KR20130048541A - Light emitting diode module - Google Patents

Light emitting diode module Download PDF

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Publication number
KR20130048541A
KR20130048541A KR1020110113430A KR20110113430A KR20130048541A KR 20130048541 A KR20130048541 A KR 20130048541A KR 1020110113430 A KR1020110113430 A KR 1020110113430A KR 20110113430 A KR20110113430 A KR 20110113430A KR 20130048541 A KR20130048541 A KR 20130048541A
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KR
South Korea
Prior art keywords
light emitting
emitting device
substrate
device package
disposed
Prior art date
Application number
KR1020110113430A
Other languages
Korean (ko)
Inventor
장성우
이주석
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020110113430A priority Critical patent/KR20130048541A/en
Publication of KR20130048541A publication Critical patent/KR20130048541A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/0004—Devices characterised by their operation
    • H01L33/0008—Devices characterised by their operation having p-n or hi-lo junctions
    • H01L33/0016—Devices characterised by their operation having p-n or hi-lo junctions having at least two p-n junctions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: A light emitting device module is provided to combine a light emitting device package with a hole penetrating a part of a substrate and to improve the durability of the light emitting device module to external impact. CONSTITUTION: A hole(220) penetrates a part of a substrate(210). An electrode pattern(230) is arranged in one surface of the substrate. A connector connection part(240) is electrically connected to an electrode pattern. A light emitting device package is arranged in the hole. The light emitting device package includes a body, a lead frame, and a light emitting device.

Description

Light emitting device module {LIGHT EMITTING DIODE MODULE}

An embodiment relates to a light emitting device module.

Light Emitting Diode (LED) is a device that converts an electric signal into a light form using the characteristics of a compound semiconductor, and is used for home appliances, remote controllers, electronic displays, indicators, and various automation devices. There is a trend.

When a forward voltage is applied to the light emitting device, electrons in the n-layer and holes in the p-layer are coupled to emit energy corresponding to the energy gap between the conduction band and the valance band. It is mainly emitted in the form of heat or light, and when emitted in the form of light, it becomes an LED.

Nitride semiconductors have attracted great interest in the development of optical devices and high output electronic devices due to their high thermal stability and wide band gap energy. In particular, blue light emitting devices, green light emitting devices, and ultraviolet light emitting devices using nitride semiconductors are commercially used and widely used.

The light emitting device package is manufactured by manufacturing a light emitting device on a substrate, separating the light emitting device chip through dieseparation, which is a sawing process, and then diebonding the light emitting device chip to a package body. Wire bonding and molding can be performed, and the test can proceed.

The light emitting device package may be electrically connected to the printed circuit board. The light emitting device module in which the light emitting device package is provided on the printed circuit board may be included in the backlight unit. In the backlight unit of the edge-light type in which the light emitting device module is disposed on the side of the light guide plate, the bezel thickness may be determined.

Therefore, in order to reduce the thickness of the backlight unit, it may be an important problem to minimize the thickness of the light emitting device module.

The embodiment provides a light emitting device module with a minimized thickness.

A light emitting device module according to an embodiment includes a substrate having a hole formed through a region; An electrode pattern disposed on one surface of the substrate; And a light emitting device package disposed in the hole. The light emitting device package includes a body, a lead frame disposed on the body and electrically connected to the electrode pattern, and a light emitting device electrically connected to the lead frame.

A light emitting device module according to an embodiment includes a substrate having a hole formed through a region; An electrode pattern disposed on one surface of the substrate; And a light emitting device package disposed in the hole. The light emitting device package includes a body, a lead frame disposed on the body and electrically connected to the electrode pattern, and a light emitting device electrically connected to the lead frame.

1A is a perspective view illustrating a structure of a light emitting device package according to an embodiment;
1B is a cross-sectional view showing a cross section of a light emitting device package according to the embodiment;
2A is a perspective view illustrating a structure of a printed circuit board according to an embodiment;
2B is a perspective view illustrating a light emitting device module including a light emitting device package according to an embodiment;
2C is a cross-sectional view showing a light emitting device module according to the embodiment;
3A is a perspective view illustrating a structure of a printed circuit board according to an embodiment;
3B is a perspective view illustrating a light emitting device module including a light emitting device package according to an embodiment;
3C is a sectional view showing a light emitting device module according to the embodiment;
4 is a sectional view showing a light emitting device module according to the embodiment;
5A is a perspective view of a lighting device including a light emitting device package according to an embodiment;
5B is a cross-sectional view of a lighting apparatus including a light emitting device package according to an embodiment;
6 is an exploded perspective view of a liquid crystal display device including the light emitting device module according to the embodiment;
7 is an exploded perspective view of a liquid crystal display including the light emitting device module according to the embodiment.

