DE102009058345B4 - Halbleiterlaser - Google Patents
Halbleiterlaser Download PDFInfo
- Publication number
- DE102009058345B4 DE102009058345B4 DE102009058345.9A DE102009058345A DE102009058345B4 DE 102009058345 B4 DE102009058345 B4 DE 102009058345B4 DE 102009058345 A DE102009058345 A DE 102009058345A DE 102009058345 B4 DE102009058345 B4 DE 102009058345B4
- Authority
- DE
- Germany
- Prior art keywords
- web
- shaped
- semiconductor
- semiconductor body
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 179
- 230000005855 radiation Effects 0.000 claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 238000000926 separation method Methods 0.000 claims abstract description 9
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000000151 deposition Methods 0.000 claims abstract description 3
- 238000002955 isolation Methods 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims description 14
- 238000002310 reflectometry Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 21
- 239000013078 crystal Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 4
- 238000005253 cladding Methods 0.000 description 3
- 230000001427 coherent effect Effects 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- -1 nitride compound Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/12—Pendeo epitaxial lateral overgrowth [ELOG], e.g. for growing GaN based blue laser diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2201—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure in a specific crystallographic orientation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009058345.9A DE102009058345B4 (de) | 2009-12-15 | 2009-12-15 | Halbleiterlaser |
| EP10779771.4A EP2514049B1 (de) | 2009-12-15 | 2010-11-12 | Verfahren zur Herstellung lichtemittierender Halbleiterkörper |
| CN201080057349.9A CN102668277B (zh) | 2009-12-15 | 2010-11-12 | 半导体激光器 |
| JP2012543557A JP5744054B2 (ja) | 2009-12-15 | 2010-11-12 | 半導体基体を製造する方法 |
| US13/515,024 US8879596B2 (en) | 2009-12-15 | 2010-11-12 | Semiconductor laser |
| KR1020127018374A KR101723143B1 (ko) | 2009-12-15 | 2010-11-12 | 반도체 레이저 |
| PCT/EP2010/067402 WO2011072964A1 (de) | 2009-12-15 | 2010-11-12 | Halbleiterlaser |
| TW099143215A TWI438992B (zh) | 2009-12-15 | 2010-12-10 | 半導體雷射 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009058345.9A DE102009058345B4 (de) | 2009-12-15 | 2009-12-15 | Halbleiterlaser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE102009058345A1 DE102009058345A1 (de) | 2011-06-16 |
| DE102009058345B4 true DE102009058345B4 (de) | 2021-05-12 |
Family
ID=43567921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102009058345.9A Active DE102009058345B4 (de) | 2009-12-15 | 2009-12-15 | Halbleiterlaser |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8879596B2 (enExample) |
| EP (1) | EP2514049B1 (enExample) |
| JP (1) | JP5744054B2 (enExample) |
| KR (1) | KR101723143B1 (enExample) |
| CN (1) | CN102668277B (enExample) |
| DE (1) | DE102009058345B4 (enExample) |
| TW (1) | TWI438992B (enExample) |
| WO (1) | WO2011072964A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013107971A1 (de) * | 2013-07-25 | 2015-01-29 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip, Halbleiterbauelement und Verfahren zur Herstellung von optoelektronischen Halbleiterchips |
| DE102013216527A1 (de) * | 2013-08-21 | 2015-02-26 | Osram Opto Semiconductors Gmbh | Laserbauelement und Verfahren zum Herstellen eines Laserbauelements |
| DE102013220641A1 (de) | 2013-10-14 | 2015-04-16 | Osram Opto Semiconductors Gmbh | Halbleiterlaser mit einseitig verbreiterter Ridgestruktur |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0936706A1 (en) * | 1998-02-16 | 1999-08-18 | Nec Corporation | Array type laser diode |
| DE10320376A1 (de) * | 2002-05-08 | 2003-11-27 | Mitsubishi Electric Corp | Optische Halbleitervorrichtung |
| US6812496B2 (en) * | 2002-01-10 | 2004-11-02 | Sharp Kabushiki Kaisha | Group III nitride semiconductor laser device |
| US20060192209A1 (en) * | 2005-02-03 | 2006-08-31 | Osamu Maeda | Optical integrated semiconductor light emitting device |
