CN102575367B - 在基材上制造金属-陶瓷涂层的镀覆或涂覆方法 - Google Patents

在基材上制造金属-陶瓷涂层的镀覆或涂覆方法 Download PDF

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CN102575367B
CN102575367B CN201080032855.2A CN201080032855A CN102575367B CN 102575367 B CN102575367 B CN 102575367B CN 201080032855 A CN201080032855 A CN 201080032855A CN 102575367 B CN102575367 B CN 102575367B
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sol
coating
plating
substrate
solution
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CN102575367A (zh
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W·高
W·陈
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Auckland Uniservices Ltd
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Auckland Uniservices Ltd
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Chemically Coating (AREA)
CN201080032855.2A 2009-06-29 2010-06-29 在基材上制造金属-陶瓷涂层的镀覆或涂覆方法 Active CN102575367B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NZ578038 2009-06-29
NZ57803809 2009-06-29
PCT/NZ2010/000128 WO2011002311A1 (en) 2009-06-29 2010-06-29 Plating or coating method for producing metal-ceramic coating on a substrate

Publications (2)

Publication Number Publication Date
CN102575367A CN102575367A (zh) 2012-07-11
CN102575367B true CN102575367B (zh) 2015-03-25

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Country Status (8)

Country Link
US (1) US9562302B2 (OSRAM)
EP (1) EP2449154B1 (OSRAM)
JP (1) JP5839407B2 (OSRAM)
KR (1) KR101746240B1 (OSRAM)
CN (1) CN102575367B (OSRAM)
AU (1) AU2010266798B2 (OSRAM)
DK (1) DK2449154T3 (OSRAM)
WO (1) WO2011002311A1 (OSRAM)

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CN102560576B (zh) * 2012-02-21 2015-01-14 合肥工业大学 一种作为焊点反应阻挡层的Ni-Cu-P三元合金涂层及其电镀制备工艺
JP5896889B2 (ja) * 2012-12-07 2016-03-30 株式会社豊田自動織機 光学選択膜
US20140287208A1 (en) * 2013-03-22 2014-09-25 Surface Technology, Inc. Blackened composite electroless nickel coatings
CN103367165A (zh) * 2013-07-01 2013-10-23 北京京东方光电科技有限公司 薄膜晶体管及其制作方法、阵列基板及显示器
CN103436927B (zh) * 2013-08-19 2016-07-06 沈阳理工大学 一种铝溶胶和金属镍离子共沉积的方法
CN104141160B (zh) * 2013-10-29 2018-02-16 中国石油化工集团公司 Cr/Al2O3/SiC复合涂层及其制备方法
EP3149222A4 (en) * 2014-05-27 2018-06-06 Auckland Uniservices Limited Plating or coating method for producing metal-ceramic coating on a substrate
KR101536717B1 (ko) * 2014-07-18 2015-07-15 (주)스마트코리아 박막 태양전지의 비진공 버퍼층 증착장치
CN104988474B (zh) * 2015-07-18 2017-05-10 西安科技大学 一种复合梯度涂层的化学镀制备方法
CN106835089A (zh) * 2017-01-21 2017-06-13 扬州大学 Ni‑W‑P‑纳米SiO2化学复合镀层的制备方法
CN109433209A (zh) * 2018-09-26 2019-03-08 昆明理工大学 镍硼非晶态合金催化剂及其制备方法和应用
CN110029377B (zh) * 2019-05-15 2021-02-09 东南大学 一种长波段超黑多孔复合材料及其制备方法
CN110129778A (zh) * 2019-06-27 2019-08-16 福建工程学院 高均匀度高性能复合Ni-P-TiO2镀层的制备方法
CN110484942B (zh) * 2019-08-07 2022-01-04 湖南纳菲尔新材料科技股份有限公司 一种Ni-P-C-Si-W多元微米晶镀层、镀液及其制备方法
CN110923607A (zh) * 2019-12-27 2020-03-27 上海英佛曼纳米科技股份有限公司 一种带有耐磨损抗粗糙度下降纳米涂层的冷轧活套辊
TW202212640A (zh) 2020-04-24 2022-04-01 紐西蘭商西洛斯材料科學有限公司 在合金上施加著色塗層的方法
CN112195491A (zh) * 2020-10-13 2021-01-08 中国兵器工业第五九研究所 一种基于微弧氧化的SiC-Al2O3涂层的制备方法
CN112226800A (zh) * 2020-10-13 2021-01-15 中国兵器工业第五九研究所 一种铝合金表面叠层陶瓷涂层的制备方法
CN114016008B (zh) * 2021-10-27 2023-08-29 东北电力大学 一种化学镀Ni-P-PTFE-TiO2复合纳米镀层及其制备方法
CN115889770B (zh) * 2022-12-07 2025-02-11 长沙岱勒新材料科技股份有限公司 一种在金刚石微粉表面镀镍的方法
CN117902905B (zh) * 2023-12-28 2025-10-03 国投陶瓷基复合材料研究院(西安)有限公司 一种陶瓷基复合材料表面超高温陶瓷涂层及其制备方法
KR102854888B1 (ko) 2024-07-23 2025-09-04 울산대학교 산학협력단 산소발생반응용 촉매, 이의 제조방법 및 수전해 장치

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EP1020542B1 (en) * 1999-01-12 2007-04-18 C. Uyemura & Co, Ltd Electroless composite plating solution and electroless composite plating method
CN101270476A (zh) * 2008-04-25 2008-09-24 浙江大学 溶胶－凝胶制备高结合强度碳素钢基Al2O3陶瓷涂层方法
CN101397657A (zh) * 2008-10-31 2009-04-01 华东理工大学 采用纳米二氧化硅溶胶和稀土强化复合镀层的方法

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GB824092A (en) * 1956-04-10 1959-11-25 Sherritt Gordon Mines Ltd Method of producing composite metal coated metal compound particles
EP0441636A1 (en) * 1990-02-09 1991-08-14 Nihon Parkerizing Co., Ltd. Process for surface treating titanium-containing metallic material
US5266181A (en) * 1991-11-27 1993-11-30 C. Uyemura & Co., Ltd. Controlled composite deposition method
EP1020542B1 (en) * 1999-01-12 2007-04-18 C. Uyemura & Co, Ltd Electroless composite plating solution and electroless composite plating method
CN101270476A (zh) * 2008-04-25 2008-09-24 浙江大学 溶胶－凝胶制备高结合强度碳素钢基Al2O3陶瓷涂层方法
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Publication number Publication date
WO2011002311A1 (en) 2011-01-06
US20120107627A1 (en) 2012-05-03
EP2449154B1 (en) 2021-09-29
DK2449154T3 (da) 2022-01-10
AU2010266798B2 (en) 2016-08-11
CN102575367A (zh) 2012-07-11
KR20120103547A (ko) 2012-09-19
WO2011002311A9 (en) 2011-02-24
JP5839407B2 (ja) 2016-01-06
AU2010266798A1 (en) 2012-01-19
EP2449154A1 (en) 2012-05-09
JP2012532253A (ja) 2012-12-13
US9562302B2 (en) 2017-02-07
KR101746240B1 (ko) 2017-06-27
EP2449154A4 (en) 2017-01-04

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