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " In addition, the criteria for the top or bottom of each component will be described based on the drawings.

In the drawings, the thickness or size of each component is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

Hereinafter, embodiments will be described in detail with reference to the drawings.

1A is a perspective view illustrating a structure of a light emitting device package according to an embodiment, and FIG. 1B is a cross-sectional view illustrating a cross section of a light emitting device package according to an embodiment.

1A and 1B, the light emitting device package 100 according to the embodiment is disposed on the body 110 and the body 110 having a cavity and includes a first electrode 140 and a second electrode 150. The lead frame 160 may include a light emitting device 120 electrically connected to the first and second electrodes 140 and 150 and an encapsulant 130 formed in a cavity, and the encapsulant 130 is a phosphor. (Not shown).

The body 110 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), photosensitive glass (PSG), polyamide 9T (PA9T) ), Neogeotactic polystyrene (SPS), a metal material, sapphire (Al 2 O 3 ), beryllium oxide (BeO), a printed circuit board (PCB, Printed Circuit Board) may be formed of at least one. The body 110 may be formed by injection molding, etching, or the like, but is not limited thereto.

The inner surface of the body 110 may be formed inclined surface. The angle of reflection of the light emitted from the light emitting device 120 may vary according to the angle of the inclined surface, thereby adjusting the directivity of the light emitted to the outside.

The shape of the cavity formed in the body 110 as viewed from above may be a circle, a rectangle, a polygon, an oval, or the like, and the shape may be a curved edge, but is not limited thereto.

The encapsulant 130 may be filled in the cavity, and may include a phosphor (not shown). The encapsulant 130 may be formed of transparent silicone, epoxy, and other resin materials. The encapsulant 130 may be formed by filling in the cavity and then UV or thermosetting it.

The phosphor (not shown) may be selected according to the wavelength of the light emitted from the light emitting device 120, so that the light emitting device package 100 can realize white light.

The phosphor (not shown) included in the encapsulant 130 may be a blue light emitting phosphor, a cyan light emitting phosphor, a green light emitting phosphor, a yellow green light emitting phosphor, a yellow light emitting phosphor, or a yellowish red light according to a wavelength of light emitted from the light emitting device 120. One of the phosphor, the orange luminescent phosphor, and the red luminescent phosphor can be applied.

The phosphor (not shown) may be excited by the light having the first light emitted from the light emitting device 120 to generate the second light. For example, when the light emitting device 120 is a blue light emitting diode and the phosphor (not shown) is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and the blue light generated from the blue light emitting diode and As yellow light generated by being excited by blue light is mixed, the light emitting device package 100 may provide white light.

When the light emitting device 120 is a green light emitting diode, a magenta phosphor or a blue and red phosphor (not shown) is mixed. When the light emitting device 120 is a red light emitting diode, a cyan phosphor or a blue and green phosphor is mixed. For example,

The phosphor (not shown) may be a known one such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride, or phosphate.

The lead frame 160 may be disposed on the body 110. The lead frame 160 may include a first electrode 140 and a second electrode 150. The first electrode 140 and the second electrode 150 may be electrically connected to the light emitting device 120 to supply power to the light emitting device 120.

The first electrode 140 and the second electrode 150 are electrically separated from each other, and may reflect light generated from the light emitting device 120 to increase light efficiency. The first electrode 140 and the second electrode 150 may discharge heat generated from the light emitting device 120 to the outside.

In FIG. 1B, the light emitting device 120 is mounted on the first electrode 140, but is not limited thereto. The light emitting device 120, the first electrode 140, and the second electrode 150 may be wire bonded. May be electrically connected by any one of the following methods, a flip chip method, and a die bonding method.