| US20080272462A1 (en) * | 2004-11-22 | 2008-11-06 | Toshitaka Shimamoto | Nitride-Based Semiconductor Device and Method for Fabricating the Same |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2044717A1 (en) | 1990-06-18 | 1991-12-19 | Candadai S. Ramadoss | Process for the separation of proteins, polypeptides or metals |
| JPH0679172U (ja) * | 1993-04-14 | 1994-11-04 | 松下電器産業株式会社 | 半導体レーザ |
| EP0874405A3 (en) * | 1997-03-25 | 2004-09-15 | Mitsubishi Cable Industries, Ltd. | GaN group crystal base member having low dislocation density, use thereof and manufacturing methods thereof |
| WO2002065556A1 (en) | 2001-02-15 | 2002-08-22 | Sharp Kabushiki Kaisha | Nitride semiconductor light emitting element and production therefor |
| US7498608B2 (en) * | 2001-10-29 | 2009-03-03 | Sharp Kabushiki Kaisha | Nitride-composite semiconductor laser element, its manufacturing method, and semiconductor optical device |
| JP2004095859A (ja) | 2002-08-30 | 2004-03-25 | Sharp Corp | 半導体レーザ及びその製造方法 |
| US7372077B2 (en) | 2003-02-07 | 2008-05-13 | Sanyo Electric Co., Ltd. | Semiconductor device |
| JP2007173402A (ja) | 2005-12-20 | 2007-07-05 | Matsushita Electric Ind Co Ltd | 半導体レーザ装置 |
| US20100085996A1 (en) | 2006-10-17 | 2010-04-08 | Sanyo Electric Co., Ltd. | Nitride semiconductor laser device and its manufacturing method |
| US20080130698A1 (en) * | 2006-11-30 | 2008-06-05 | Sanyo Electric Co., Ltd. | Nitride-based semiconductor device and method of fabricating the same |
| JP2009088270A (ja) | 2007-09-28 | 2009-04-23 | Sanyo Electric Co Ltd | 半導体素子の製造方法 |
| JP2009200478A (ja) * | 2008-01-21 | 2009-09-03 | Sanyo Electric Co Ltd | 半導体レーザ素子およびその製造方法 |
| JP2009200341A (ja) * | 2008-02-22 | 2009-09-03 | Sharp Corp | 窒化物系半導体ウェハ、窒化物系半導体レーザ素子および窒化物系半導体レーザ素子の製造方法 |
-
2009
- 2009-12-15 DE DE102009058345.9A patent/DE102009058345B4/de active Active
-
2010
- 2010-11-12 JP JP2012543557A patent/JP5744054B2/ja active Active
- 2010-11-12 KR KR1020127018374A patent/KR101723143B1/ko active Active
- 2010-11-12 CN CN201080057349.9A patent/CN102668277B/zh active Active
- 2010-11-12 WO PCT/EP2010/067402 patent/WO2011072964A1/de not_active Ceased
- 2010-11-12 EP EP10779771.4A patent/EP2514049B1/de active Active
- 2010-11-12 US US13/515,024 patent/US8879596B2/en active Active
- 2010-12-10 TW TW099143215A patent/TWI438992B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0936706A1 (en) * | 1998-02-16 | 1999-08-18 | Nec Corporation | Array type laser diode |
| US6812496B2 (en) * | 2002-01-10 | 2004-11-02 | Sharp Kabushiki Kaisha | Group III nitride semiconductor laser device |
| DE10320376A1 (de) * | 2002-05-08 | 2003-11-27 | Mitsubishi Electric Corp | Optische Halbleitervorrichtung |
| US20080272462A1 (en) * | 2004-11-22 | 2008-11-06 | Toshitaka Shimamoto | Nitride-Based Semiconductor Device and Method for Fabricating the Same |
| US20060192209A1 (en) * | 2005-02-03 | 2006-08-31 | Osamu Maeda | Optical integrated semiconductor light emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013513956A (ja) | 2013-04-22 |
| DE102009058345A1 (de) | 2011-06-16 |
| US20120287956A1 (en) | 2012-11-15 |
| US8879596B2 (en) | 2014-11-04 |
| WO2011072964A1 (de) | 2011-06-23 |
| JP5744054B2 (ja) | 2015-07-01 |
| KR20120112559A (ko) | 2012-10-11 |
| EP2514049A1 (de) | 2012-10-24 |
| CN102668277A (zh) | 2012-09-12 |
| CN102668277B (zh) | 2014-06-18 |
| TWI438992B (zh) | 2014-05-21 |
| EP2514049B1 (de) | 2018-08-08 |
| TW201131918A (en) | 2011-09-16 |
| KR101723143B1 (ko) | 2017-04-04 |
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| DE3535046C2 (enExample) |
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| R012 | Request for examination validly filed | ||
| R002 | Refusal decision in examination/registration proceedings | ||
| R006 | Appeal filed | ||
| R007 | Decision rectified on appeal | ||
| R016 | Response to examination communication | ||
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| R018 | Grant decision by examination section/examining division | ||
| R020 | Patent grant now final |