CN102549730B - 焊接劈刀 - Google Patents
焊接劈刀 Download PDFInfo
- Publication number
- CN102549730B CN102549730B CN201080042841.9A CN201080042841A CN102549730B CN 102549730 B CN102549730 B CN 102549730B CN 201080042841 A CN201080042841 A CN 201080042841A CN 102549730 B CN102549730 B CN 102549730B
- Authority
- CN
- China
- Prior art keywords
- welding
- declining
- welding chopper
- chopper
- neck part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/103—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding using a roller
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- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009228080 | 2009-09-30 | ||
JP2009-228080 | 2009-09-30 | ||
JP2010-220356 | 2010-09-30 | ||
JP2010220356A JP2011097042A (ja) | 2009-09-30 | 2010-09-30 | ボンディングキャピラリー |
PCT/JP2010/067114 WO2011040543A1 (fr) | 2009-09-30 | 2010-09-30 | Capillaire de soudage |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102549730A CN102549730A (zh) | 2012-07-04 |
CN102549730B true CN102549730B (zh) | 2015-02-11 |
Family
ID=43826355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080042841.9A Expired - Fee Related CN102549730B (zh) | 2009-09-30 | 2010-09-30 | 焊接劈刀 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2011097042A (fr) |
KR (1) | KR20120062813A (fr) |
CN (1) | CN102549730B (fr) |
WO (1) | WO2011040543A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014007430A (ja) * | 2009-09-30 | 2014-01-16 | Toto Ltd | ボンディングキャピラリー |
JP2012039032A (ja) * | 2010-08-11 | 2012-02-23 | Fujitsu Ltd | ワイヤボンディング装置用キャピラリ及び超音波トランスデューサ |
JP5376413B1 (ja) * | 2013-01-25 | 2013-12-25 | Toto株式会社 | ボンディングキャピラリ |
JP6270256B1 (ja) | 2016-11-28 | 2018-01-31 | Toto株式会社 | ボンディングキャピラリ |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1098819A (zh) * | 1993-04-30 | 1995-02-15 | 松下电器产业株式会社 | 一种用于导线连接装置的毛细管以及一种应用该毛细管形成导电连接隆起的方法 |
CN1815727A (zh) * | 2005-01-11 | 2006-08-09 | 株式会社海上 | 引线回路,具有该引线回路的半导体器件以及引线接合方法 |
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JP3022151B2 (ja) * | 1993-04-30 | 2000-03-15 | 松下電器産業株式会社 | ワイヤボンディング装置用のキャピラリー及びそのキャピラリーを用いた電気的接続バンプの形成方法 |
JP3139341B2 (ja) * | 1995-10-13 | 2001-02-26 | 松下電器産業株式会社 | キャピラリツールの形状選定方法 |
JP3333399B2 (ja) * | 1996-08-21 | 2002-10-15 | 株式会社新川 | ワイヤボンディング装置用キャピラリ |
JP2000091372A (ja) * | 1998-09-11 | 2000-03-31 | Matsushita Electronics Industry Corp | 電子部品及びそのワイヤボンディングに使用するキャピラリ |
JP2001291736A (ja) * | 2000-04-06 | 2001-10-19 | Seiko Epson Corp | ワイヤボンディング用キャピラリ |
US20040211814A1 (en) * | 2003-04-23 | 2004-10-28 | Jackson Hsieh | Wire bonding capillary for an image sensor |
JP2005197417A (ja) * | 2004-01-06 | 2005-07-21 | Seiko Instruments Inc | キャピラリ及びキャピラリ再生方法 |
KR100718889B1 (ko) * | 2005-11-28 | 2007-05-16 | 이정구 | 투스텝 하이 보틀넥을 갖는 와이어 본딩 캐필러리 |
US7597231B2 (en) * | 2006-04-10 | 2009-10-06 | Small Precision Tools Inc. | Wire bonding capillary tool having multiple outer steps |
JP4941268B2 (ja) * | 2007-12-17 | 2012-05-30 | 富士通株式会社 | ワイヤボンディング方法およびワイヤボンディング装置 |
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2010
- 2010-09-30 JP JP2010220356A patent/JP2011097042A/ja active Pending
- 2010-09-30 KR KR1020127007378A patent/KR20120062813A/ko not_active Application Discontinuation
- 2010-09-30 CN CN201080042841.9A patent/CN102549730B/zh not_active Expired - Fee Related
- 2010-09-30 WO PCT/JP2010/067114 patent/WO2011040543A1/fr active Application Filing
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CN1098819A (zh) * | 1993-04-30 | 1995-02-15 | 松下电器产业株式会社 | 一种用于导线连接装置的毛细管以及一种应用该毛细管形成导电连接隆起的方法 |
CN1815727A (zh) * | 2005-01-11 | 2006-08-09 | 株式会社海上 | 引线回路,具有该引线回路的半导体器件以及引线接合方法 |
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KR20120062813A (ko) | 2012-06-14 |
CN102549730A (zh) | 2012-07-04 |
WO2011040543A1 (fr) | 2011-04-07 |
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