CN102479911A - Light emitting device package - Google Patents

Light emitting device package Download PDF

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Publication number
CN102479911A
CN102479911A CN2011103820668A CN201110382066A CN102479911A CN 102479911 A CN102479911 A CN 102479911A CN 2011103820668 A CN2011103820668 A CN 2011103820668A CN 201110382066 A CN201110382066 A CN 201110382066A CN 102479911 A CN102479911 A CN 102479911A
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CN
China
Prior art keywords
light
lead frame
heat sink
connection part
described light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2011103820668A
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Chinese (zh)
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CN102479911B (en
Inventor
晋洪范
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Lekin Semiconductor Co Ltd
Original Assignee
LG Innotek Co Ltd
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Publication of CN102479911A publication Critical patent/CN102479911A/en
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Publication of CN102479911B publication Critical patent/CN102479911B/en
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    • H—ELECTRICITY
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    • H01L33/64—Heat extraction or cooling elements
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    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

A light emitting device package is disclosed. The disclosed light emitting device package includes a body comprising a cavity, and a recess formed at a bottom surface of the body, first and second lead frames mounted in the body, and a light source electrically connected with the first and second lead frames, wherein at least one of the first and second lead frames has a heat sink which is extended from a portion of the first or the second lead frames, and is disposed in the recess. The body includes a first coupler formed on at least a portion of the body. The heat sink includes a second coupler, to which the first coupler is coupled.

Description

Light
The cross reference of related application
The application requires the priority of on November 25th, 2010 to the korean patent application No.10-2010-0118125 of Korea S Department of Intellectual Property submission, and the disclosure of this korean application is incorporated in the way of reference that this passes through.
Technical field
The present invention relates to a kind of light.
Background technology
Light-emitting diode (LED) is to utilize the characteristic of compound semiconductor with the device of electrical signal conversion for light.This LED is applied to household electrical appliance, remote controllers, advertisement display floater, indicating device, various automatic utensils etc.The range of application of LED enlarges just gradually.
Simultaneously, when when light applies electric energy, this light can produce sizable heat.This heat not only can reduce the durability and the reliability of light, and can limit the function and the life-span of this light.
Summary of the invention
The present invention provides a kind of light; This light comprises lead frame; This lead frame has the portion of extending laterally; Increasing the expose portion of this lead frame, and therefore strengthen the heat absorption function and the heat sinking function of this lead frame, thereby can bring into play more excellent radiating effect and realize the enhancing of reliability.
In one embodiment, a kind of light comprises: body, and this body comprises cavity and recess, this recess is formed on the bottom surface of said body; First lead frame and second lead frame, this first lead frame and second lead frame are installed in the said body; And light source, this light source is electrically connected to first lead frame and second lead frame, wherein; In this first lead frame and second lead frame at least one has heat sink; This heat sink extends and is arranged on the said recess from the part of first or second lead frame, and wherein, said body also comprises first connection part; This first connection part is formed at least a portion of said body; And wherein, said heat sink comprises second connection part, and said first connection part is attached to this second connection part.
Said heat sink can contact at least a portion of a side surface of said body.
At least a portion of said heat sink can contact said recess.
Said heat sink can have at least one bend.
Said bend can be arranged on the folding corner region place of said body.
Said bend can have the sphering part.
Said heat sink can extend from first lead frame.Said light source can be installed on first lead frame.
Said first lead frame can constitute anode terminal.
The width of said recess can be greater than the width of said heat sink.
Said concave depth can be greater than the thickness of said heat sink.
Said first connection part can be a groove, and said second connection part can be the convexity that connects with this groove.
Said first connection part can be protruding, and said second connection part can be the groove that connects with this convexity.
Said heat sink can have the hole, and at least a portion of said heat sink is run through in this hole.
At least a portion of said body can be passed this hole and given prominence to.
Can be formed with uneven portion at least a portion of said heat sink.
Said heat sink can be by processing with first lead frame and the second lead frame identical materials.
Said light can also comprise binder course, and this binder course is arranged between at least one side surface and said heat sink of said body.
