CN102479911A - 发光器件封装 - Google Patents

发光器件封装 Download PDF

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CN102479911A
CN102479911A CN2011103820668A CN201110382066A CN102479911A CN 102479911 A CN102479911 A CN 102479911A CN 2011103820668 A CN2011103820668 A CN 2011103820668A CN 201110382066 A CN201110382066 A CN 201110382066A CN 102479911 A CN102479911 A CN 102479911A
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light
lead frame
heat sink
connection part
described light
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CN102479911B (zh
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晋洪范
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Suzhou Lekin Semiconductor Co Ltd
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LG Innotek Co Ltd
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Abstract

本发明公开了一种发光器件封装。公开的发光器件封装包括：本体，该本体包括腔体和凹部，该凹部形成在本体的底表面处；第一引线框架和第二引线框架，该第一引线框架和第二引线框架安装在本体中；以及光源，该光源与第一引线框架和第二引线框架电连接，其中，第一引线框架和第二引线框架如下项中的至少一个：具有散热件，该散热件被从第一或者第二引线框架的一部分延伸，并且设置在凹部中。本体包括第一联接部，该第一联接部被形成在本体的至少一部分上。散热件包括第二联接部，第一联接部联接至所述第二联接部。

Description

发光器件封装
相关申请的交叉引用
本申请要求2010年11月25日向韩国知识产权局提交的韩国专利申请No.10-2010-0118125的优先权，该韩国申请的公开内容在此通过的引用方式并入。
技术领域
本发明涉及一种发光器件封装。
背景技术
发光二极管(LED)是利用化合物半导体的特性将电信号转换为光的器件。这种LED被应用于家用电器、远程控制器、广告显示面板、指示器、各种自动器具等。LED的应用范围正逐渐扩大。
同时，当向发光器件封装施加电能时，该发光器件封装会产生相当大的热量。这种热量不仅会降低发光器件封装的耐用性和可靠性，而且会限制该发光器件封装的功能和寿命。
发明内容
本发明提供一种发光器件封装，该发光器件封装包括引线框架，该引线框架具有侧向延伸部，以增加该引线框架的暴露部分，并因此增强该引线框架的吸热功能和散热功能，从而能够发挥更优异的散热效果并实现可靠性的增强。
在一个实施例中，一种发光器件封装包括：本体，该本体包括腔体和凹部，该凹部形成在所述本体的底表面处；第一引线框架和第二引线框架，该第一引线框架和第二引线框架安装在所述本体中；以及光源，该光源电连接到第一引线框架和第二引线框架，其中，该第一引线框架和第二引线框架中的至少一个具有散热件，该散热件从第一或第二引线框架的一部分延伸并设置在所述凹部中，其中，所述本体还包括第一联接部，该第一联接部形成在所述本体的至少一部分上，并且其中，所述散热件包括第二联接部，所述第一联接部联接至该第二联接部。
所述散热件可以接触所述本体的一个侧表面的至少一部分。
所述散热件的至少一部分可以接触所述凹部。
所述散热件可以具有至少一个弯曲部。
所述弯曲部可以设置在所述本体的角部区域处。
所述弯曲部可以具有圆化部分。
所述散热件可以从第一引线框架延伸。所述光源可以安装在第一引线框架上。
所述第一引线框架可以构成阳极端子。
所述凹部的宽度可以大于所述散热件的宽度。
所述凹部的深度可以大于所述散热件的厚度。
所述第一联接部可以是凹槽，而所述第二联接部可以是与该凹槽联接的凸起。
所述第一联接部可以是凸起，而所述第二联接部可以是与该凸起联接的凹槽。
所述散热件可以具有孔，该孔贯穿所述散热件的至少一部分。
所述本体的至少一部分可以穿过该孔而突出。
所述散热件的至少一部分中可以形成有凹凸不平部。
所述散热件可以由与第一引线框架及第二引线框架相同的材料制成。
所述发光器件封装还可以包括结合层，该结合层设置在所述本体的至少一个侧表面与所述散热件之间。
所述散热件可以包括覆层，该覆层形成在所述散热件的表面的至少一部分上。
附图说明
从以下结合附图进行的详细描述中，将能更清楚地理解本发明的详情，在附图中：
图1是示出根据本发明一个示例性实施例的发光器件封装的透视图；
图2是示出图1所示的发光器件封装的截面图；
图3是示出图1所示的发光器件封装的截面图；
图4是示出根据另一实施例的发光器件封装的截面图；
图5是示出根据另一实施例的发光器件封装的截面图；
图6是示出根据另一实施例的发光器件封装的透视图；
图7A是示出包括根据示例性实施例的发光器件封装的照明设备的透视图；
图7B是示出图7A所示的照明设备的剖视图；
图8是示出包括根据示例性一实施例的发光器件的液晶显示设备的分解透视图；并且
图9是示出包括根据另一实施例的发光器件的液晶显示设备的分解透视图。
具体实施方式
现在将详细参考各个实施例，附图中示出了这些实施例的示例。在附图中，为了便于描述和清楚起见，每一层的厚度或尺寸可以被夸大、省略或示意性地示出。而且，每个组成元件的尺寸或面积并不完全反映其实际尺寸。只要可能，在所有附图中都将使用相同的附图标记来表示相同或相似的部件。
图1是示出根据本发明一个示例性实施例的发光器件封装的透视图。图2是示出图1所示的发光器件封装的截面图。图3是沿着与图2的平面垂直的平面截取的截面图，示出了图1所示的发光器件封装。
在以下描述中，为了更详细地说明根据所示实施例的发光器件封装的形状，发光器件封装的纵向方向将被称为“纵向方向Z”，与纵向方向Z垂直的水平方向将被称为“水平方向Y”，而与纵向方向Z及水平方向Y均垂直的高度方向将被称为“高度方向X”。
即，图2是沿着图1所示的发光器件封装的X-Y平面截取并沿纵向方向Z观察到的截面图，而图3是沿着图1所示的发光器件封装的Z-X平面截取并沿水平方向Y观察到的截面图。
参考图1至图3，由附图标记“100”表示的、根据所示实施例的发光器件封装包括：本体110，该本体110具有腔体，同时在该本体110的底表面处设置有凹部115；第一引线框架140和第二引线框架150，该第一引线框架140和第二引线框架150安装在本体110的腔体中；以及光源130，该光源130安装在本体110的腔体中，同时电连接到第一引线框架140和第二引线框架150，其中，第一引线框架140和第二引线框架150中的至少一个具有散热件160，该散热件160从第一引线框架140或第二引线框架150的一部分延伸并设置在凹部115中。本体110包括第二联接部175，该第二联接部175形成在本体110的至少一部分上。散热件160包括第一联接部170，所述第二联接部175联接至该第一联接部170。
本体110可以由从如下项中选择的至少一种材料而制成：诸如聚邻苯二甲酰胺(PPA)的树脂、硅(Si)、铝(Al)、氮化铝(AlN)、诸如光敏玻璃(PSG)的液晶聚合物、聚酰胺9T(PA9T)、间规聚苯乙烯(SPS)、金属、蓝宝石(Al2O3)、以及氧化铍(BeO)，或者该本体110也可以是印刷电路板(PCB)。本体110可以通过注射成型工艺、蚀刻工艺等来形成，但本公开不限于此。
本体110可以在其内表面处具有倾斜表面。根据该倾斜表面的倾斜度，从光源130发射的光的反射角可以变化。因此，可以调整向外发射的光的取向角。
光的取向角越小，从光源130发射到外部的光的会聚度就越大。相反，光的取向角越大，从光源130发射到外部的光的会聚度就越小。
当从顶侧观察该本体110中形成的腔体时，所述腔体可以具有圆形、正方形、多边形、椭圆形形状等，并且可以具有圆化角部。当然，所述腔体不限于上述形状。
光源130电连接到第一引线框架140和第二引线框架150。例如，光源130可以通过电线135被电线结合到第一引线框架140和第二引线框架150。
例如，光源130可以是发射红光、绿光、蓝光以及白光的彩色发光二极管，或者是发射紫外光的紫外(UV)发光二极管，但本公开不限于此。可以安装有一个或多个发光二极管。
所述发光二极管可以是水平式发光二极管，在该水平式发光二极管中，所有电气端子均设置在其上表面上，或者所述发光二极管可以是竖直式发光二极管，在该竖直式发光二极管中，电气端子分散在其上表面和下表面上。替代地，所述发光二极管也可以是倒装芯片式发光二极管。
所述腔体内可以填充有树脂包封体(未示出)，以覆盖所述光源130。
该树脂包封体(未示出)可以由硅树脂、环氧树脂、或其它树脂材料制成。通过利用包封材料来填充所述腔体并利用紫外光或热来固化所填充的材料，可以形成该树脂包封体。
该树脂包封体(未示出)可以包括荧光物质。可以根据从光源130发射的光的波长来选择该荧光物质的种类，以便发出白光。
根据从光源130发射的光的波长，所述荧光物质可以是发射蓝光、蓝绿光、绿光、黄绿光、黄光、黄红光、橙色或红光的荧光物质，但本公开不限于此。
即，该荧光物质可以由光源130发射的第一波长的光来激发，以产生具有第二波长的光。例如，当光源130是蓝色发光二极管且该荧光物质是黄色荧光物质时，通过蓝光来激发该黄色荧光物质，从而发出黄光。在这种情况下，当蓝色发光二极管产生的蓝光与通过该蓝光的激发而产生的黄光进行混合时，发光器件封装100可以提供白光。
类似地，当光源130是绿色发光二极管时，可以使用洋红色的荧光物质或者使用蓝色荧光物质和红色荧光物质的混合物来作为所述荧光物质。而且，当光源130是红色发光二极管时，可以使用青色荧光物质或者使用蓝色荧光物质和绿色荧光物质的混合物来作为所述荧光物质。
该荧光物质可以是公知的荧光物质，例如YAG基、TAG基、硫化物基、硅酸盐基、铝酸盐基、氮化物基、碳化物基、氮化硅酸盐基、硼酸盐基、氟化物基或磷酸盐基荧光物质。
第一引线框架140和第二引线框架150可以由如下项中的至少一个或其合金制成：钛(Ti)、铜(Cu)、镍(Ni)、金(Au)、铬(Cr)、钽(Ta)、铂(Pt)、锡(Sn)、银(Ag)、磷(P)、铝(A1)、铟(In)、钯(Pd)、钴(Co)、硅(Si)、锗(Ge)、铪(Hf)、钌(Ru)、以及铁(Fe)。第一引线框架140和第二引线框架150可以具有单层结构或多层结构，但本公开不限于此。
第一引线框架140和第二引线框架150可以相互隔开，以便彼此电气隔离。第一引线框架140可以直接接触光源130，或者可以经由具有导电性的材料来电连接至光源130。第一引线框架140和第二引线框架150中的一个可以用作阳极端子，并且，第一引线框架140和第二引线框架150中的另一个可以用作阴极端子。而且，第二引线框架150可以通过电线135电连接到光源130，但本公开不限于此。因此，当电源连接到第一引线框架140和第二引线框架150时，可以向光源130提供电力。同时，本体110中可以安装多个引线框架(未示出)，并且这些引线框架(未示出)中的每一个均可以电连接到多个光源中的相关的一个光源，但本公开不限于此。
第一引线框架140具有散热件160，该散热件160从本体110沿着该本体110的纵向方向Z延伸到外部。实际上，第一引线框架140和第二引线框架150中的至少一个可以具有纵向延伸部，以形成散热件160。该延伸部可以弯曲而连接所述本体110的侧表面。替代地，单独的构件(未示出)可以联接到第一引线框架140和第二引线框架150，使得它连接该本体110的至少一个侧表面。替代地，在本体110的侧表面上可以覆有具有导热性的诸如树脂材料等的材料。当然，本公开不限于上述结构。
同时，散热件160可以由与第一引线框架140及第二引线框架150相同的材料制成，但本公开不限于此。即，该散热件可以由如下项中的至少一个或其合金制成：钛(Ti)、铜(Cu)、镍(Ni)、金(Au)、铬(Cr)、钽(Ta)、铂(Pt)、锡(Sn)、银(Ag)、磷(P)、铝(Al)、铟(In)、钯(Pd)、钴(Co)、硅(Si)、锗(Ge)、铪(Hf)、钌(Ru)、以及铁(Fe)，但本公开不限于此。
尽管散热件160被示出为从第一引线框架140延伸，如图3所示，但它也可以形成为从第一引线框架140和第二引线框架150中的至少一个延伸。可以形成多个引线框架(未示出)，并且多个散热件160可以从这些引线框架中的选定的某些引线框架延伸，但本公开不限于此。
同时，散热件160可以形成在第一引线框架140处，光源130安装在该第一引线框架140上。根据此结构，能够将光源130中产生的热量更有效地传递到散热件160。因此，可以进一步增强该发光器件封装100的散热功能。
散热件160可以形成在阳极端子处。因为主要在阳极端子处进行该发光器件封装100的散热，所以能够更有效地实现该发光器件封装100的散热效果的提高。
散热件160可以包括弯曲部，以使散热件160分别接触所述本体110的侧表面。该弯曲部可以具有圆化部分。该弯曲部可以分别形成在本体110的角部区域处。
因为散热件160形成为从第一引线框架140和第二引线框架150延伸并同时沿着本体110的壁部120的侧表面延伸，所以能够进一步增大第一引线框架140和第二引线框架150的暴露面积和体积，并因此增强第一引线框架140和第二引线框架150的吸热功能和散热功能。因此，能够实现发光器件封装100的可靠性的增强。
同时，散热件160可以弯曲成沿着本体110的底表面延伸。如上所述，本体110可以在其底表面处设置有凹部115，以收容该散热件160的延伸部。由于本体110设置有凹部115且散热件160被部分地收容在该凹部115中，所以能够更稳定地形成散热件160。
凹部115的深度可以大于散热件160的厚度，并且凹部115的宽度可以大于散热件160的宽度，以允许该散热件160更容易地收容在凹部115中。
由于本体110包括凹部115且散热件160设置在凹部115中，所以能够将散热件160更可靠地固定到本体110。
同时，参考图3，散热件160可以包括第一联接部170，而本体110可以包括第二联接部175。
第一联接部170可以形成散热件160的内表面处，从而与本体110相连。第一联接部170可以包括至少一个凸起。第二联接部175可以形成为能够与第一联接部170接合。第二联接部175可以包括至少一个凹槽。同时，第二联接部175可以具有与所示结构不同的结构，例如孔结构，只要它可以与第一联接部170联接即可。当然，本公开不限于上述结构。
尽管包括多个凸起的第一联接部170形成在散热件160处，并且包括多个凹槽以与第一联接部170对应的第二联接部175形成在本体110处，如图3的情形，但本公开不限于此。例如，也可以采用相反的结构。即，凸起(未示出)可以形成在本体110的至少一部分上，而与这些凸起(未示出)相对应的凹槽(未示出)可以形成在散热件160的至少一部分中。
因为散热件160设置有第一联接部170，并且本体110设置有与第一联接部170相对应的第二联接部175，所以能够将散热件160更可靠地固定到本体110。
图4是示出根据另一实施例的发光器件封装的截面图。
参考图4，散热件160可以包括凹凸不平部180，该凹凸不平部180形成在散热件160的至少一部分上。
例如，凹凸不平部180可以形成在散热件160的外表面上，但本公开不限于此。
因为散热件160包括凹凸不平部(未示出)，所以能够增大该散热件160的表面积，并因此能够实现该散热件160的散热效果的增强。
图5是示出根据另一实施例的发光器件封装的截面图。
参考图5，在本体110的至少一个表面与散热件160之间可以设置有结合层190。
由于在本体110和散热件160之间设置有结合层190，所以能够将散热件160可靠地固定到本体110。可以通过如下方式来形成结合层190：先将该结合层190的材料覆在本体110的一个侧表面上，将散热件160设置成与所覆的结合层(未示出)接触，然后固化所覆的结合层(未示出)，但本公开不限于此。
图6是示出根据另一实施例的发光器件封装的透视图。
参考图6，散热件160可以具有孔165。
可以通过对散热件160进行蚀刻或冲压，或者通过制备第一引线框架140和第二引线框架150以使其具有孔165，来形成这些孔165，但本公开不限于此。尽管在与第一引线框架140连接的散热件160处形成有具有矩形形状的多个孔165，如图6中的情形，但孔165也可形成在与第二引线框架150连接的散热件160处。而且，孔165可以具有其它形状，例如圆形或多边形形状，但本公开不限于此。
同时，本体110的一部分可以突入到这些孔165的至少一个中，或者，这些孔165的至少一个可以填充有所述本体110的一部分，但本公开不限于此。
因为孔165形成在散热件160处，所以增大了散热件160的暴露面积，从而增强了该散热件160的吸热功能和散热效果。因此，可以实现发光器件封装100的可靠性的增强。
根据上述任一个实施例的发光器件封装可以应用于照明系统。该照明系统可以是照明设备、背光单元、液晶显示装置等，但本公开不限于此。
图7A是示出包括根据一示例性实施例的发光器件封装的照明设备的透视图。图7B是沿着在纵向方向Z和高度方向X上延伸的平面截取并在水平方向Y上观察到的截面图，示出了图7A的照明设备。
参考图7A和图7B，由附图标记“500”表示的该照明设备可以包括本体510、与本体510联接的盖子530、以及位于本体510两端的端帽550。
发光器件模块540联接到本体510的下表面。本体510可以由呈现出优异的导电性和优异的散热效果的金属制成，以通过本体510的上表面向外散发由发光器件封装544产生的热量。
多个发光器件封装544可以在印刷电路板(PCB)542上安装成多行，同时它们具有各种颜色，以形成多颜色阵列。如果必要，能够以相同的间距来安装这些发光器件封装544，或者，能够以不同的间距来安装这些发光器件封装544以便能够进行亮度调节。PCB 542可以是金属芯PCB(MCPCB)或由阻燃剂-4(FR4)材料制成的PCB。
每个发光器件封装544可以包括散热件(未示出)使得它可以具有增强的散热功能。因此，能够增强发光器件封装544的可靠性和效率。另外，能够延长包括发光器件封装544的照明设备500的寿命。
盖子530可以具有圆形形状，以包围本体510的下表面，但本公开不限于此。
盖子530针对外部异物等来保护发光器件模块540。盖子530可以包括光漫射颗粒，以实现抗眩光效果以及发光器件封装544产生的光的均匀发射。盖子530的内表面和外表面中的至少一个可以设置有棱镜图案。而且，在盖子530的内表面和外表面中的至少一个上可以覆有荧光物质。
因为从发光器件封装544产生的光通过盖子530向外发射，所以盖子530应具有高的光透射率和足以耐受从发光器件封装544产生的热量的热阻。为此，盖子530可以由聚对苯二甲酸乙二酯(PET)、聚碳酸酯(PC)或聚甲基丙烯酸甲酯(PMMA)形成。
端帽550可以设置在本体510的两端并用于密封供电装置(未示出)。每个端帽550均设置有电力插头552，从而，根据所示实施例的照明设备500可以在没有额外的连接器的情况下直接连接到为常规荧光灯设置的端子。
图8是示出包括根据示例性实施例的发光器件的液晶显示设备的分解透视图。
图8示出了侧光式液晶显示设备600。该液晶显示设备600可以包括液晶显示面板610和向液晶显示面板610供应光的背光单元670。
液晶显示面板610可以利用从背光单元670供应的光来显示图像。液晶显示面板610可以包括彩色滤光片基板612和薄膜晶体管基板614，该彩色滤光片基板612和薄膜晶体管基板614彼此相对并且液晶介于二者之间。
彩色滤光片基板612可以实现在液晶显示面板610上显示的图像的颜色。
薄膜晶体管基板614利用驱动膜617电连接到安装有多个电路元件的PCB 618。薄膜晶体管基板614可以响应于从PCB 618发送的驱动信号而向所述液晶施加由PCB 618提供的驱动电压。
薄膜晶体管基板614可以包括形成在由诸如玻璃或塑料等的透明材料形成的另一基板上的薄膜形式的像素电极和薄膜晶体管。
背光单元670包括：发光器件模块620，该发光器件模块620发射光；导光板630，该导光板630将从发光器件模块620发射的光变成平面光并将该平面光透射到液晶显示面板610；多个膜650、666和664，该膜650、666和664实现亮度分布的均匀性以及从导光板630产生的光的提高的竖直入射性；以及反射片640，该反射片640朝向导光板630反射从导光板630向后发射的光。
发光器件模块620可以包括PCB 622和多个发光器件封装624，所述多个发光器件封装624安装在所述PCB 622上以形成阵列。
特别地，每个发光器件封装624均可以包括散热件(未示出)，从而它可以具有增强的散热功能。因此，能够增强该发光器件封装624的可靠性和效率。另外，能够延长包括该发光器件封装624的显示设备600的寿命。
同时，背光单元670可以包括：漫射膜666，该漫射膜666漫射从导光板630朝向液晶显示面板610入射的光；和棱镜膜650，该棱镜膜650聚集所漫射的光，以便增强光的竖直入射性。背光单元670还可以包括对棱镜膜650进行保护的保护膜664。
图9是示出包括根据另一实施例的发光器件的液晶显示设备的分解透视图。将不再详细地重复描述与图8中示出且参考图8描述的构造相同的构造。
图9示出了直下式液晶显示设备700，该直下式液晶显示设备700包括液晶显示面板710和背光单元770，以向液晶显示面板710供应光。
液晶显示面板710与图8中的液晶显示面板相同，因此，将不再给出其详细描述。
背光单元770可以包括：多个发光器件模块723；反射片724；下底座730，该下底座730中容纳所述发光器件模块723和反射片724；以及漫射片740和多个光学膜760，该漫射片740和多个光学膜760设置在发光器件模块723上方。
每个发光器件模块723均可以包括多个发光器件封装722和PCB721，所述多个发光器件封装722安装在所述PCB 721上以形成阵列。
特别地，每个发光器件封装722均可以包括散热件(未示出)，从而它可以具有增强的散热功能。因此，能够增强该发光器件封装722的可靠性和效率。另外，能够延长包括该发光器件封装722的背光单元770的寿命。
反射片724朝向液晶显示面板710反射由发光器件封装722产生的光，以实现光利用效率的增强。
同时，从发光器件模块723产生的光被入射到漫射片740上。光学膜760设置在漫射片740上方。光学膜760可以包括漫射膜766、棱镜膜750和保护膜764。