The first electrode 140 and the second electrode 150 are metal materials, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), and tantalum (Ta). ), Platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge) ), Hafnium (Hf), ruthenium (Ru), iron (Fe) may include one or more materials or alloys. The first electrode 140 and the second electrode 150 may be formed to have a single layer or a multilayer structure, but is not limited thereto.

The light emitting device 120 may be mounted on the first electrode 140 and may be, for example, a light emitting device emitting light of red, green, blue, white, or UV (ultraviolet) light emitting device emitting ultraviolet light. However, the present invention is not limited thereto. One or more light emitting devices 120 may be mounted.

The light emitting device 120 may be applied to a horizontal type in which all of its electrical terminals are formed on the upper surface, or to a vertical type or flip chip formed on the upper and lower surfaces.

The light emitting device package 100 may include a light emitting device 120.

The light emitting device 120 may be a light emitting device package including a light emitting diode (LED).

A light emitting diode (not shown) can convert an electric signal into an infrared ray, a visible ray or a light using the characteristics of a compound semiconductor. The light emitting diode (not shown) may be electrically connected to a lead frame (not shown) of the light emitting device package (not shown).

The light emitting diode (not shown) may be formed by growing a light emitting structure (not shown) on a support substrate (not shown). The light emitting diode (not shown) may form a support substrate (not shown) with silicon carbide (SiC) having high thermal conductivity in order to facilitate heat emission, but is not limited thereto.

The light emitting structure (not shown) may be formed on a supporting substrate (not shown). The light emitting structure (not shown) may be formed by stacking a first semiconductor layer (not shown), an active layer (not shown), and a second semiconductor layer (not shown).

The first semiconductor layer (not shown), the active layer (not shown), and the second semiconductor layer (not shown) may be, for example, metal organic chemical vapor deposition (MOCVD) or chemical vapor deposition (CVD). Deposition), Plasma-Enhanced Chemical Vapor Deposition (PECVD), Molecular Beam Epitaxy (MBE), Hydride Vapor Phase Epitaxy (HVPE), and the like. It is not limited thereto.

In the light emitting structure (not shown), the doping concentration of the conductive dopant in the first semiconductor layer (not shown) and the second semiconductor layer (not shown) may be uniformly or non-uniformly formed, but is not limited thereto. The interlayer structure of the light emitting structure (not shown) may be variously formed, but is not limited thereto.

A plurality of light emitting device packages 100 according to the embodiment may be arranged on a substrate, and a light guide plate, a prism sheet, a diffusion sheet, or the like, which is an optical member, may be disposed on an optical path of the light emitting device package 100.

The light emitting device package 100, the substrate, and the optical member may function as a light unit. Another embodiment may be implemented as a display device, an indicator device, or a lighting system including a light emitting device (not shown) or a light emitting device package 100. For example, the lighting system may include a lamp or a street lamp. .

2A is a perspective view illustrating a structure of a printed circuit board according to an embodiment, FIG. 2B is a perspective view illustrating a light emitting device module including a light emitting device package according to an embodiment, and FIG. 2C illustrates a light emitting device module according to an embodiment. It is a cross section.

2A, 2B, and 2C, a light emitting device module according to an embodiment may include a substrate 210 having a hole penetrated through a region thereof, and an electrode pattern 230 disposed on one surface of the substrate 210. And a light emitting device package disposed in the hole 220, the body, the lead frame 160 disposed on the body and electrically connected to the electrode pattern 230, and the light emitting device electrically connected to the lead frame 160. 120.

The substrate 210 may be formed of an insulating material, and may be formed to have a ductility or thinness to facilitate bending, but is not limited thereto. The substrate 210 may be a single-sided printed circuit board (PCB), a double-sided printed circuit board (PCB), or a printed circuit board (PCB) formed of a plurality of layers such that the electrode patterns 230 are disposed on one or both surfaces thereof. It is not limited.

For example, the substrate 210 may be formed of an insulating resin or FR-4, or may include at least one of polyimide, liquid crystal polymer, and polyester. The substrate 210 may have a thin structure or may be formed of a light transmissive resin to have a light transmissive characteristic, but is not limited thereto. For example, the substrate 210 may be formed of a thin plate formed of a flexible synthetic resin, a film, or the like.

A hole 220 may be formed through a region of the substrate 210. The substrate 210 may have a hole 220 to correspond to the outer shape of the light emitting device package 100.