Said heat sink can comprise coating, and this coating is formed at least a portion on surface of said heat sink.
Description of drawings
From the detailed description of carrying out below in conjunction with accompanying drawing, can more be expressly understood details of the present invention, in the accompanying drawings:
Fig. 1 is the perspective view that light according to an illustrative embodiment of the invention is shown;
Fig. 2 is the sectional view that light shown in Figure 1 is shown;
Fig. 3 is the sectional view that light shown in Figure 1 is shown;
Fig. 4 is the sectional view that illustrates according to the light of another embodiment;
Fig. 5 is the sectional view that illustrates according to the light of another embodiment;
Fig. 6 is the perspective view that illustrates according to the light of another embodiment;
Fig. 7 A illustrates the perspective view that comprises according to the lighting apparatus of the light of exemplary embodiment;
Fig. 7 B is the cutaway view that the lighting apparatus shown in Fig. 7 A is shown;
Fig. 8 illustrates the decomposition diagram that comprises according to the liquid crystal display of the luminescent device of an exemplary embodiment; And
Fig. 9 illustrates the decomposition diagram that comprises according to the liquid crystal display of the luminescent device of another embodiment.
Embodiment
Now will be in detail with reference to each embodiment, the example of these embodiment has been shown in the accompanying drawing.In the accompanying drawings, for the purpose of description and knowing, thickness of each layer or size can be by exaggerative, omissions or schematically illustrated.And the size of each element or area also not exclusively reflect its actual size.As long as maybe, in institute's drawings attached, all will use identical Reference numeral to represent same or analogous parts.
Fig. 1 is the perspective view that light according to an illustrative embodiment of the invention is shown.Fig. 2 is the sectional view that light shown in Figure 1 is shown.Fig. 3 is along the sectional view of the planar interception vertical with the plane of Fig. 2, shows light shown in Figure 1.
In the following description; In order to illustrate in greater detail shape according to the light of illustrated embodiment; The longitudinal direction of light will be called as " longitudinal direction Z "; The horizontal direction vertical with longitudinal direction Z will be called as " horizontal direction Y ", and will be called as " short transverse X " with longitudinal direction Z and all vertical short transverse of horizontal direction Y.
That is, Fig. 2 is along the X-Y plane intercepting of light shown in Figure 1 and the observed sectional view of Z along the longitudinal direction, and Fig. 3 is Z-X planar interception and the observed sectional view of along continuous straight runs Y along light shown in Figure 1.
Referring to figs. 1 to Fig. 3, by Reference numeral " 100 " expression, comprise according to the light of illustrated embodiment: body 110, this body 110 has cavity, the bottom surface at this body 110 is provided with recess 115 simultaneously; First lead frame 140 and second lead frame 150, this first lead frame 140 and second lead frame 150 are installed in the cavity of body 110; And light source 130; This light source 130 is installed in the cavity of body 110; Be electrically connected to first lead frame 140 and second lead frame 150 simultaneously; Wherein, at least one in first lead frame 140 and second lead frame 150 has heat sink 160, and this heat sink 160 extends and is arranged on the recess 115 from the part of first lead frame 140 or second lead frame 150.Body 110 comprises second connection part 175, and this second connection part 175 is formed at least a portion of body 110.Heat sink 160 comprises first connection part 170, and said second connection part 175 is attached to this first connection part 170.
Body 110 can be processed by at least a material of from following, selecting: such as resin, silicon (Si), aluminium (Al), aluminium nitride (AlN), the liquid crystal polymer such as photosensitive glass (PSG), polyamide 9T (PA9T), syndiotactic polytyrene (SPS), metal, the sapphire (Al of polyphthalamide (PPA) 2O 3) and beryllium oxide (BeO), perhaps this body 110 also can be a printed circuit board (PCB) (PCB).Body 110 can wait through injection molding technique, etch process and form, but the disclosure is not limited thereto.
Body 110 surface within it has inclined surface.According to the gradient of this inclined surface, the reflection of light angle of launching from light source 130 can change.Therefore, can adjust the angle of orientation of the light of outside emission.
