN102668277B/zh active Active
- 2010-11-12 WO PCT/EP2010/067402 patent/WO2011072964A1/de not_active Ceased
- 2010-11-12 EP EP10779771.4A patent/EP2514049B1/de active Active
- 2010-11-12 US US13/515,024 patent/US8879596B2/en active Active
- 2010-12-10 TW TW099143215A patent/TWI438992B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1519998A (zh) * | 2003-02-07 | 2004-08-11 | ������������ʽ���� | 半导体元件及其制造方法 |
| CN101529674A (zh) * | 2006-10-17 | 2009-09-09 | 三洋电机株式会社 | 氮化物类半导体激光元件及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013513956A (ja) | 2013-04-22 |
| DE102009058345A1 (de) | 2011-06-16 |
| DE102009058345B4 (de) | 2021-05-12 |
| US20120287956A1 (en) | 2012-11-15 |
| US8879596B2 (en) | 2014-11-04 |
| WO2011072964A1 (de) | 2011-06-23 |
| JP5744054B2 (ja) | 2015-07-01 |
| KR20120112559A (ko) | 2012-10-11 |
| EP2514049A1 (de) | 2012-10-24 |
| CN102668277A (zh) | 2012-09-12 |
| TWI438992B (zh) | 2014-05-21 |
| EP2514049B1 (de) | 2018-08-08 |
| TW201131918A (en) | 2011-09-16 |
| KR101723143B1 (ko) | 2017-04-04 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |