CN102559075B - 各向异性导电膜及其组合物和包括该导电膜的装置 - Google Patents

各向异性导电膜及其组合物和包括该导电膜的装置 Download PDF

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Publication number
CN102559075B
CN102559075B CN201110301310.3A CN201110301310A CN102559075B CN 102559075 B CN102559075 B CN 102559075B CN 201110301310 A CN201110301310 A CN 201110301310A CN 102559075 B CN102559075 B CN 102559075B
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conductive film
anisotropic conductive
ppm
resin
equal
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Chinese (zh)
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CN102559075A (zh
Inventor
高连助
鱼东善
曹长铉
朴镇晟
裵相植
金镇圭
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Guktoh Chemical Co ltd
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Cheil Industries Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/10—Homopolymers or copolymers of methacrylic acid esters
    • C08L33/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L35/04—Homopolymers or copolymers of nitriles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201110301310.3A 2010-12-29 2011-09-28 各向异性导电膜及其组合物和包括该导电膜的装置 Active CN102559075B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100138221A KR101279980B1 (ko) 2010-12-29 2010-12-29 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름
KR10-2010-0138221 2010-12-29

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CN102559075A CN102559075A (zh) 2012-07-11
CN102559075B true CN102559075B (zh) 2014-09-10

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Country Status (5)

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US (2) US8608985B2 (https=)
JP (2) JP6338810B2 (https=)
KR (1) KR101279980B1 (https=)
CN (1) CN102559075B (https=)
TW (1) TWI458795B (https=)

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US9281097B2 (en) * 2010-12-29 2016-03-08 Cheil Industries, Inc. Anisotropic conductive film, composition for the same, and apparatus including the same
KR101279980B1 (ko) * 2010-12-29 2013-07-05 제일모직주식회사 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름
KR101385032B1 (ko) * 2010-12-31 2014-04-14 제일모직주식회사 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름
KR101479658B1 (ko) * 2011-11-18 2015-01-06 제일모직 주식회사 가압착 공정성이 개선된 이방성 도전 필름
KR101631359B1 (ko) 2013-08-30 2016-06-16 제일모직주식회사 인체에 무해한 이방 도전성 필름용 조성물, 이방 도전성 필름, 및 상기 필름에 의해 접속된 회로접속물
JP6460344B2 (ja) * 2013-09-24 2019-01-30 エルジー・ケム・リミテッド 粘着性組成物
KR101594483B1 (ko) 2013-10-18 2016-02-16 제일모직주식회사 인체에 무해한 이방 도전성 필름용 조성물, 이방 도전성 필름, 및 상기 필름에 의해 접속된 디스플레이 장치
CN112724870B (zh) 2014-08-12 2022-09-30 三菱化学株式会社 透明粘合片材
CN104531041B (zh) * 2014-12-05 2017-05-10 烟台泰盛精化科技有限公司 一种聚醚型聚氨酯丙烯酸酯紫外光固化胶粘剂及其制备方法
JP6614127B2 (ja) * 2015-01-14 2019-12-04 東洋紡株式会社 導電性銀ペースト
CN108368409B (zh) * 2016-05-23 2019-05-07 拓自达电线株式会社 导电性粘接剂组合物
JP7172991B2 (ja) * 2017-03-29 2022-11-16 昭和電工マテリアルズ株式会社 接着剤組成物及び構造体
JP7264598B2 (ja) * 2018-04-02 2023-04-25 デクセリアルズ株式会社 接着剤組成物及び接続構造体
KR102813180B1 (ko) * 2018-12-28 2025-05-28 엘지디스플레이 주식회사 측면 접속 구조를 갖는 표시 장치 및 이의 본딩 방법
CN110564337B (zh) * 2019-09-12 2021-06-29 天津伟景诺兰达科技有限公司 一种acf导电胶带及其制备工艺和应用
KR20230107273A (ko) * 2020-11-12 2023-07-14 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그 제조 방법, 및 접속 구조체 및 그 제조 방법

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EP2180026A1 (en) * 2007-08-08 2010-04-28 Hitachi Chemical Company, Ltd. Adhesive composition, film-like adhesive, and connection structure for circuit member

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Also Published As

Publication number Publication date
US8608985B2 (en) 2013-12-17
KR20120076185A (ko) 2012-07-09
JP2012140589A (ja) 2012-07-26
TW201226497A (en) 2012-07-01
KR101279980B1 (ko) 2013-07-05
US20140034882A1 (en) 2014-02-06
JP6338810B2 (ja) 2018-06-06
JP2016189334A (ja) 2016-11-04
US9384869B2 (en) 2016-07-05
JP6357501B2 (ja) 2018-07-11
CN102559075A (zh) 2012-07-11
US20120168683A1 (en) 2012-07-05
TWI458795B (zh) 2014-11-01

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Address after: Han Guojingjidao

Patentee after: Samsung SDI Co.,Ltd.

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Patentee before: CHEIL INDUSTRIES Inc.

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Effective date of registration: 20191203

Address after: Seoul, South Kerean

Patentee after: GUKTOH CHEMICAL Co.,Ltd.

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Effective date of registration: 20220913

Address after: Gyeonggi Do, South Korea

Patentee after: Guo Dujianduansucai

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Patentee before: GUKTOH CHEMICAL Co.,Ltd.

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