The angle of orientation of light is more little, and the convergence that is transmitted into outside light from light source 130 is just big more.On the contrary, the angle of orientation of light is big more, and the convergence that is transmitted into outside light from light source 130 is just more little.
When observing the cavity that forms this body 110 from the top side, said cavity can have circle, square, polygon, elliptical shape etc., and can have rounded corner.Certainly, said cavity is not limited to above-mentioned shape.
Light source 130 is electrically connected to first lead frame 140 and second lead frame 150.For example, light source 130 can be attached to first lead frame 140 and second lead frame 150 by electric wire through electric wire 135.
For example, light source 130 can be the colorful light-emitting diode of red-emitting, green glow, blue light and white light, or the ultraviolet of emitted in ultraviolet light (UV) light-emitting diode, but the disclosure is not limited thereto.One or more light-emitting diodes can be installed.
Said light-emitting diode can be the horizontal light-emitting diode; In this horizontal light-emitting diode; All electric terminals all are arranged on its upper surface; Perhaps said light-emitting diode can be the vertical light-emitting diode, and in this vertical light-emitting diode, electric terminal is dispersed on its upper surface and the lower surface.Alternatively, said light-emitting diode also can be the chip upside-down mounting type light-emitting diode.
Can be filled with resin-encapsulate body (not shown) in the said cavity, to cover said light source 130.
This resin-encapsulate body (not shown) can be processed by silicones, epoxy resin or other resin material.Through utilize encapsulating material to fill said cavity and utilize ultraviolet light or heat solidify the material of being filled, can form this resin-encapsulate body.
This resin-encapsulate body (not shown) can comprise fluorescent material.Can be according to selecting the kind of this fluorescent material, so that send white light from light source 130 wavelength of light emitted.
According to from light source 130 wavelength of light emitted, said fluorescent material can be the fluorescent material of emission blue light, blue green light, green glow, green-yellow light, gold-tinted, yellow ruddiness, orange or ruddiness, but the disclosure is not limited thereto.
That is, this fluorescent material can be excited by the light of first wavelength of light source 130 emission, has the light of second wavelength with generation.For example, when light source 130 is blue LED and this fluorescent material when being yellow fluorescent substance, excite this yellow fluorescent substance through blue light, thereby send gold-tinted.In this case, when the blue light of blue LED generation mixed with the gold-tinted that produces through exciting of this blue light, light 100 can provide white light.
Similarly, when light source 130 is green LED, can uses carmine fluorescent material or use the mixture of blue fluorescent substance and red fluorescent material to be used as said fluorescent material.And, when light source 130 is red light emitting diodes, can uses the cyan fluorescent material or use the mixture of blue fluorescent substance and green fluorescence material to be used as said fluorescent material.
This fluorescent material can be known fluorescent material, and for example YAG base, TAG are basic, sulfide base, silicate-base, aluminate-base, nitride based, carbide base, boron nitride-silicate base, boric acid alkali, fluoride-based or phosphate base fluorescent material.
First lead frame 140 and second lead frame 150 can be processed by at least one or its alloy in following: titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminium (A1), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) and iron (Fe).First lead frame 140 and second lead frame 150 can have single layer structure or sandwich construction, but the disclosure is not limited thereto.
First lead frame 140 and second lead frame 150 can be spaced from each other, so that be electrically isolated from one another.First lead frame 140 can directly contact light source 130, perhaps can be electrically connected to light source 130 via the material with conductivity.One in first lead frame 140 and second lead frame 150 can be used as anode terminal, and another in first lead frame 140 and second lead frame 150 can be used as cathode terminal.And second lead frame 150 can be electrically connected to light source 130 through electric wire 135, but the disclosure is not limited thereto.Therefore, when power supply is connected to first lead frame 140 and second lead frame 150, can electric power be provided to light source 130.Simultaneously, a plurality of lead frame (not shown) can be installed in the body 110, and in these lead frame (not shown) each all can be electrically connected to the relevant light source in a plurality of light sources, but the disclosure is not limited thereto.
