CN102646664B - 锚定的导电通孔及形成方法 - Google Patents

锚定的导电通孔及形成方法 Download PDF

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Publication number
CN102646664B
CN102646664B CN201210037938.1A CN201210037938A CN102646664B CN 102646664 B CN102646664 B CN 102646664B CN 201210037938 A CN201210037938 A CN 201210037938A CN 102646664 B CN102646664 B CN 102646664B
Authority
CN
China
Prior art keywords
layer
conductive
opening
dielectric layer
undercutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210037938.1A
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English (en)
Chinese (zh)
Other versions
CN102646664A (zh
Inventor
T·S·尤林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of CN102646664A publication Critical patent/CN102646664A/zh
Application granted granted Critical
Publication of CN102646664B publication Critical patent/CN102646664B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76816—Aspects relating to the layout of the pattern or to the size of vias or trenches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • H01L23/53295—Stacked insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
    • H01L2924/35121—Peeling or delaminating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN201210037938.1A 2011-02-17 2012-02-17 锚定的导电通孔及形成方法 Expired - Fee Related CN102646664B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/029,205 US8314026B2 (en) 2011-02-17 2011-02-17 Anchored conductive via and method for forming
US13/029,205 2011-02-17

Publications (2)

Publication Number Publication Date
CN102646664A CN102646664A (zh) 2012-08-22
CN102646664B true CN102646664B (zh) 2017-06-20

Family

ID=46652077

Family Applications (1)

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CN201210037938.1A Expired - Fee Related CN102646664B (zh) 2011-02-17 2012-02-17 锚定的导电通孔及形成方法

Country Status (3)

Country Link
US (1) US8314026B2 (enExample)
JP (1) JP5967801B2 (enExample)
CN (1) CN102646664B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10217644B2 (en) * 2012-07-24 2019-02-26 Infineon Technologies Ag Production of adhesion structures in dielectric layers using photoprocess technology and devices incorporating adhesion structures
US9832887B2 (en) * 2013-08-07 2017-11-28 Invensas Corporation Micro mechanical anchor for 3D architecture
US9892957B2 (en) * 2015-03-16 2018-02-13 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device structure and method for forming the same
CN105990314B (zh) * 2015-03-16 2018-10-26 台湾积体电路制造股份有限公司 半导体器件结构及其形成方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6462395B1 (en) * 1999-10-26 2002-10-08 Fujitsu Limited Semiconductor device and method of producing the same

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US5169680A (en) * 1987-05-07 1992-12-08 Intel Corporation Electroless deposition for IC fabrication
JPS6480024A (en) * 1987-09-22 1989-03-24 Toshiba Corp Semiconductor device and manufacture thereof
JPH0226020A (ja) * 1988-07-15 1990-01-29 Fujitsu Ltd 半導体装置及び半導体装置の製造方法
JPH02110934A (ja) * 1988-10-19 1990-04-24 Matsushita Electric Works Ltd コンタクト電極用窓の形成方法
JPH05308056A (ja) * 1992-04-30 1993-11-19 Sanyo Electric Co Ltd 半導体装置の製造方法
US5470790A (en) 1994-10-17 1995-11-28 Intel Corporation Via hole profile and method of fabrication
KR19990000816A (ko) * 1997-06-10 1999-01-15 윤종용 앵커드 텅스텐 플러그를 구비한 반도체장치의 금속배선구조 및 그 제조방법
KR100366635B1 (ko) * 2000-11-01 2003-01-09 삼성전자 주식회사 반도체 소자의 금속 배선 및 그 제조방법
JP2002319550A (ja) * 2001-04-23 2002-10-31 Sony Corp 金属膜の形成方法および半導体装置の製造方法
JP2002373937A (ja) * 2001-06-15 2002-12-26 Fujitsu Ltd 半導体装置及びその製造方法
US6531384B1 (en) 2001-09-14 2003-03-11 Motorola, Inc. Method of forming a bond pad and structure thereof
KR100413828B1 (ko) * 2001-12-13 2004-01-03 삼성전자주식회사 반도체 장치 및 그 형성방법
JP3973467B2 (ja) * 2002-03-20 2007-09-12 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
JP2004134498A (ja) * 2002-10-09 2004-04-30 Renesas Technology Corp 半導体集積回路装置およびその製造方法
US6864578B2 (en) 2003-04-03 2005-03-08 International Business Machines Corporation Internally reinforced bond pads
US7190078B2 (en) 2004-12-27 2007-03-13 Khandekar Viren V Interlocking via for package via integrity
JP5208936B2 (ja) * 2006-08-01 2013-06-12 フリースケール セミコンダクター インコーポレイテッド チップ製造および設計における改良のための方法および装置
US20090139568A1 (en) * 2007-11-19 2009-06-04 Applied Materials, Inc. Crystalline Solar Cell Metallization Methods

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6462395B1 (en) * 1999-10-26 2002-10-08 Fujitsu Limited Semiconductor device and method of producing the same

Also Published As

Publication number Publication date
US20120211883A1 (en) 2012-08-23
CN102646664A (zh) 2012-08-22
US8314026B2 (en) 2012-11-20
JP5967801B2 (ja) 2016-08-10
JP2012175109A (ja) 2012-09-10

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GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Texas in the United States

Patentee after: NXP USA, Inc.

Address before: Texas in the United States

Patentee before: FREESCALE SEMICONDUCTOR, Inc.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170620