The hole 220 is formed in one region of the substrate 210 and may have the same shape as that of the light emitting device package 100. For example, the shape of the light emitting device package 100 may be determined according to its use and design, and the shape of the hole 220 may be various shapes such as triangles, squares, polygons, and circles depending on the shape of the light emitting device package 100. Can have

The electrode pattern 230 may be disposed on one surface of the substrate 210. The electrode pattern 230 may be formed to have electrical conductivity. The electrode pattern 230 may be, for example, a thin copper foil to have electrical conductivity, but is not limited thereto. For example, the electrode pattern 230 is a thin metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru), iron (Fe) may include one or more materials or alloys, or may be composed of an electrically conductive polymer material. In addition, the electrode pattern 230 may be formed by forming a conductive layer on the substrate 210 by a method such as sputtering, electrolytic / electroless plating, or the like, and then etching the conductive layer. Not.

The electrode pattern 230 may be operated by connecting the light emitting device packages 100 in parallel or in series, but the connection structure is not limited thereto.

The electrode pattern 230 may be spaced apart from an area where the hole 220 of the substrate 210 is formed. The electrode pattern 230 may be disposed in an area where the hole 220 of the substrate 210 is not formed.

An insulating layer 250 may be disposed between the substrate 210 and the electrode pattern 230. The insulating layer 250 may be formed of a material having no electrical conductivity. For example, SiO 2 It may be formed of the same material, but is not limited to the material. The insulating layer 250 may prevent corrosion, breakage, and electrical short of the substrate 210. The insulating layer 250 may be used when the substrate 210 is formed of a material having electrical conductivity, but is not limited thereto.

The connector connection unit 240 may be disposed in one region of the substrate 210. The connector connection unit 240 may be electrically connected to the electrode pattern 230. The connector module 240 may be connected to the connector module. According to an exemplary embodiment, the connector connection part 240 may be disposed in an area of the bottom surface of the substrate 210.

The connector connection unit 240 may transfer power supplied from the outside to the electrode pattern 230. The connector connection unit 240 may be connected to the connector module of another device to enable the exchange of electrical signals between the light emitting device module 200 and the other device. When the connector module 240 is connected to a connector module of another electric device (not shown) or an electronic device (not shown), the electrode pattern 230 and the other electric device (not shown) or the electronic device (not shown) may be electrically connected. Can be.

According to an embodiment, the electrode pattern may be disposed on the bottom surface of the substrate 210. The electrode pattern 230 may receive power input to the connector connection unit 240. The electrode pattern 230 may be connected to the lead frame 160 of the light emitting device package 100 to supply power received from the connector connection unit 240.

The light emitting device package 100 may be disposed in the hole 220. The light emitting surface emitting the light of the light emitting device package 100 may be disposed in the same direction as the top surface of the substrate 210. In the light emitting device package 100, the lead frame 160 may be exposed in a lower surface direction of the substrate 210. The light emitting device package 100 may be disposed in the hole 220 and the lead frame 160 may be connected to the electrode pattern. The light emitting device package 100 may be electrically connected to the electrode pattern.

The light emitting device package 100 may be fixed to the substrate 210 by the lead frame 160. In the light emitting device package 100, the lead frame 160 may extend to both sides of the body. When the light emitting device package 100 is disposed on the substrate 210, the lead frame 160 may overlap the lower surface of the substrate 210. The lead frame 160 may be connected to the electrode pattern 230 disposed on the bottom surface of the substrate 210.

The light emitting device package 100 may correspond to the shape of the hole 220 formed in the substrate 210 in the outward direction. The light emitting device package 100 may be firmly coupled to the hole 220. Since the light emitting device package 100 is firmly coupled to the hole 220 of the substrate 210, the light emitting device module may be strong against external impact, thereby improving reliability.

The height from the bottom surface of the substrate 210 of the light emitting surface of the light emitting device package 100 may be higher than the height from the bottom surface of the upper surface of the substrate 210. The thickness of the body of the light emitting device package 100 may be thicker than the thickness of the substrate 210.

3A is a perspective view showing a structure of a printed circuit board according to an embodiment, FIG. 3B is a perspective view showing a light emitting device module including a light emitting device package 100 according to an embodiment, and FIG. 3C is a light emitting device according to an embodiment. A cross section showing a module.