First lead frame 140 has heat sink 160, and the longitudinal direction Z along this body 110 extends to the outside to this heat sink 160 from body 110.In fact, at least one in first lead frame 140 and second lead frame 150 can have longitudinal extension part, to form heat sink 160.This extension can be crooked and connect the side surface of said body 110.Alternatively, independent member (not shown) can be connected to first lead frame 140 and second lead frame 150, makes it connect at least one side surface of this body 110.Alternatively, on the side surface of body 110, can be covered with material such as resin material etc. with thermal conductivity.Certainly, the disclosure is not limited to said structure.
Simultaneously, heat sink 160 can be by processing with first lead frame 140 and second lead frame, 150 identical materials, but the disclosure is not limited thereto.Promptly; This heat sink can be processed by at least one or its alloy in following: titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminium (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) and iron (Fe), but the disclosure is not limited thereto.
Extend although heat sink 160 is shown as from first lead frame 140, as shown in Figure 3, it also can form at least one extension from first lead frame 140 and second lead frame 150.Can form a plurality of lead frame (not shown), and some selected lead frame that a plurality of heat sink 160 can be from these lead frames extends, but the disclosure is not limited thereto.
Simultaneously, heat sink 160 can be formed on first lead frame, 140 places, and light source 130 is installed on this first lead frame 140.According to this structure, can the heat that produce in the light source 130 more effectively be delivered to heat sink 160.Therefore, can further strengthen the heat sinking function of this light 100.
Heat sink 160 can be formed on the anode terminal place.Because mainly carry out the heat radiation of this light 100, can more effectively realize the raising of the radiating effect of this light 100 at the anode terminal place.
Heat sink 160 can comprise bend, so that heat sink 160 contacts the side surface of said body 110 respectively.This bend can have the sphering part.This bend can be respectively formed at the folding corner region place of body 110.
Because heat sink 160 forms from first lead frame 140 and second lead frame 150 extends and extend along the side surface of the wall portion 120 of body 110 simultaneously; So can further increase the exposed area and the volume of first lead frame 140 and second lead frame 150, and therefore strengthen the heat absorption function and the heat sinking function of first lead frame 140 and second lead frame 150.Therefore, can realize the enhancing of the reliability of light 100.
Simultaneously, heat sink 160 can bend to along the basal surface of body 110 and extend.As stated, body 110 can be provided with recess 115 in its bottom surface, to accommodate the extension of this heat sink 160.Because body 110 is provided with recess 115 and heat sink 160 partly is housed in this recess 115, so can more stably form heat sink 160.
The degree of depth of recess 115 can be greater than the thickness of heat sink 160, and the width of recess 115 can more easily be housed in the recess 115 to allow this heat sink 160 greater than the width of heat sink 160.
Because body 110 comprises that recess 115 and heat sink 160 are arranged in the recess 115, so can heat sink 160 be fixed to body 110 more reliably.
Simultaneously, with reference to figure 3, heat sink 160 can comprise first connection part 170, and body 110 can comprise second connection part 175.
First connection part 170 can form the inner surface place of heat sink 160, thereby links to each other with body 110.First connection part 170 can comprise at least one convexity.Second connection part 175 can form and can engage with first connection part 170.Second connection part 175 can comprise at least one groove.Simultaneously, second connection part 175 can have with shown in the structure various structure, pore structure for example is as long as it can connect with first connection part 170.Certainly, the disclosure is not limited to said structure.
Be formed on heat sink 160 places although comprise first connection part 170 of a plurality of convexities, and comprise a plurality of grooves to be formed on body 110 places with first connection part, the 170 second corresponding connection parts 175, like the situation of Fig. 3, the disclosure is not limited thereto.For example, also can adopt opposite configuration.That is, protruding (not shown) can be formed at least a portion of body 110, and can be formed at least a portion of heat sink 160 with the corresponding groove (not shown) of these protruding (not shown).
Because heat sink 160 is provided with first connection part 170, and body 110 is provided with and first connection part, 170 corresponding second connection parts 175, so can heat sink 160 be fixed to body 110 more reliably.
Fig. 4 is the sectional view that illustrates according to the light of another embodiment.