从上文的描述中显然可见，在根据上述每个实施例的发光器件封装中，形成为从引线框架延伸的散热件沿着所述本体的侧表面延伸，使得能够增强该引线框架的吸热功能和散热功能。因此，能够获得更优异的散热效果并实现可靠性的增强。
虽然已经参照其多个示例性实施例描述了本发明，但应当理解，本领域的技术人员可以想到将落入这些实施例的本质范围内的多个其它修改和应用。更特别地，在这些实施例的具体组成元件方面，可以进行各种变化和修改。另外，应当理解，与这些变化和修改有关的差异也落入所附权利要求中限定的本公开的精神和范围内。

Claims (20)

1.一种发光器件封装，包括：
本体，所述本体包括腔体和凹部，所述凹部形成在所述本体的底表面处；
第一引线框架和第二引线框架，所述第一引线框架和所述第二引线框架安装在所述本体中；以及
光源，所述光源电连接到所述第一引线框架和所述第二引线框架；
其中，所述第一引线框架和所述第二引线框架中的至少一个具有散热件，所述散热件从所述第一引线框架或所述第二引线框架的一部分延伸并设置在所述凹部中，其中，所述本体还包括第一联接部，所述第一联接部形成在所述本体的至少一部分上，并且
其中，所述散热件包括第二联接部，所述第一联接部联接至所述第二联接部。
2.根据权利要求1所述的发光器件封装，其中，所述散热件接触所述本体的一个侧表面的至少一部分。
3.根据权利要求1或2所述的发光器件封装，其中，所述散热件的至少一部分接触所述凹部。
4.根据权利要求1至3中的任一项所述的发光器件封装，其中，所述散热件具有至少一个弯曲部。
5.根据权利要求4所述的发光器件封装，其中，所述弯曲部设置在所述本体的角部区域处。
6.根据权利要求4或5所述的发光器件封装，其中，所述弯曲部具有圆化部分。
7.根据权利要求1至6中的任一项所述的发光器件封装，其中：
所述散热件从所述第一引线框架延伸；并且
所述光源安装在所述第一引线框架上。
8.根据权利要求7所述的发光器件封装，其中，所述第一引线框架构成阳极端子。
9.根据权利要求1至8中的任一项所述的发光器件封装，其中，所述凹部的宽度大于所述散热件的宽度。
10.根据权利要求1至9中的任一项所述的发光器件封装，其中，所述凹部的深度大于所述散热件的厚度。
11.根据权利要求1至10中的任一项所述的发光器件封装，其中：
所述第一联接部是凹槽；并且
所述第二联接部是与所述凹槽联接的凸起。
12.根据权利要求1至10中的任一项所述的发光器件封装，其中：
所述第一联接部是凸起；并且
所述第二联接部是与所述凸起联接的凹槽。
13.根据权利要求1至12中的任一项所述的发光器件封装，其中，所述散热件具有孔，所述孔贯穿所述散热件的至少一部分。
14.根据权利要求13所述的发光器件封装，其中，所述本体的至少一部分穿过所述孔而突出。
15.根据权利要求1至14中的任一项所述的发光器件封装，其中，在所述散热件的至少一部分中形成有凹凸不平部。
16.根据权利要求1至15中的任一项所述的发光器件封装，其中，所述散热件由与所述第一引线框架及所述第二引线框架相同的材料制成。
17.根据权利要求1至16中的任一项所述的发光器件封装，其中，所述散热件包括如下项中的至少一个：钛(Ti)、铜(Cu)、镍(Ni)、金(Au)、铬(Cr)、钽(Ta)、铂(Pt)、锡(Sn)、银(Ag)、磷(P)、铝(Al)、铟(In)、钯(Pd)、钴(Co)、硅(Si)、锗(Ge)、铪(Hf)、钌(Ru)、以及铁(Fe)。
18.根据权利要求1至17中的任一项所述的发光器件封装，还包括：
结合层，所述结合层设置在所述本体的至少一个侧表面与所述散热件之间。
19.一种照明系统，其包括根据权利要求1至18中的任一项所述的发光器件封装。
20.一种背光单元，其包括根据权利要求1至18中的任一项所述的发光器件封装。
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