3A, 3B, and 3C, the light source module according to the embodiment includes a substrate 310 and a substrate 310 in which a recess 320 is formed in which one side of the side is recessed so that an upper surface and a lower surface thereof pass. An electrode pattern 330 disposed on one surface; And a light emitting device package 100 disposed on the recess 320, and the light emitting device package 100 is disposed on the body and the body, and is connected to the electrode pattern 330 and the lead frame 160 and the lead frame ( 160 includes a light emitting device that is electrically connected to the.

The contents described in FIGS. 2A, 2B and 2C will not be further described.

The substrate 310 may have a recessed portion 320 formed by recessing a region of a side surface of the substrate 310 so as to penetrate the upper and lower surfaces thereof. The material or shape of the substrate 310 has been described above, and thus will not be described in further detail.

The depression 320 may be formed to correspond to the outer shape of the light emitting device package 100. The depression part 320 is formed in one region of the substrate 310 and may have various shapes such as triangle, rectangle, polygon, and circle according to the shape of the light emitting device package 100, but is not limited thereto.

The electrode pattern may be disposed on one surface of the substrate 310. The electrode pattern may be spaced apart from an area where the recess 320 of the substrate 310 is formed. The electrode pattern may be disposed in an area where the depression 320 is not formed.

The light emitting device package 100 may be disposed in the recess 320. The light emitting surface emitting the light of the light emitting device package 100 may be disposed in the same direction as the top surface of the substrate 310. In the light emitting device package 100, the lead frame 160 may be exposed in a lower surface direction of the substrate 310. The light emitting device package 100 may be disposed in the recess 320 and the lead frame 160 may be connected to the electrode pattern. The light emitting device package 100 may be electrically connected to the electrode pattern.

The light emitting device package 100 may be fixed to the substrate 310 by the lead frame 160. In the light emitting device package 100, the lead frame 160 may extend to both sides of the body. When the light emitting device package 100 is disposed on the substrate 310, the lower surface of the substrate 310 and the lead frame 160 may overlap. The lead frame 160 may be connected to the electrode pattern 330 disposed on the bottom surface of the substrate 310.

The light emitting device package 100 may correspond to the shape of the recess 320 formed on the substrate 310. The light emitting device package 100 may be firmly coupled to the recess 320. Since the light emitting device package 100 is firmly coupled to the recess 320 of the substrate 310, the light emitting device module may be strong against external impact, thereby improving reliability.

The height of the light emitting surface of the light emitting device package 100 from the lower surface of the substrate 310 may be higher than the height from the lower surface of the upper surface of the substrate 310. The thickness of the body of the light emitting device package 100 may be thicker than the thickness of the substrate 310. The light emitting device package 100 may prevent the light emitting surface from being located higher than the upper surface of the substrate 310 to narrow the directing angle of the emitted light.

An insulating layer 350 may be disposed between the substrate 310 and the electrode pattern 330. The insulating layer 350 may be formed of a material that is not electrically conductive. For example, SiO 2 It may be formed of the same material, but is not limited to the material. The insulating layer 350 may prevent corrosion, breakage, and electrical short of the substrate 310. The insulating layer 350 may be used when the substrate 310 is formed of a material having electrical conductivity, but is not limited thereto.

Referring to FIG. 4, in the light emitting device module according to another exemplary embodiment, the light emitting device package 450 may be a side view type.

The light emitting device package 450 may radiate light to the side. In the light emitting device package, a light emitting surface 455 for emitting light may be disposed at a side surface thereof.

The light emitting device package 450 may be disposed on the recess 420 formed on the side surface of the substrate 410. The light emitting device package 450 may have the light emitting surface 455 disposed in the same direction as a side surface on which the recessed portion 420 of the substrate 410 is formed. The light emitting device package 450 may radiate light in a lateral direction of the substrate 410.

The light emitting device package 450 may be disposed to protrude more than a side surface at which the recessed portion 420 of the substrate 410 is formed, thereby preventing the orientation angle from being narrowed.

5A is a perspective view illustrating a lighting apparatus including a light emitting device package according to an embodiment, and FIG. 5B is a cross-sectional view illustrating a C-C 'cross section of the lighting apparatus of FIG. 5A.