With reference to figure 4, heat sink 160 can comprise uneven 180, at least a portion that this uneven 180 is formed on heat sink 160.
For example, on the outer surface that can be formed on heat sink 160 for uneven 180, but the disclosure is not limited thereto.
Because heat sink 160 comprises uneven (not shown), thus the surface area of this heat sink 160 can be increased, and therefore can realize the enhancing of the radiating effect of this heat sink 160.
Fig. 5 is the sectional view that illustrates according to the light of another embodiment.
With reference to figure 5, body 110 at least one the surface and heat sink 160 between can be provided with binder course 190.
Owing between body 110 and heat sink 160, be provided with binder course 190, so can heat sink 160 be fixed to body 110 reliably.Can form binder course 190 through following mode: the material with this binder course 190 overlays on the side surface of body 110 earlier; Heat sink 160 is arranged to contact with the binder course (not shown) that is covered; Solidify the binder course (not shown) that is covered then, but the disclosure is not limited thereto.
Fig. 6 is the perspective view that illustrates according to the light of another embodiment.
With reference to figure 6, heat sink 160 can have hole 165.
Can perhaps, form these holes 165, but the disclosure be not limited thereto through heat sink 160 is carried out etching or punching press through preparing first lead frame 140 and second lead frame 150 so that it has hole 165.Although heat sink 160 places being connected with first lead frame 140 are formed with a plurality of holes 165 with rectangular shape, like the situation among Fig. 6, hole 165 also can be formed on heat sink 160 places that are connected with second lead frame 150.And hole 165 can have other shape, for example circle or polygonal shape, but the disclosure is not limited thereto.
Simultaneously, the part of body 110 can protrude at least one of these holes 165, and perhaps, at least one of these holes 165 can be filled with the part of said body 110, but the disclosure is not limited thereto.
Because hole 165 is formed on heat sink 160 places, thus the exposed area of heat sink 160 increased, thus strengthened the heat absorption function and the radiating effect of this heat sink 160.Therefore, can realize the enhancing of the reliability of light 100.
Light according to above-mentioned any embodiment can be applied to illuminator.This illuminator can be lighting apparatus, back light unit, liquid crystal indicator etc., but the disclosure is not limited thereto.
Fig. 7 A illustrates the perspective view that comprises according to the lighting apparatus of the light of an exemplary embodiment.Fig. 7 B is along at planar interception that extends on longitudinal direction Z and the short transverse X and observed sectional view on the Y in the horizontal direction, shows the lighting apparatus of Fig. 7 A.
With reference to figure 7A and Fig. 7 B, this lighting apparatus of being represented by Reference numeral " 500 " can comprise body 510, the lid 530 that connects with body 510 and the end cap 550 that is positioned at body 510 two ends.
Light emitting device module 540 is connected to the lower surface of body 510.Body 510 can be processed with the metal of the radiating effect of excellence by demonstrating excellent conductivity, outwards distributes the heat that is produced by light 544 with the upper surface through body 510.
A plurality of light 544 can be mounted to multirow on printed circuit board (PCB) (PCB) 542, they have shades of colour simultaneously, to form many color array.If necessary, can these light 544 be installed, perhaps, can these light 544 be installed so that can carry out brightness regulation with different spacings with identical spacing.PCB 542 can be metal-cored PCB (MCPCB) or the PCB that processed by fire retardant-4 (FR4) material.
Each light 544 can comprise that the heat sink (not shown) makes it can have the heat sinking function of enhancing.Therefore, can strengthen the reliability and the efficient of light 544.In addition, can prolong the life-span of the lighting apparatus 500 that comprises light 544.
Lid 530 can have round-shaped, and with the lower surface of encirclement body 510, but the disclosure is not limited thereto.
Lid 530 waits to foreign and protects light emitting device module 540.Lid 530 can comprise light diffusion particles, to realize the even emission of the light that anti-glare effect and light 544 produce.The inner surface of lid 530 and at least one in the outer surface can be provided with prism pattern.And, on the inner surface of lid 530 and in the outer surface at least one, can be covered with fluorescent material.
Because outwards launch through lid 530, so lid 530 should have high light transmission and be enough to tolerate the thermal resistance from the heat of light 544 generations from the light that light 544 produces.For this reason, lid 530 can be formed by PET (PET), Merlon (PC) or polymethyl methacrylate (PMMA).
End cap 550 can be arranged on the two ends of body 510 and be used to seal the electric supply installation (not shown).Each end cap 550 is provided with power plug 552, thereby, can under the situation that does not have extra connector, be directly connected to the terminal that is provided with into conventional fluorescent lamp according to the lighting apparatus 500 of illustrated embodiment.
Fig. 8 illustrates the decomposition diagram that comprises according to the liquid crystal display of the luminescent device of exemplary embodiment.
Fig. 8 shows side-light type liquid crystal display 600.This liquid crystal display 600 can comprise display panels 610 and to the back light unit 670 of display panels 610 supply lights.
Display panels 610 can utilize from the light of back light unit 670 supplies and come display image.Display panels 610 can comprise colored filter substrate 612 and thin film transistor base plate 614, this colored filter substrate 612 and thin film transistor base plate 614 against each other and liquid crystal between between the two.
Colored filter substrate 612 can be implemented in the color of images displayed on the display panels 610.
The PCB 618 that thin film transistor base plate 614 utilizes drive membrane 617 to be electrically connected to a plurality of circuit elements are installed.Thin film transistor base plate 614 can be in response to the drive signal of sending from PCB 618 applies the driving voltage that is provided by PCB 618 to said liquid crystal.
Thin film transistor base plate 614 can comprise pixel electrode and the thin-film transistor that is formed on the form of film on another substrate that is formed by the transparent material such as glass or plastics etc.
Back light unit 670 comprises: light emitting device module 620, these light emitting device module 620 emission light; LGP 630, this LGP 630 will also be transmitted to display panels 610 with this planar light from the light complanation light of light emitting device module 620 emissions; A plurality of films 650,666 and 664, this film 650,666 and 664 are realized the uniformity of Luminance Distribution and the vertical incident property of the raising of the light that produces from LGP 630; And reflector plate 640, the light that this reflector plate 640 is launched from LGP 630 towards LGP 630 reflections backward.
Light emitting device module 620 can comprise PCB 622 and a plurality of light 624, and said a plurality of light 624 are installed on the said PCB 622 to form array.
Especially, each light 624 all can comprise the heat sink (not shown), thereby it can have the heat sinking function of enhancing.Therefore, can strengthen the reliability and the efficient of this light 624.In addition, can prolong the life-span of the display device 600 that comprises this light 624.
Simultaneously, back light unit 670 can comprise: diffuser 666, and these diffuser 666 diffusions are from the light of LGP 630 towards display panels 610 incidents; With prism film 650, this prism film 650 is assembled the light of institute's diffusion, so that strengthen the vertical incident property of light.Back light unit 670 can also comprise the diaphragm 664 that prism film 650 is protected.
Fig. 9 illustrates the decomposition diagram that comprises according to the liquid crystal display of the luminescent device of another embodiment.With no longer at length being repeated in this description and the structure identical construction of describing shown in Fig. 8 and with reference to figure 8.
Fig. 9 shows directly-down liquid crystal display device 700, and this directly-down liquid crystal display device 700 comprises display panels 710 and back light unit 770, with to display panels 710 supply lights.
Display panels 710 is identical with display panels among Fig. 8, therefore, will no longer provide its detailed description.
Back light unit 770 can comprise: a plurality of light emitting device modules 723; Reflector plate 724; Lower bottom base 730 holds said light emitting device module 723 and reflector plate 724 in this lower bottom base 730; And diffusion disk 740 and a plurality of bloomings 760, this diffusion disk 740 is arranged on light emitting device module 723 tops with a plurality of bloomings 760.
Each light emitting device module 723 all can comprise a plurality of light 722 and PCB721, and said a plurality of light 722 are installed on the said PCB 721 to form array.