Hereinafter, in order to describe the shape of the lighting device 500 according to the embodiment in more detail, the longitudinal direction (Z) of the lighting device 500, the horizontal direction (Y) perpendicular to the longitudinal direction (Z), and the length The height direction X perpendicular to the direction Z and the horizontal direction Y will be described.

That is, FIG. 5B is a cross-sectional view of the lighting apparatus 500 of FIG. 5A cut in the plane of the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. FIG.

5A and 5B, the lighting device 500 may include a body 510, a cover 530 fastened to the body 510, and a closing cap 550 located at both ends of the body 510. have.

The light emitting device module 540 is fastened to the lower surface of the body 510, and the body 510 is conductive so that heat generated in the light emitting device package 544 can be discharged to the outside through the upper surface of the body 510. And it may be formed of a metal material having an excellent heat dissipation effect.

The light emitting device package 544 may be mounted on the substrate 542 in a multi-colored, multi-row array to form an array. The light emitting device package 544 may be mounted at the same interval or may be mounted at various separation distances as necessary to adjust brightness. As the substrate 542, a metal core PCB (MPPCB) or a PCB made of FR4 may be used.

The cover 530 may be formed in a circular shape so as to surround the lower surface of the body 510, but is not limited thereto.

The cover 530 protects the internal light emitting element module 540 from foreign substances or the like. In addition, the cover 530 may include diffusion particles to prevent glare of light generated in the light emitting device package 544 and uniformly emit light to the outside, and may include at least one of an inner surface and an outer surface of the cover 530 A prism pattern or the like may be formed on one side. Further, the phosphor may be applied to at least one of the inner surface and the outer surface of the cover 530.

On the other hand, since the light generated from the light emitting device package 544 is emitted to the outside through the cover 530, the cover 530 should have excellent light transmittance, and has sufficient heat resistance to withstand the heat generated from the light emitting device package 544. The cover 530 is preferably formed of a material containing polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. .

The finishing cap 550 is located at both ends of the body 510 and can be used to seal a power supply unit (not shown). In addition, the finishing cap 550 is provided with the power supply pin 552, so that the lighting device 500 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

6 is an exploded perspective view of a liquid crystal display device including the optical sheet according to the embodiment.

FIG. 6 illustrates an edge-light method, and the liquid crystal display 600 may include a liquid crystal display panel 610 and a backlight unit 670 for providing light to the liquid crystal display panel 610.

The liquid crystal display panel 610 can display an image using light provided from the backlight unit 670. The liquid crystal display panel 610 may include a color filter substrate 612 and a thin film transistor substrate 614 facing each other with a liquid crystal therebetween.

The color filter substrate 612 can realize the color of an image to be displayed through the liquid crystal display panel 610.

The thin film transistor substrate 614 is electrically connected to the printed circuit board 618 on which a plurality of circuit components are mounted through the driving film 617. The thin film transistor substrate 614 can apply a driving voltage provided from the printed circuit board 618 to the liquid crystal in response to a driving signal provided from the printed circuit board 618. [

The thin film transistor substrate 614 may include a thin film transistor and a pixel electrode formed of a thin film on another transparent material such as glass or plastic.

The backlight unit 670 includes a light emitting element module 620 that outputs light, a light guide plate 630 that changes the light provided from the light emitting element module 620 into a surface light source and provides the light to the liquid crystal display panel 610, A plurality of films 650, 666, and 664 for uniformly distributing the luminance of light provided from the light guide plate 630 and improving vertical incidence, and a reflective sheet (not shown) for reflecting light emitted to the rear of the light guide plate 630 to the light guide plate 630 640).

The light emitting device module 620 may include a substrate 622 such that a plurality of light emitting device packages 624 and a plurality of light emitting device packages 624 are mounted to form an array.

In particular, since the substrate 622 has a hole (not shown) or a depression (not shown), the light emitting device package 624 is disposed, so that the thickness of the light emitting device module 620 may be reduced, so that the thickness of the backlight unit 670 may be reduced. Can be reduced and reliability, workability, and economy can be improved. The light emitting device module 620 may be disposed in one region of the lower chassis 730. The light emitting device package 722 directly contacts the lower chassis 730 to maximize the heat dissipation effect.