Especially, each light 722 all can comprise the heat sink (not shown), thereby it can have the heat sinking function of enhancing.Therefore, can strengthen the reliability and the efficient of this light 722.In addition, can prolong the life-span of the back light unit 770 that comprises this light 722.
The light that reflector plate 724 is produced by light 722 towards display panels 710 reflections is to realize the enhancing of light utilization ratio.
Simultaneously, the light that produces from light emitting device module 723 is incided on the diffusion disk 740.Blooming 760 is arranged on diffusion disk 740 tops.Blooming 760 can comprise diffuser 766, prism film 750 and diaphragm 764.
Obviously visible from the description of preceding text, in light, form the heat sink that extends from lead frame and extend along the side surface of said body according to above-mentioned each embodiment, make it possible to strengthen the heat absorption function and the heat sinking function of this lead frame.Therefore, can obtain more excellent radiating effect and realize the enhancing of reliability.
Though described the present invention, should be appreciated that those skilled in the art can expect a plurality of other modifications and application in the essential scope that falls into these embodiment with reference to its a plurality of exemplary embodiments.More particularly, aspect the concrete element of these embodiment, can carry out variations and modifications.In addition, should be appreciated that with these variations and revise relevant difference and also fall in spirit of the present disclosure defined in the appended claims and the scope.

Claims (20)

1. light comprises:
Body, said body comprises cavity and recess, said recess is formed on the bottom surface of said body;
First lead frame and second lead frame, said first lead frame and said second lead frame are installed in the said body; And
Light source, said light source are electrically connected to said first lead frame and said second lead frame;
Wherein, In said first lead frame and said second lead frame at least one has heat sink; Said heat sink extends and is arranged on the said recess from the part of said first lead frame or said second lead frame, and wherein, said body also comprises first connection part; Said first connection part is formed at least a portion of said body, and
Wherein, said heat sink comprises second connection part, and said first connection part is attached to said second connection part.
2. light according to claim 1, wherein, said heat sink contacts at least a portion of a side surface of said body.
3. light according to claim 1 and 2, wherein, at least a portion of said heat sink contacts said recess.
4. according to each the described light in the claim 1 to 3, wherein, said heat sink has at least one bend.
5. light according to claim 4, wherein, said bend is arranged on the folding corner region place of said body.
6. according to claim 4 or 5 described light, wherein, said bend has the sphering part.
7. according to each the described light in the claim 1 to 6, wherein:
Said heat sink extends from said first lead frame; And
Said light source is installed on said first lead frame.
8. light according to claim 7, wherein, said first lead frame constitutes anode terminal.
9. according to each the described light in the claim 1 to 8, wherein, the width of said recess is greater than the width of said heat sink.
10. according to each the described light in the claim 1 to 9, wherein, said concave depth is greater than the thickness of said heat sink.
11. according to each the described light in the claim 1 to 10, wherein:
Said first connection part is a groove; And
Said second connection part is the convexity that connects with said groove.
12. according to each the described light in the claim 1 to 10, wherein:
Said first connection part is protruding; And
Said second connection part is the groove that connects with said convexity.
13. according to each the described light in the claim 1 to 12, wherein, said heat sink has the hole, at least a portion of said heat sink is run through in said hole.
14. light according to claim 13, wherein, at least a portion of said body is passed said hole and is given prominence to.
15., wherein, at least a portion of said heat sink, be formed with uneven portion according to each the described light in the claim 1 to 14.
16. according to each the described light in the claim 1 to 15, wherein, said heat sink is by processing with said first lead frame and the said second lead frame identical materials.
17. according to each the described light in the claim 1 to 16; Wherein, said heat sink comprises at least one in following: titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminium (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) and iron (Fe).
18. each the described light according in the claim 1 to 17 also comprises:
Binder course, said binder course are arranged between at least one side surface and said heat sink of said body.
19. an illuminator, it comprises according to each the described light in the claim 1 to 18.
20. a back light unit, it comprises according to each the described light in the claim 1 to 18.
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EP2458655A3 (en) 2014-06-11
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EP2458655B1 (en) 2021-04-21
KR20120056543A (en) 2012-06-04

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