The backlight unit 670 includes a diffusion film 666 for diffusing the light incident from the light guide plate 630 toward the liquid crystal display panel 610 and a prism film 650 for enhancing vertical incidence by condensing the diffused light. And may include a protective film 664 for protecting the prism film 650. [

7 is an exploded perspective view of a liquid crystal display device including the optical sheet according to the embodiment. However, the parts shown and described in Fig. 6 are not repeatedly described in detail.

7 is a direct view, the liquid crystal display 700 may include a liquid crystal display panel 710 and a backlight unit 770 for providing light to the liquid crystal display panel 710.

Since the liquid crystal display panel 710 is the same as that described with reference to FIG. 6, a detailed description thereof will be omitted.

The backlight unit 770 includes a plurality of light emitting element modules 723, a reflective sheet 724, a lower chassis 730 in which the light emitting element module 723 and the reflective sheet 724 are accommodated, And a plurality of optical films 760 disposed on the diffuser plate 740. [

Light emitting device module 723 A plurality of light emitting device packages 722 and a plurality of light emitting device packages 722 may be mounted to include a substrate 721 to form an array.

In particular, the substrate 721 may have a hole (not shown) or a depression (not shown) so that the light emitting device package 722 may be disposed, thereby reducing the thickness of the light emitting device module, thereby reducing the thickness of the backlight unit 770. And reliability, workability, and economy can be improved.

The reflective sheet 724 reflects light generated from the light emitting device package 722 in a direction in which the liquid crystal display panel 710 is positioned, thereby improving light utilization efficiency.

Light generated in the light emitting element module 723 is incident on the diffusion plate 740 and an optical film 760 is disposed on the diffusion plate 740. The optical film 760 is composed of a diffusion film 766, a prism film 750, and a protective film 764.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

110 body 120 light emitting element
130: sealing material 140: first electrode
150: second electrode 160: lead frame
210: substrate 220: hole
230: electrode pattern 240: connector connection

Claims (12)

A substrate through which one region is formed to form a hole;
An electrode pattern disposed on one surface of the substrate; And
And a light emitting device package disposed in the hole.
The light emitting device package may include a body, a lead frame disposed on the body and electrically connected to an electrode pattern, and a light emitting device electrically connected to the lead frame. The method of claim 1,
The shape of the hole corresponds to the shape of the light emitting device package. A substrate in which a depression is formed in which one side of the side is recessed so that the upper and lower surfaces thereof pass;
An electrode pattern disposed on one surface of the substrate; And
And a light emitting device package disposed in the recess.
The light emitting device package includes a body, a lead frame disposed on the body and electrically connected to the electrode pattern, and a light emitting device electrically connected to the lead frame. The method according to claim 1 or 3,
The electrode pattern is disposed on the lower surface of the substrate. 5. The method of claim 4,
The light emitting module of the light emitting device package is disposed in the same direction as the upper surface of the substrate. The method according to claim 1 or 3,
The light source module further comprises an insulating layer disposed between the substrate and the electrode pattern. The method according to claim 1 or 3,
The light source module is electrically connected to the lead frame and the electrode pattern. The method according to claim 1 or 3,
And a connector connection part disposed on a bottom surface of the substrate and connected to the electrode pattern. The method according to claim 1 or 3,
And a height from a lower surface of the substrate of the light emitting surface of the light emitting device package is higher than a height from a lower surface of the upper surface of the substrate. The method according to claim 1 or 2,
The electrode pattern is spaced apart from the hole module. The method of claim 3,
The light emitting module for emitting light of the light emitting device package is disposed in the same direction as the side surface on which the depression of the substrate is formed. The method of claim 3,
The light emitting module of the light emitting device package is disposed to protrude more than the side surface formed with the recessed portion of the substrate.
KR1020110113430A 2011-11-02 2011-11-02 Light emitting diode module KR20130048541A (en)

Priority Applications (1)

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KR1020110113430A KR20130048541A (en) 2011-11-02 2011-11-02 Light emitting diode module

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Application Number Priority Date Filing Date Title
KR1020110113430A KR20130048541A (en) 2011-11-02 2011-11-02 Light emitting diode module

Publications (1)

Publication Number Publication Date
KR20130048541A true KR20130048541A (en) 2013-05-10

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